LAV-AT-300E-2CSG484C
| Part Description |
Avant-E Field Programmable Gate Array (FPGA) IC 230 2723840 306000 484-BGA, FCCSPBGA |
|---|---|
| Quantity | 427 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCCSP (12x12) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA, FCCSPBGA | Number of I/O | 230 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 306000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-300E-2CSG484C – Avant‑E FPGA, 306,000 Logic Elements, 230 I/Os
The LAV-AT-300E-2CSG484C is an Avant‑E Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation designed for commercial embedded applications requiring reconfigurable logic. It combines a high logic element count with on‑chip RAM and a dense I/O complement in a compact surface‑mount FCCSP/BGA package.
With 306,000 logic elements, approximately 2.72 Mbits of embedded memory and 230 I/Os, this device is targeted at board‑level designs that need substantial programmable logic and high pin density while conforming to commercial temperature and RoHS requirements.
Key Features
- Logic Capacity 306,000 logic elements provide substantial programmable resources for complex designs and hardware acceleration.
- Embedded Memory Approximately 2.72 Mbits of on‑chip RAM to support buffering, state storage and local data processing.
- I/O Density 230 I/Os enable dense peripheral interfacing and multi‑channel connectivity on constrained PCBs.
- Package and Mounting 484‑ball FCCSP/BGA package (484‑FCCSP, 12×12) in a surface‑mount form factor for compact board integration.
- Power Device specified with a supply voltage of 820 mV.
- Commercial Grade & Temperature Rated for commercial operation from 0 °C to 85 °C.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Commercial Embedded Systems Reconfigurable logic for control, signal processing and feature upgrades in commercial products operating within 0 °C to 85 °C.
- High‑Density I/O Designs Systems that require many interfaces or parallel channels can leverage the 230 I/Os for flexible board‑level connectivity.
- Compact Board Deployments Space‑constrained designs benefit from the 12×12 484‑FCCSP package and surface‑mount profile.
- Prototyping and Development Use where substantial programmable logic and embedded RAM are needed for iterative hardware and firmware development.
Unique Advantages
- High programmable density: 306,000 logic elements enable implementation of complex logic and parallel processing without immediate need for external accelerators.
- On‑chip memory for local buffering: Approximately 2.72 Mbits of embedded RAM reduces dependence on external memory for many applications, simplifying board design.
- Large I/O count: 230 I/Os provide flexible interfacing options for sensors, peripherals and multiple channel I/O requirements.
- Compact packaging: 484‑FCCSP (12×12) BGA package delivers high pin density in a small footprint for tight PCB layouts.
- Commercial operating range: Rated for 0 °C to 85 °C to meet typical commercial product requirements.
- Environmental compliance: RoHS status ensures the device meets common environmental regulatory expectations.
Why Choose LAV-AT-300E-2CSG484C?
The LAV-AT-300E-2CSG484C positions itself as a high‑capacity Avant‑E FPGA option for commercial embedded designs that need a balance of logic resources, on‑chip memory and dense I/O in a compact surface‑mount package. Its combination of 306,000 logic elements, approximately 2.72 Mbits of embedded RAM and 230 I/Os makes it well suited for applications that require significant reconfigurable logic without expanding board area or external component count.
Designed for commercial temperature operation and RoHS compliance, this device offers a clear path for product designs focused on scalability and integration at the board level while leveraging the Avant‑E platform architecture.
If you would like pricing, availability or a custom quote for the LAV-AT-300E-2CSG484C, submit a request or inquiry and our team will respond with the information you need.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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