LAV-AT-300E-1LFG676C

IC FPGA AVANT 306KLC 676BGA
Part Description

Avant-E Field Programmable Gate Array (FPGA) IC 312 2723840 306000 676-BBGA, FCBGA

Quantity 29 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O312Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells306000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-300E-1LFG676C – Avant-E Field Programmable Gate Array (FPGA) IC

The LAV-AT-300E-1LFG676C is an Avant-E series field programmable gate array (FPGA) supplied in a 676-ball FCBGA package. It integrates 306,000 logic element cells, approximately 2.72 Mbits of embedded memory, and 312 I/Os to support high-density, programmable digital designs.

Designed for commercial-grade applications, this surface-mount FPGA offers flexible I/O, on-chip signal features and hardened I/O/PHY options listed in the product specification set, enabling complex interfacing and system integration within a 27 × 27 mm package footprint.

Key Features

  • Core Capacity — 306,000 logic element cells to implement sizable custom logic and data-paths within a single device.
  • Embedded Memory — Approximately 2.72 Mbits of on-chip RAM for buffering, state storage, and embedded data structures.
  • I/O Density — 312 user I/Os to support multi-channel interfaces and parallel connectivity.
  • Package & Mounting — 676-FCBGA (27 × 27 mm) package, surface-mount mount type, enabling compact, high-density board designs.
  • Power — Voltage supply specified at 820 mV, suitable for designs targeting the device’s defined power domain.
  • Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
  • High-speed Interfaces & Hardened IP — Datasheet specifications include hardened PCIe characteristics across multiple lane rates and detailed sysI/O support, useful for designs requiring standardized PCIe connectivity and a range of differential/serial I/O standards.
  • sysI/O and Signal Support — Device documentation details multiple sysI/O modes and differential standards (LVDS, SubLVDS, SLVS, Soft MIPI D‑PHY and others), plus on-chip programmable termination for signal integrity tuning.
  • Platform-level Reliability Features — Datasheet includes specifications for ESD performance, power supply ramp/sequence guidance, PLL and internal oscillator characteristics to aid reliable system integration.

Typical Applications

  • Custom digital acceleration — Implement programmable accelerators and custom pipelines leveraging 306,000 logic elements and embedded RAM.
  • High-density I/O control — Drive and manage multi-signal front-ends or control planes using 312 I/Os in a compact FCBGA footprint.
  • PCIe-enabled peripherals — Integrate with host systems using the device’s documented hardened PCIe characteristics for PCIe endpoint or bridge implementations.
  • Multistandard serial interfaces — Use the sysI/O options and supported differential standards for camera, display, or high-speed sensor interfaces.

Unique Advantages

  • High logic and memory density: 306,000 logic element cells and approximately 2.72 Mbits of on-chip RAM provide the resources to consolidate multiple functions into one FPGA.
  • Compact, high-pin package: 676-FCBGA (27 × 27 mm) enables high I/O count and dense interconnect while minimizing board area.
  • Flexible signal support: Extensive sysI/O mode coverage and on-chip programmable termination simplify interfacing across a variety of differential and single-ended standards.
  • Documented system features: Datasheet-level details for PLLs, internal oscillators, ESD performance, and power sequencing support robust integration and predictable behavior in target systems.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to match a broad set of commercial applications and deployment environments.
  • RoHS compliant: Environmentally compliant with RoHS requirements to support modern manufacturing processes.

Why Choose LAV-AT-300E-1LFG676C?

The LAV-AT-300E-1LFG676C positions itself as a high-capacity, interface-rich FPGA choice for commercial designs that demand significant programmable logic, embedded memory, and dense I/O in a compact package. Its documented platform features—covering high-speed I/O standards, hardened PCIe characteristics, programmable termination, and system-level timing and power guidance—help reduce integration risk and accelerate time to market.

This device is suited to engineering teams building custom digital systems, high-density interface controllers, or PCIe-capable peripherals who require verifiable device-level specifications and a balance of logic capacity, memory and I/O in a single, surface-mount FCBGA package.

Request a quote or contact sales to discuss availability, lead times and volume pricing for LAV-AT-300E-1LFG676C. Our team can provide purchasing and delivery options to match your project schedule.

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