ICE65L04F-LCB132C
| Part Description |
iCE65™ L Field Programmable Gate Array (FPGA) IC 95 81920 3520 132-VFBGA, CSPBGA |
|---|---|
| Quantity | 1,537 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-VFBGA, CSPBGA | Number of I/O | 95 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 440 | Number of Logic Elements/Cells | 3520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 81920 |
Overview of ICE65L04F-LCB132C – iCE65™ L Low-Power FPGA, 3,520 Logic Elements, 132-VFBGA/CSPBGA
The ICE65L04F-LCB132C is an iCE65™ L-series field programmable gate array (FPGA) in a 132-ball VFBGA/CSPBGA package optimized for low-power, space-efficient embedded applications. Based on the iCE65 ultra low-power mobileFPGA family architecture, this device integrates programmability, on-chip RAM, flexible I/O banks and nonvolatile configuration options suited for handheld, portable and volume-production designs.
Key Features
- Core Logic 3,520 logic elements (LUTs + flip-flops) providing programmable logic resources for control, glue logic, and moderate-density FPGA functions.
- Embedded Memory Twenty 4Kbit RAM blocks (approximately 80 Kbits total) for on-chip data buffering and storage.
- I/O Flexibility 95 programmable I/O pins with family-level support for four independently powered I/O banks and multiple voltage standards to simplify system interfacing.
- Low-Power Architecture Part of the iCE65 ultra low-power family and offered in the L (low-power) option; designed for reduced static and dynamic power in portable systems.
- Configuration Options Supports reconfiguration from external SPI serial Flash PROM and secure internal Nonvolatile Configuration Memory (NVCM) for in-system and production configuration modes.
- Performance Family-level internal performance up to 256 MHz and support for fast configuration download over SPI-like interfaces.
- Package & Mounting 132-VFBGA / CSPBGA package (supplier device package: 132-CSBGA 8×8), surface-mount mounting for compact PCB integration.
- Supply & Temperature Operating supply range 1.14 V to 1.26 V and commercial operating temperature range 0 °C to 70 °C.
- Compliance RoHS compliant.
- Development Ecosystem Supported by the iCEcube™ development system with synthesis, place-and-route, design libraries and development board options.
Typical Applications
- Portable and Handheld Devices Low-power FPGA fabric and compact 132-ball package enable integration of custom logic and interfaces while conserving board area and battery life.
- Consumer Electronics Implement display controllers, sensor aggregation and peripheral bridging with on-chip RAM and flexible I/O configurations.
- Embedded Control and Glue Logic Replace discrete logic for device control, protocol conversion and timing-critical glue functions using available logic elements and RAM blocks.
- Volume Production Designs Internal NVCM option and support for SPI flash boot simplify factory programming and secure in-field configuration for cost-sensitive products.
Unique Advantages
- Low-power option (L) tailored for battery-operated systems: Leverages the iCE65 family’s ultra low-power architecture to minimize standby and dynamic power consumption.
- Integrated memory and logic density: 3,520 logic elements plus approximately 80 Kbits of on-chip RAM reduce the need for external memory and discrete logic components.
- Flexible configuration modes: Choice of SPI serial Flash configuration or secure internal NVCM supports both in-field reprogramming and production-ready nonvolatile configuration.
- Compact, surface-mount packaging: 132-ball VFBGA/CSPBGA (132-CSBGA 8×8) enables space-efficient board designs for constrained form factors.
- Broad I/O flexibility: 95 programmable I/O pins and family-level support for multiple I/O voltage standards simplify interfacing with peripherals and sensors.
- Design tool support: Availability of the iCEcube™ toolset and development board streamlines synthesis, place-and-route and system bring-up.
Why Choose ICE65L04F-LCB132C?
The ICE65L04F-LCB132C positions a low-power, mid-density FPGA solution for designers who need a balance of programmable logic, on-chip memory and flexible I/O in a compact surface-mount package. Its L-series low-power option, internal configuration memory and support for SPI-based boot options make it suitable for battery-conscious, high-volume embedded products.
This device is well suited for engineers developing portable consumer products, embedded controllers and production designs that benefit from on-chip memory, secure configuration and a supported development ecosystem.
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