ICE65L01F-TCS36I

IC FPGA 25 I/O 36WLCSP
Part Description

iCE65™ L Field Programmable Gate Array (FPGA) IC 25 65536 1280

Quantity 39 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package36-WLCSPGradeIndustrialOperating Temperature-40°C – 85°C
Package / CaseN/ANumber of I/O25Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of ICE65L01F-TCS36I – iCE65™ L Field Programmable Gate Array (FPGA), 25 I/O, 65,536‑bit RAM, 1,280 logic elements

The ICE65L01F-TCS36I is an industrial‑grade iCE65™ L-series FPGA offered by Lattice Semiconductor Corporation. It combines 1,280 logic elements with 65,536 bits of on‑chip RAM and 25 programmable I/O in a 36‑WLCSP surface‑mount package.

Designed for low‑power, reprogrammable logic in cost‑sensitive, high‑volume applications, the device supports nonvolatile configuration memory (NVCM) and SPI‑flash configuration options, enabling compact, low‑power system designs with flexible configuration modes.

Key Features

  • Core Logic  1,280 logic elements (logic cells) suitable for implementing combinational and sequential logic functions.
  • Embedded Memory  65,536 bits of on‑chip RAM (16 × 4Kbit RAM blocks as indicated for the L01 family device), useful for data buffering and small tables.
  • Low‑Power Operation  L‑series low‑power option with typical static current of 12 μA at 0 kHz (family data) and a lower core voltage range of 1.14 V to 1.26 V.
  • Programmability & Configuration  Supports self‑configuration from external SPI serial Flash and in‑system programmability via an SPI‑like serial interface; optional secure internal Nonvolatile Configuration Memory (NVCM) for ASIC‑like loading.
  • I/O and Banks  25 programmable I/O pins in a device package; flexible I/O supports typical programmable I/O signaling for system interface tasks.
  • Package & Mounting  36‑WLCSP supplier device package with surface‑mount mounting type for compact board footprint.
  • Operating Range & Compliance  Industrial temperature range of −40 °C to 85 °C and RoHS‑compliant for environmentally conscious designs.
  • Development Support  Family‑level support includes the iCEcube™ development system with VHDL/Verilog synthesis, place‑and‑route, and IP libraries (per family datasheet).

Typical Applications

  • Battery‑powered handheld devices  Low static current and low core voltage make the device suitable for energy‑sensitive handheld logic and control tasks.
  • Portable instrumentation  On‑chip RAM and reprogrammable logic enable compact data buffering and processing functions in portable test and measurement equipment.
  • Embedded system glue logic  Use as interface, protocol bridging, or custom control logic where a small footprint and reprogrammability reduce BOM and board area.
  • Industrial control and monitoring  Industrial operating temperature range supports control, I/O handling, and interface roles in industrial applications.

Unique Advantages

  • Low static power footprint: Typical 12 μA static current (family L‑series data) and reduced core voltage minimize standby energy consumption.
  • Compact package with surface‑mount convenience: 36‑WLCSP package enables high‑density board integration and space savings in constrained form factors.
  • Flexible configuration options: Support for external SPI flash, processor download over SPI‑like interface, and internal NVCM provides multiple deployment models from development to production.
  • Industrial temperature support: −40 °C to 85 °C operation allows reliable duty in a wide range of environmental conditions.
  • Developer ecosystem: Family tools such as iCEcube™ provide synthesis, place‑and‑route, and IP libraries to accelerate design implementation.

Why Choose ICE65L01F-TCS36I?

The ICE65L01F-TCS36I is positioned for designers who need a compact, low‑power FPGA with modest logic density and on‑chip RAM for control, interface, and buffering tasks. Its industrial temperature rating, RoHS compliance, and surface‑mount 36‑WLCSP package make it suitable for space‑constrained, battery‑sensitive, or industrial environments.

With multiple configuration options (external SPI flash, processor download, and internal NVCM) and family development tool support, the ICE65L01F-TCS36I delivers a practical balance of integration, low power, and design flexibility for high‑volume, cost‑sensitive applications.

Request a quote or submit an inquiry to get pricing and availability information for ICE65L01F-TCS36I and to discuss how this device fits your next low‑power FPGA design.

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