LAV-AT-300E-1LFG676I

The LAV-AT-300E-1LFG676I is an Avant‑E FPGA from Lattice Semiconductor supplied in a 676‑ball FCBGA (27×27) surface‑mount package. It provides a high density of programmable logic and on‑chip RAM in an industrial‑grade device with extensive I/O capability and documented electrical and timing characteristics in the accompanying datasheet.

Engineered for designs that require large programmable logic resources, substantial embedded memory, and broad I/O, this device targets engineers seeking a scalable, rugged FPGA building block for industrial and other temperature‑sensitive applications.

Key Features

• Core Logic Density  Approximately 306,000 logic elements (LEs) to implement complex programmable logic functions and custom hardware acceleration.
• Embedded Memory  Approximately 2.72 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Capacity  312 user I/Os, enabling dense peripheral interfacing and multi‑channel connectivity.
• Package & Mounting  676‑BBGA FCBGA package (supplier device package: 676‑FCBGA, 27×27) with surface‑mount mounting suitable for compact board designs.
• Voltage Supply  Documented voltage supply reference at 820 mV (per product data).
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting deployments in temperature‑sensitive environments.
• Compliance  RoHS‑compliant to support regulatory and manufacturing requirements.
• Datasheet Coverage  Comprehensive datasheet content includes DC/switching characteristics, power sequencing, sysI/O electrical characteristics, sysCLOCK PLL timing, and hardened PCIe characteristics across multiple data rates as documented in the product literature.

Typical Applications

• High‑density programmable logic  Large FPGA designs that require roughly 306k logic elements and significant on‑chip RAM for algorithm implementation or hardware acceleration.
• I/O‑intensive systems  Applications needing extensive external interfacing using the device’s 312 I/Os for sensors, peripherals, or multi‑lane connectivity.
• Industrial control and monitoring  Deployments taking advantage of the industrial operating temperature range (−40 °C to 100 °C) and surface‑mount FCBGA packaging.

Unique Advantages

• High logic integration: The device’s ~306,000 logic elements let designers consolidate complex functions into a single FPGA, reducing external component count.
• Substantial embedded memory: Approximately 2.72 Mbits of on‑chip RAM supports buffering, state machines, and large lookup tables without relying solely on external memory.
• Extensive I/O flexibility: 312 I/Os provide capacity for multi‑channel interfaces and dense peripheral connectivity, simplifying board‑level routing and design partitioning.
• Industrial thermal capability: Specified operation from −40 °C to 100 °C supports designs that must tolerate wide temperature ranges.
• Compact, production‑ready package: The 676‑FCBGA (27×27) surface‑mount package balances high pin count with a compact footprint for space‑constrained boards.
• Documented system‑level details: The available datasheet includes extensive DC, timing, and sysI/O specifications and hardened PCIe characteristics to aid system validation and integration.

Why Choose LAV-AT-300E-1LFG676I?

The LAV-AT-300E-1LFG676I positions itself as a high‑density, industrial‑grade FPGA option that combines a large logic fabric, meaningful on‑chip RAM, and broad I/O in a compact FCBGA package. Its documented electrical, timing, and interface characteristics support engineering evaluation and system integration for complex programmable logic designs.

This device is well suited for development teams and procurement looking for a robust FPGA building block for high‑logic, I/O‑heavy, or temperature‑sensitive applications where component consolidation and clear datasheet guidance are priorities.

Request a quote or submit an inquiry to receive pricing and availability for LAV-AT-300E-1LFG676I and to discuss how this Avant‑E FPGA can fit your next design.