ICE65L04F-TCB132I

The ICE65L04F-TCB132I is a low-power field programmable gate array (FPGA) from the iCE65™ Ultra Low-Power mobileFPGA family. It combines a programmable logic fabric with on-chip RAM and nonvolatile configuration options targeted for handheld, battery-powered and industrial applications where low static and dynamic power, compact packaging, and flexible I/O are important.

Architected for cost-sensitive, high-volume designs, the device integrates 3,520 logic elements, approximately 81,920 bits of embedded memory, and up to 95 programmable I/O in a compact 132-VFBGA / 132-CSBGA (8×8) package, with industrial temperature range and RoHS compliance.

Key Features

• Core Logic  3,520 logic elements (LUTs and flip-flops) providing programmable combinational and sequential logic for control, glue logic, and mid-density FPGA functions.
• Embedded Memory  Approximately 81,920 bits of on-chip RAM for data buffering, small lookup tables, and state storage within the FPGA fabric.
• Flexible I/O  Up to 95 programmable I/O pins to interface with sensors, processors, and peripherals while simplifying board-level connectivity.
• Low-Voltage Operation  Core voltage supply specified at 1.14 V to 1.26 V to support low-power system designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• Package and Mounting  Available in a compact 132-VFBGA / 132-CSBGA (8×8) package and intended for surface-mount assembly to save board area.
• Nonvolatile Configuration Options  Family-level support for self-configuration from external SPI serial Flash or internal Nonvolatile Configuration Memory (NVCM) enables flexible programming and secure in-system configuration.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Handheld and Portable Devices  Low-voltage, low-power architecture supports battery-operated equipment and user-interface logic in portable products.
• Embedded Control and Glue Logic  3,520 logic elements and on-chip RAM provide resources for peripheral aggregation, protocol bridging, and control state machines.
• Industrial Instrumentation  Industrial temperature rating and compact BGA package suit compact controllers, test instruments, and data-acquisition modules.
• High-volume, Cost-Sensitive Designs  On-chip nonvolatile configuration memory options and compact packaging help reduce BOM and streamline production for consumer and industrial volumes.

Unique Advantages

• Balanced Logic and Memory Capacity  3,520 logic elements paired with ~81,920 bits of RAM offers a practical balance for mid-density FPGA designs without excessive board real estate.
• Low-Voltage, Low-Power Operation  Core supply between 1.14 V and 1.26 V and the device’s low-power family heritage reduce dynamic and standby power for battery-powered systems.
• Compact, Production-Ready Packaging  132-VFBGA / 132-CSBGA (8×8) package in a surface-mount form factor simplifies board layout and supports high-volume manufacturing.
• Industrial Reliability  Rated for −40 °C to 85 °C operation to meet typical industrial environment requirements.
• Flexible Configuration  Support for SPI Flash-based configuration and internal NVCM enables secure, in-field reprogramming and streamlined production programming flows.

Why Choose ICE65L04F-TCB132I?

The ICE65L04F-TCB132I offers a pragmatic combination of low-power operation, mid-range logic density, and embedded RAM in a compact industrial-grade package. It is suited to engineers who need programmable logic for battery-sensitive, space-constrained, or high-volume applications where predictable operating temperature and RoHS compliance are required.

With flexible configuration options and a development ecosystem associated with the iCE65 family, this device provides a pathway from prototype to production while minimizing BOM complexity and supporting secure, in-system updates.

Request a quote or submit a procurement inquiry to obtain pricing, lead-time, and availability for the ICE65L04F-TCB132I FPGA.