ICE65L04F-TCB132C

IC FPGA 95 I/O 132CSBGA
Part Description

iCE65™ L Field Programmable Gate Array (FPGA) IC 95 81920 3520 132-VFBGA, CSPBGA

Quantity 460 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package132-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 70°C
Package / Case132-VFBGA, CSPBGANumber of I/O95Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs440Number of Logic Elements/Cells3520
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits81920

Overview of ICE65L04F-TCB132C – Ultra Low-Power mobileFPGA (3,520 logic elements)

The ICE65L04F-TCB132C is an iCE65™ L-series ultra low-power Field Programmable Gate Array (FPGA) IC. The device provides 3,520 logic elements, approximately 80 Kbits of on-chip RAM, and up to 95 programmable I/O in a compact 132-ball VFBGA/CSPBGA package suitable for surface-mount assembly.

Designed for handheld and battery-sensitive applications, this L-series device supports low-power operation and flexible configuration options, including on-chip nonvolatile configuration memory and processor-driven SPI-style programming for in-system updates.

Key Features

  • Logic Capacity – 3,520 logic elements (LUTs + flip-flops) for mid-density programmable logic and control functions.
  • Embedded Memory – Approximately 80 Kbits of on-chip RAM for data buffering and small packet storage.
  • Programmable I/O – Up to 95 I/O pins to support a wide range of external interfaces and peripherals.
  • Low-Power L-Series Option – L-series low-power device characteristics and a listed typical static current of 26 μA at 0 kHz, 1.0 V (family data).
  • Configuration and Security – On-chip Nonvolatile Configuration Memory (NVCM) plus support for self-configuration from external SPI serial Flash and processor-driven SPI-like downloads for flexible manufacturing and field updates.
  • Performance – Family-level internal performance up to 256 MHz for many control and data-path applications.
  • Power and Supply – Core supply voltage range specified as 1.14 V to 1.26 V to match low-power system rails.
  • Package and Mounting – 132-VFBGA / CSPBGA (supplier package: 132-CSBGA 8×8) in a surface-mount form factor for compact PCB designs.
  • Commercial Temperature Grade – Rated for 0 °C to 70 °C operation for commercial applications.
  • RoHS Compliant – Conforms to RoHS requirements for lead-free manufacturing processes.
  • Development Ecosystem – Supported by the family’s iCEcube development tools with VHDL/Verilog synthesis, place-and-route, and IP libraries (family documentation).

Typical Applications

  • Handheld Devices – Low static and dynamic power characteristics and compact package make the device suitable for battery-powered handheld control and interface tasks.
  • Embedded Control – Use as glue logic, state machines, or custom peripheral controllers where 3,520 logic elements and on-chip RAM meet mid-density needs.
  • Processor Companion – Acts as a configurable peripheral fabric that can be programmed from a processor over an SPI-like serial interface for runtime updates and feature extensions.
  • Portable Instrumentation – Provides programmable I/O and memory for data buffering, protocol adaptation, and custom signal handling in portable test equipment.

Unique Advantages

  • Integrated Nonvolatile Configuration Memory: On-chip NVCM enables ASIC-like in-system programming and secure configuration storage without requiring external configuration-only devices.
  • Low-Power Operation: L-series low-power characteristics and family-level microamp static currents reduce standby energy use in battery-operated designs.
  • Flexible Configuration Options: Supports self-configuration from external SPI Flash or direct download from a host processor, enabling multiple production and field update workflows.
  • Compact, Surface-Mount Package: 132-ball VFBGA/CSPBGA (132-CSBGA, 8×8) provides a small PCB footprint for space-constrained designs.
  • Developer Tool Support: Family-level development tools (iCEcube) support VHDL and Verilog flows, easing integration into existing FPGA toolchains.
  • RoHS Compliance: Meets lead-free manufacturing requirements for modern electronics production.

Why Choose ICE65L04F-TCB132C?

The ICE65L04F-TCB132C positions itself as a mid-density, low-power FPGA option within the iCE65 family, delivering 3,520 logic elements, approximately 80 Kbits of embedded RAM, and up to 95 I/O in a compact 132-ball BGA package. Its on-chip nonvolatile configuration memory and support for SPI-based programming provide flexible production and field-update models while minimizing external component needs.

This device is well-suited for customers developing commercial, battery-conscious products that require programmable logic for custom interfaces, glue logic, or embedded control. Supported development tools and family-level performance data make it practical for volume and handheld-oriented designs where power, size, and reprogrammability are key considerations.

Request a quote or submit a procurement inquiry for ICE65L04F-TCB132C to obtain pricing, availability, and lead-time information for your design.

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