LAV-AT-300E-2LFG676I

The LAV-AT-300E-2LFG676I is an Avant-E platform Field Programmable Gate Array (FPGA) IC that delivers a high-density logic fabric with substantial on-chip memory and extensive I/O. This surface-mount, industrial-grade FPGA combines approximately 306,000 logic elements, approximately 2.72 Mbits of embedded memory, and 312 I/O to support complex digital designs requiring integrated logic and connectivity.

Key Features

• Core Logic Density  Approximately 306,000 logic elements to implement large-scale digital logic, custom datapaths, and glue logic within a single device.
• Embedded Memory  Approximately 2.72 Mbits of on-chip RAM to support buffering, tables, and local storage without external memory for many use cases.
• I/O Count  312 general-purpose I/O pins provide broad interfacing options for sensors, peripherals, and system buses.
• Package & Mounting  Available in a 676-FCBGA supplier device package (27×27) / 676-BBGA FCBGA package case, optimized for surface-mount PCB assembly.
• Operating Range & Grade  Industrial-grade operation with a specified temperature range of −40 °C to 100 °C to support demanding environmental conditions.
• Voltage Supply  Specified operating supply voltage at 820 mV.
• Regulatory Compliance  RoHS compliant to meet standard material and environmental requirements.

Typical Applications

• High-density digital logic  Deployment where large numbers of logic elements are required to implement custom state machines, signal processing blocks, or datapaths.
• Memory-intensive embedded functions  On-chip RAM (~2.72 Mbits) for buffering, lookup tables, and intermediate storage without relying solely on external memory.
• I/O-rich system integration  Systems that require hundreds of I/O lines for interfacing sensors, user interfaces, or multiple peripheral buses.

Unique Advantages

• High logic capacity: The device’s ~306,000 logic elements enable consolidation of complex logic onto a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 2.72 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O integration: 312 I/O pins simplify system routing and support multiple parallel interfaces without additional I/O expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, production-ready package: 676-FCBGA (27×27) surface-mount packaging facilitates dense board layouts and automated assembly.
• RoHS compliant: Aligns with common environmental and materials requirements for commercial and industrial products.

Why Choose LAV-AT-300E-2LFG676I?

The LAV-AT-300E-2LFG676I positions itself as a high-density, industrial-grade FPGA option for designs that require a large number of logic elements, meaningful embedded memory, and significant I/O capacity in a single surface-mount package. Its combination of approximately 306,000 logic elements, roughly 2.72 Mbits of embedded RAM, and 312 I/O makes it suitable for consolidating complex digital functions and reducing system BOM.

For engineering teams and procurement evaluating scalable, integration-focused FPGA solutions, this Avant-E part offers a balance of logic capacity, embedded memory, and robust operating range while maintaining RoHS compliance.

Request a quote or submit a sales inquiry to obtain pricing and availability for the LAV-AT-300E-2LFG676I.