ICE65L01F-TVQ100C

IC FPGA 72 I/O 100VQFP
Part Description

iCE65™ L Field Programmable Gate Array (FPGA) IC 72 65536 1280 100-TQFP

Quantity 382 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O72Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of ICE65L01F-TVQ100C – iCE65 L Low-Power FPGA, 1280 Logic Elements, 72 I/Os, 100-TQFP

The ICE65L01F-TVQ100C is a commercial-grade, ultra low-power FPGA IC from the iCE65 family, optimized for hand-held and battery-powered applications. It provides a compact programmable logic fabric with 1,280 logic elements, on-chip SRAM resources, and 72 general-purpose I/O pins in a 100-pin TQFP package.

Designed for cost-sensitive, high-volume embedded designs, the device features low static current, flexible configuration options including external SPI flash and internal nonvolatile configuration memory (NVCM), and a development ecosystem for synthesis and place-and-route.

Key Features

  • Core Logic — 1,280 logic elements provide a moderate-density programmable fabric for glue logic, protocol bridging, and control tasks.
  • On-chip Memory — 65,536 bits of embedded RAM organized as sixteen 4Kbit blocks for data buffering and small on-chip memories.
  • Low Power Operation — Ultra low-power family characteristics including a typical static current of 12 μA (static mode) to support long battery life in portable applications.
  • Performance — Family-level internal performance up to 256 MHz for timing headroom in control and data-path functions.
  • Configuration Flexibility — Reprogrammable from external SPI serial Flash or downloaded over an SPI-like serial interface in as little as 20 μs; also supports secure in-system programming via internal NVCM for production use.
  • I/O and Interface Support — 72 I/O pins in the device; family-level support for multiple I/O standards and independently powered I/O banks (3.3 V, 2.5 V, 1.8 V, 1.5 V) to simplify mixed-voltage system interfaces.
  • Process and Technology — Proven 65 nm low-power CMOS technology offering low leakage and reduced dynamic power.
  • Package & Mounting — 100-TQFP (100-VQFP, 14×14 outline) surface-mount package; commercial temperature grade (0 °C to 70 °C).
  • Compliance — RoHS compliant.

Typical Applications

  • Hand-held and Portable Devices — Low static current and on-chip configuration memory make the device suitable for battery-powered electronics that require reprogrammable logic and long standby life.
  • Embedded Control and Glue Logic — Moderate logic density and 72 I/Os enable protocol bridging, peripheral control, and interface adaptation in compact systems.
  • Sensor Hubs and Data Aggregation — On-chip RAM blocks and flexible I/O banks support buffering and interfacing to sensors and lower-speed data sources.
  • Consumer Electronics — Reprogrammability and compact packaging fit consumer and portable designs where product variants and in-field updates are required.

Unique Advantages

  • Low standby power: Typical static current of 12 μA reduces battery drain during idle periods.
  • Compact embedded memory: Sixteen 4Kbit RAM blocks (65,536 bits total) provide on-chip buffering without external RAM.
  • Fast, flexible configuration: Supports external SPI Flash boot and fast SPI-like downloads (as little as 20 μs), plus internal NVCM for secure production programming.
  • Mixed-voltage I/O support: Family-level support for multiple I/O voltage standards and independently powered I/O banks simplifies interfacing to a variety of peripherals.
  • Standard SMT packaging: 100-TQFP surface-mount package balances board-area efficiency and assembly practicality.
  • Development ecosystem: Supported by the iCEcube development tools for VHDL/Verilog synthesis and place-and-route workflows.

Why Choose ICE65L01F-TVQ100C?

The ICE65L01F-TVQ100C pairs low static and dynamic power characteristics with a practical logic and memory footprint, making it well suited to handheld, portable, and cost-sensitive embedded designs that require reprogrammability and mixed-voltage interfacing. Its combination of 1,280 logic elements, 65,536 bits of on-chip RAM, and 72 I/Os in a compact 100-TQFP package provides engineers a balanced option for glue logic, control, and small data-path implementations.

Backed by the iCE65 family architecture and development tools, this device offers a clear path for production deployments that need in-system programmability, secure configuration memory, and a low-power profile for longer battery life and efficient system integration.

Request a quote or submit an inquiry to get pricing, lead times, and availability for the ICE65L01F-TVQ100C.

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