LAV-AT-300E-2LBG484I

IC FPGA AVANT 306KLC 484BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 230 2723840 306000 484-BFBGA, FCBGA

Quantity 183 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGA, FCBGANumber of I/O230Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells306000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-300E-2LBG484I – Avant-E Field Programmable Gate Array (FPGA) IC 230 2723840 306000 484-BFBGA, FCBGA

The LAV-AT-300E-2LBG484I is an Avant‑E platform FPGA from Lattice Semiconductor, delivered in a 484‑ball FCBGA package. It provides a high logic density silicon fabric together with substantial embedded RAM and a large I/O count for complex, integrated digital designs.

Key device parameters include approximately 306,000 logic elements, approximately 2.72 Mbits of embedded memory, 230 I/O pins, an industrial operating temperature range (‑40 °C to 100 °C), and a specified supply voltage of 820 mV. Detailed device behavior and system-level characteristics are documented in the Avant platform datasheet.

Key Features

  • Core Density — Approximately 306,000 logic elements suitable for large-scale programmable logic implementations.
  • Embedded Memory — Approximately 2.72 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
  • I/O Capacity — 230 I/O pins to consolidate multiple peripherals, interfaces, and board-level signals.
  • High‑Speed Interfaces — Datasheet documents hardened PCIe characteristics (2.5–16 Gbps ranges) and comprehensive sysI/O support including LVDS, LVDSE, SubLVDS, SLVS, Soft MIPI D‑PHY and other differential standards.
  • System Timing and Clocking — On‑chip PLL(s) and internal oscillator characteristics are specified in the platform documentation to support synchronous designs.
  • Signal Integrity and I/O Control — On‑chip programmable termination, ESD performance data, and detailed DC/differential I/O electrical characteristics are provided in the datasheet.
  • Power and Supply — Device supply specified at 820 mV; datasheet includes power supply ramp, sequencing, and supply current information for system integration.
  • Packaging & Mounting — 484‑BFBGA (supplier package: 484‑FCBGA, 19×19) in a surface‑mount form factor for compact board layouts.
  • Industrial Grade Temperature — Rated for operation from ‑40 °C to 100 °C for use in temperature‑demanding environments.

Typical Applications

  • Industrial Systems — Use where industrial temperature range and robust packaging are required for long‑lifecycle deployments.
  • High‑density Logic Implementations — Suitable for designs that require a large number of logic elements for complex custom digital functions.
  • Memory‑intensive Designs — Embedded RAM capacity supports buffering, on‑chip data processing and state machines.
  • High‑pin‑count I/O and Interface Bridging — 230 I/Os and documented high‑speed interface characteristics support consolidation of multiple peripherals and serial links.

Unique Advantages

  • High Integration Density: Approximately 306,000 logic elements enable consolidation of multiple logic blocks into a single device, reducing board-level component count.
  • Substantial On‑chip Memory: Approximately 2.72 Mbits of embedded RAM provides local storage for buffering and algorithm state without immediate external memory dependency.
  • Comprehensive I/O & Interface Support: 230 I/Os and documented support for differential standards and hardened PCIe allow flexible connectivity and high‑speed data paths.
  • Industrial Temperature Rating: Specified operation from ‑40 °C to 100 °C supports deployments in temperature‑challenging environments.
  • Complete Design Documentation: Datasheet includes DC and switching characteristics, PLL and oscillator specifications, power sequencing, programmable termination, and ESD data for predictable system integration.
  • Compact Package: 484‑ball FCBGA package (19×19) provides a high I/O count in a compact surface‑mount footprint for space‑constrained designs.

Why Choose LAV-AT-300E-2LBG484I?

The LAV-AT-300E-2LBG484I positions itself as a high‑density FPGA option on the Avant platform, combining substantial logic capacity, embedded memory, and a large I/O count in a compact 484‑FCBGA package. Its documented system characteristics—covering power sequencing, I/O standards, PLLs, and hardened PCIe behavior—help engineers integrate the device into complex digital systems with known electrical and timing parameters.

This device is particularly well suited for teams designing systems that require significant programmable logic, multiple high‑speed interfaces, and industrial temperature tolerance. Backed by platform documentation from Lattice Semiconductor, the part supports technical evaluation and system‑level planning for medium to large FPGA implementations.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the LAV-AT-300E-2LBG484I FPGA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up