LAV-AT-300E-3CSG484C
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 230 2723840 306000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 90 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 230 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 306000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-300E-3CSG484C – Avant‑E FPGA, 306,000 Logic Elements, 230 I/Os
The LAV-AT-300E-3CSG484C is an Avant‑E Field Programmable Gate Array (FPGA) from Lattice Semiconductor, delivering a high density of programmable logic and on‑chip memory in a compact surface‑mount package. Built on the Avant platform, this commercial‑grade device is designed for designs that require substantial logic capacity, a large number of I/Os, and integrated memory resources.
With 306,000 logic elements, approximately 2.72 Mbits of embedded RAM and 230 I/Os, the device targets applications that need flexible, reprogrammable hardware for interface bridging, protocol implementation, and custom logic acceleration while conforming to a 0 °C to 85 °C operating range.
Key Features
- Programmable Logic Capacity — 306,000 logic elements provide a large fabric for implementing complex custom logic, accelerators, and protocol engines.
- Embedded Memory — Approximately 2.72 Mbits of on‑chip RAM for buffering, state machines, and local data storage without external memory.
- I/O Density & Flexibility — 230 I/Os to support high‑pin‑count designs and multiple external interfaces; sysI/O documentation on the Avant platform details support for numerous single‑ended and differential I/O standards.
- High‑Speed Interface Support — Avant platform datasheet includes hardened PCIe characteristics and PLL/sysCLOCK resources, enabling high‑speed serial and interface implementations.
- Power Supply — Core supply specified at 820 mV, enabling low‑voltage core operation as defined in the product specifications.
- Package & Mounting — 484‑FCCSP (12×12) package, 484‑BGA footprint, surface mount for compact board designs and high I/O density.
- Commercial Grade & Temperature Range — Rated for commercial operation from 0 °C to 85 °C.
- RoHS Compliance — Device is RoHS compliant, supporting lead‑free manufacturing processes.
Typical Applications
- High‑Speed Interface Bridging — Implement protocol conversion and interface bridging where large I/O counts and hardened high‑speed interfaces are required.
- Custom Logic Acceleration — Offload compute or data‑path tasks to programmable logic using the device’s sizable logic element and memory resources.
- Prototyping and Proof‑of‑Concept — Rapid hardware iteration and validation of custom IP leveraging the Avant platform capabilities documented in the datasheet.
- Embedded System Integration — Integrate multiple peripheral interfaces and custom control logic into a single, compact FPGA package for space‑constrained systems.
Unique Advantages
- High Logic Density: 306,000 logic elements enable implementation of complex designs without immediate recourse to larger FPGA families.
- Substantial On‑Chip RAM: Approximately 2.72 Mbits of embedded memory reduces external memory dependence for many buffering and state requirements.
- Generous I/O Count: 230 I/Os simplify board routing and allow direct connection to multiple peripherals and interfaces.
- Advanced Platform Features: Avant platform documentation details PLLs, sysCLOCK resources and hardened PCIe characteristics for high‑speed interface needs.
- Compact, Surface‑Mount Package: 484‑FCCSP (12×12) package delivers high density in a small form factor suitable for modern PCB layouts.
- Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial electronics production.
Why Choose LAV-AT-300E-3CSG484C?
The LAV-AT-300E-3CSG484C positions itself as a versatile, high‑density programmable logic device on the Avant platform, combining extensive logic resources, multi‑megabit embedded RAM, and a large I/O complement in a compact 484‑FCCSP package. It is well suited for engineers who need on‑device memory and I/O capacity to implement protocol engines, custom accelerators, or interface consolidation in commercial applications.
Backed by Lattice Semiconductor’s Avant platform documentation, the device provides the technical detail engineers need to design and validate high‑performance, reprogrammable hardware while meeting commercial temperature and RoHS requirements.
Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the LAV-AT-300E-3CSG484C.