EX128-TQG100

IC FPGA 70 I/O 100TQFP
Part Description

EX Field Programmable Gate Array (FPGA) IC 70 256 100-LQFP

Quantity 407 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-LQFPNumber of I/O70Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level1 (Unlimited)Number of LABs/CLBs128Number of Logic Elements/Cells256
Number of Gates6000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EX128-TQG100 – EX Field Programmable Gate Array (FPGA) IC, 70 I/O, 256 logic elements, 100-LQFP

The EX128-TQG100 is a Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for compact commercial electronic designs. It provides moderate programmable logic capacity with up to 70 I/O pins and approximately 6,000 gate equivalents in a 100‑LQFP surface-mount package.

Targeted at applications that require flexible, board-level logic implementation within a low-voltage, commercial temperature range, the device combines a compact package, defined I/O count, and straightforward power requirements to simplify system integration.

Key Features

  • Core Logic — 256 logic elements delivering roughly 6,000 gates for implementing combinational logic and small state machines.
  • I/O — 70 I/O pins to support multiple peripheral and signal connections on a single device.
  • Power — Operates from a 2.3 V to 2.7 V supply, aligning with low‑voltage system rails.
  • Package & Mounting — 100‑LQFP surface-mount package; supplier device package listed as 100‑TQFP (14×14), suitable for compact PCB layouts.
  • Operating Conditions & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
  • Environmental Compliance — RoHS compliant for lead‑free assembly requirements.

Typical Applications

  • Glue Logic and Signal Integration — Consolidate discrete logic components and manage multiple signal lines using the device's logic capacity and 70 I/O pins.
  • Peripheral Interfacing — Implement custom interface logic and I/O buffering for sensors, displays, and communication peripherals.
  • Prototyping and Validation — Rapidly evaluate and iterate small FPGA designs in a compact, surface‑mount package.

Unique Advantages

  • Compact, board‑friendly package: The 100‑LQFP surface‑mount package provides a small PCB footprint while exposing 70 I/O for flexible routing.
  • Moderate logic density: 256 logic elements and ~6,000 gates allow implementation of a range of combinational and small sequential functions without large footprint devices.
  • Low‑voltage operation: 2.3–2.7 V supply range aligns with modern low‑voltage digital systems.
  • Commercial temperature rating: Specified 0 °C to 70 °C for standard commercial environments and applications.
  • RoHS compliant: Supports lead‑free manufacturing and regulatory requirements.

Why Choose EX128-TQG100?

The EX128-TQG100 is positioned for designers and procurement teams seeking a Microchip Technology FPGA solution that balances compact packaging, defined I/O capacity, and moderate logic resources. Its combination of 256 logic elements, approximately 6,000 gates, and 70 I/O pins makes it suited to board-level logic consolidation and interface tasks in commercial products.

With a 100‑LQFP surface‑mount package, low‑voltage operation, and RoHS compliance, the device offers a practical, space‑efficient option for projects that require reliable, commercially graded programmable logic from a known manufacturer.

Request a quote or submit a parts inquiry to receive pricing and availability for the EX128-TQG100.

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