EX128-TQ64A

The EX128-TQ64A is a Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a compact, low-voltage programmable logic solution. With 256 logic elements, 46 I/O pins and support for a 2.3 V to 2.7 V supply, it targets embedded control and interface tasks where small form-factor integration and automotive qualification are important.

Designed for demanding thermal environments, this device is qualified to AEC-Q100 and rated for operation from −40 °C to 125 °C, making it suitable for applications that require proven component-level reliability within that temperature window.

Key Features

• Core Logic Capacity — 256 logic elements providing approximately 6,000 usable gates for implementing control, glue-logic and small-to-medium sized combinational/sequential designs.
• I/O and Package — 46 general-purpose I/O pins in a 64-pin LQFP package; supplier device package listed as 64-TQFP (10×10) for compact PCB implementations.
• Power — Operates from a 2.3 V to 2.7 V supply range to support low-voltage system rails.
• Temperature and Qualification — Automotive grade with AEC-Q100 qualification and an operating range of −40 °C to 125 °C for high-reliability environments.
• Mounting and Compliance — Surface-mount package and RoHS-compliant construction for modern manufacturing and regulatory compatibility.
• On-chip Memory — Total on-chip RAM bits: 0 (device is optimized for logic and I/O functions rather than embedded RAM storage).

Typical Applications

• Automotive control modules — AEC-Q100 qualification and wide temperature rating make this FPGA suitable for interface and control logic in automotive electronic modules.
• Embedded control and signal glue-logic — Use for protocol bridging, custom state machines and peripheral interfacing where modest logic density and plentiful I/O are required.
• Sensor and actuator interfacing — Implement deterministic I/O handling and signal conditioning logic for sensor front-ends and actuator drivers within constrained PCB footprints.
• Compact system designs — 64-pin LQFP package supports space-constrained layouts where low-voltage operation and surface-mount assembly are needed.

Unique Advantages

• Automotive-qualified reliability: AEC-Q100 qualification and −40 °C to 125 °C rating support deployment in temperature-critical automotive applications.
• Balanced logic density: 256 logic elements and approximately 6,000 gates provide a practical trade-off between capability and cost for control and glue-logic tasks.
• Low-voltage operation: 2.3 V to 2.7 V supply compatibility eases integration with modern low-voltage system rails.
• Compact packaging: 64-LQFP / 64-TQFP (10×10) footprint enables dense PCB placement while providing accessible I/O counts.
• Manufacturing-ready: Surface-mount package and RoHS compliance streamline assembly and regulatory acceptance for production designs.
• Flexible I/O resources: 46 I/O pins allow multiple peripheral interfaces and parallel signal connections without external multiplexing.

Why Choose EX128-TQ64A?

The EX128-TQ64A delivers a compact, automotive-qualified FPGA option for designers needing dependable logic and I/O in a small surface-mount package. Its combination of 256 logic elements, 46 I/Os, low-voltage operation and AEC-Q100 qualification positions it for embedded control, interface bridging and automotive electronic modules that must operate across −40 °C to 125 °C.

Backed by Microchip Technology, this device is a practical choice when designers require a reliable, space-efficient programmable logic component that integrates into low-voltage systems and production-focused assembly flows.

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