LAV-AT-G50-1LFG676C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA

Quantity 587 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-G50-1LFG676C – Avant™-G Field Programmable Gate Array (FPGA) IC

The LAV-AT-G50-1LFG676C is an Avant™-G FPGA IC from Lattice Semiconductor Corporation. It implements the Avant platform architecture with high logic density and integrated system building blocks for FPGA-based designs.

With 409,000 logic elements, approximately 2.7 Mbits of embedded memory, and 298 I/O, this commercial-grade, surface-mount FCBGA device targets designs that require substantial programmable logic, embedded RAM, and flexible I/O in a compact 676-FCBGA (27×27) package.

Key Features

  • Core Logic Capacity — 409,000 logic elements provide significant programmable fabric for complex logic, controllers, and datapath implementations.
  • Embedded Memory — Approximately 2.7 Mbits of on-chip RAM with sysMEM capabilities such as single/dual/pseudo-dual port modes, memory cascading, FIFO modes, and RAM initialization/ROM operation.
  • I/O Density — 298 user I/O pins support high-connectivity applications and flexible sysI/O banking and programmable I/O cell configurations.
  • Clocking and Timing — On-chip oscillator, PLLs, global and regional clock networks, edge clocks, PHY clocks, clock synchronizers/dividers, and dynamic clock control provide a broad clock-management feature set.
  • High‑Speed Interfaces — Platform-level support for SERDES/PMA blocks, Multi-Protocol PCS (MPPCS), and Multi-Protocol PHY (MPPHY) integration to enable high-speed serial and PHY interfaces.
  • DDR Memory Support — DDRPHY and DQS grouping for DDR memory interfaces enable integration with external DDR memory subsystems.
  • Programmable DSP and Peripherals — sysDSP blocks and programmable functional unit (PFU) slices for datapath acceleration and arithmetic-intensive functions.
  • Configuration and Reliability — Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling mechanisms documented for the Avant platform.
  • Package & Mounting — 676-BBGA / 676-FCBGA (27×27) package, surface-mount mounting type suitable for compact board designs.
  • Electrical & Environmental — Voltage supply specified at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High-density data processing: FPGA fabric and sysDSP resources enable implementation of custom datapath acceleration and packet processing logic.
  • Memory interface controllers: sysMEM and DDRPHY support facilitate integration with external DDR memory for buffering and high-throughput designs.
  • Multi-protocol connectivity: SERDES, PCS, and multi-protocol PHY integration provide flexibility for serial links and protocol adaptation.
  • System integration and prototyping: Large logic capacity and extensive I/O make the device suitable for consolidating multiple functions into a single FPGA for system prototyping and integration.

Unique Advantages

  • High logical capacity: 409,000 logic elements enable implementation of complex controllers, accelerators, and custom peripherals on a single device.
  • Substantial embedded memory: Approximately 2.7 Mbits of on-chip RAM with flexible memory modes reduces dependence on external memory for many applications.
  • Comprehensive clocking: Multiple on-chip clock resources, PLLs, and dynamic clock controls simplify timing architectures for multi-domain designs.
  • Integrated high-speed PHYs: SERDES and DDRPHY support allow direct implementation of high-speed interfaces and memory subsystems, lowering system-level integration effort.
  • Compact FCBGA packaging: 676-FCBGA (27×27) package delivers high I/O count and logic capacity in a space-efficient surface-mount form factor.
  • Commercial-grade and compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliant for standard production environments.

Why Choose LAV-AT-G50-1LFG676C?

The LAV-AT-G50-1LFG676C positions the Avant™-G platform’s architecture and system-level features into a high-capacity FPGA package that balances logic density, on-chip memory, and extensive I/O. It is suited for engineers and system designers who need a compact, surface-mount FPGA with integrated clocking, memory, DSP, and high-speed interface capabilities documented by Lattice Semiconductor.

Its combination of 409,000 logic elements, approximately 2.7 Mbits of embedded memory, DDR and SERDES support, and 298 I/O pins makes it a practical choice for consolidating complex digital functions and shortening system-level design cycles in commercial-temperature applications.

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