LAV-AT-300E-1LFG676C
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 312 2723840 306000 676-BBGA, FCBGA |
|---|---|
| Quantity | 29 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 312 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 306000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-300E-1LFG676C – Avant-E Field Programmable Gate Array (FPGA) IC
The LAV-AT-300E-1LFG676C is an Avant-E series field programmable gate array (FPGA) supplied in a 676-ball FCBGA package. It integrates 306,000 logic element cells, approximately 2.72 Mbits of embedded memory, and 312 I/Os to support high-density, programmable digital designs.
Designed for commercial-grade applications, this surface-mount FPGA offers flexible I/O, on-chip signal features and hardened I/O/PHY options listed in the product specification set, enabling complex interfacing and system integration within a 27 × 27 mm package footprint.
Key Features
- Core Capacity — 306,000 logic element cells to implement sizable custom logic and data-paths within a single device.
- Embedded Memory — Approximately 2.72 Mbits of on-chip RAM for buffering, state storage, and embedded data structures.
- I/O Density — 312 user I/Os to support multi-channel interfaces and parallel connectivity.
- Package & Mounting — 676-FCBGA (27 × 27 mm) package, surface-mount mount type, enabling compact, high-density board designs.
- Power — Voltage supply specified at 820 mV, suitable for designs targeting the device’s defined power domain.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- High-speed Interfaces & Hardened IP — Datasheet specifications include hardened PCIe characteristics across multiple lane rates and detailed sysI/O support, useful for designs requiring standardized PCIe connectivity and a range of differential/serial I/O standards.
- sysI/O and Signal Support — Device documentation details multiple sysI/O modes and differential standards (LVDS, SubLVDS, SLVS, Soft MIPI D‑PHY and others), plus on-chip programmable termination for signal integrity tuning.
- Platform-level Reliability Features — Datasheet includes specifications for ESD performance, power supply ramp/sequence guidance, PLL and internal oscillator characteristics to aid reliable system integration.
Typical Applications
- Custom digital acceleration — Implement programmable accelerators and custom pipelines leveraging 306,000 logic elements and embedded RAM.
- High-density I/O control — Drive and manage multi-signal front-ends or control planes using 312 I/Os in a compact FCBGA footprint.
- PCIe-enabled peripherals — Integrate with host systems using the device’s documented hardened PCIe characteristics for PCIe endpoint or bridge implementations.
- Multistandard serial interfaces — Use the sysI/O options and supported differential standards for camera, display, or high-speed sensor interfaces.
Unique Advantages
- High logic and memory density: 306,000 logic element cells and approximately 2.72 Mbits of on-chip RAM provide the resources to consolidate multiple functions into one FPGA.
- Compact, high-pin package: 676-FCBGA (27 × 27 mm) enables high I/O count and dense interconnect while minimizing board area.
- Flexible signal support: Extensive sysI/O mode coverage and on-chip programmable termination simplify interfacing across a variety of differential and single-ended standards.
- Documented system features: Datasheet-level details for PLLs, internal oscillators, ESD performance, and power sequencing support robust integration and predictable behavior in target systems.
- Commercial temperature rating: Rated for 0 °C to 85 °C to match a broad set of commercial applications and deployment environments.
- RoHS compliant: Environmentally compliant with RoHS requirements to support modern manufacturing processes.
Why Choose LAV-AT-300E-1LFG676C?
The LAV-AT-300E-1LFG676C positions itself as a high-capacity, interface-rich FPGA choice for commercial designs that demand significant programmable logic, embedded memory, and dense I/O in a compact package. Its documented platform features—covering high-speed I/O standards, hardened PCIe characteristics, programmable termination, and system-level timing and power guidance—help reduce integration risk and accelerate time to market.
This device is suited to engineering teams building custom digital systems, high-density interface controllers, or PCIe-capable peripherals who require verifiable device-level specifications and a balance of logic capacity, memory and I/O in a single, surface-mount FCBGA package.
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