LAV-AT-G50-1LFG676C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 587 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-G50-1LFG676C – Avant™-G Field Programmable Gate Array (FPGA) IC
The LAV-AT-G50-1LFG676C is an Avant™-G FPGA IC from Lattice Semiconductor Corporation. It implements the Avant platform architecture with high logic density and integrated system building blocks for FPGA-based designs.
With 409,000 logic elements, approximately 2.7 Mbits of embedded memory, and 298 I/O, this commercial-grade, surface-mount FCBGA device targets designs that require substantial programmable logic, embedded RAM, and flexible I/O in a compact 676-FCBGA (27×27) package.
Key Features
- Core Logic Capacity — 409,000 logic elements provide significant programmable fabric for complex logic, controllers, and datapath implementations.
- Embedded Memory — Approximately 2.7 Mbits of on-chip RAM with sysMEM capabilities such as single/dual/pseudo-dual port modes, memory cascading, FIFO modes, and RAM initialization/ROM operation.
- I/O Density — 298 user I/O pins support high-connectivity applications and flexible sysI/O banking and programmable I/O cell configurations.
- Clocking and Timing — On-chip oscillator, PLLs, global and regional clock networks, edge clocks, PHY clocks, clock synchronizers/dividers, and dynamic clock control provide a broad clock-management feature set.
- High‑Speed Interfaces — Platform-level support for SERDES/PMA blocks, Multi-Protocol PCS (MPPCS), and Multi-Protocol PHY (MPPHY) integration to enable high-speed serial and PHY interfaces.
- DDR Memory Support — DDRPHY and DQS grouping for DDR memory interfaces enable integration with external DDR memory subsystems.
- Programmable DSP and Peripherals — sysDSP blocks and programmable functional unit (PFU) slices for datapath acceleration and arithmetic-intensive functions.
- Configuration and Reliability — Enhanced configuration options, JTAG support, and Single Event Upset (SEU) handling mechanisms documented for the Avant platform.
- Package & Mounting — 676-BBGA / 676-FCBGA (27×27) package, surface-mount mounting type suitable for compact board designs.
- Electrical & Environmental — Voltage supply specified at 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-density data processing: FPGA fabric and sysDSP resources enable implementation of custom datapath acceleration and packet processing logic.
- Memory interface controllers: sysMEM and DDRPHY support facilitate integration with external DDR memory for buffering and high-throughput designs.
- Multi-protocol connectivity: SERDES, PCS, and multi-protocol PHY integration provide flexibility for serial links and protocol adaptation.
- System integration and prototyping: Large logic capacity and extensive I/O make the device suitable for consolidating multiple functions into a single FPGA for system prototyping and integration.
Unique Advantages
- High logical capacity: 409,000 logic elements enable implementation of complex controllers, accelerators, and custom peripherals on a single device.
- Substantial embedded memory: Approximately 2.7 Mbits of on-chip RAM with flexible memory modes reduces dependence on external memory for many applications.
- Comprehensive clocking: Multiple on-chip clock resources, PLLs, and dynamic clock controls simplify timing architectures for multi-domain designs.
- Integrated high-speed PHYs: SERDES and DDRPHY support allow direct implementation of high-speed interfaces and memory subsystems, lowering system-level integration effort.
- Compact FCBGA packaging: 676-FCBGA (27×27) package delivers high I/O count and logic capacity in a space-efficient surface-mount form factor.
- Commercial-grade and compliant: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliant for standard production environments.
Why Choose LAV-AT-G50-1LFG676C?
The LAV-AT-G50-1LFG676C positions the Avant™-G platform’s architecture and system-level features into a high-capacity FPGA package that balances logic density, on-chip memory, and extensive I/O. It is suited for engineers and system designers who need a compact, surface-mount FPGA with integrated clocking, memory, DSP, and high-speed interface capabilities documented by Lattice Semiconductor.
Its combination of 409,000 logic elements, approximately 2.7 Mbits of embedded memory, DDR and SERDES support, and 298 I/O pins makes it a practical choice for consolidating complex digital functions and shortening system-level design cycles in commercial-temperature applications.
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