LAV-AT-G50-2LBG484C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BFBGA, FCBGA |
|---|---|
| Quantity | 1,214 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA, FCBGA | Number of I/O | 218 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-G50-2LBG484C – Avant™-G Field Programmable Gate Array (FPGA) IC, 218 I/O, approximately 2.72 Mbits RAM, 409,000 logic elements, 484-FCBGA
The LAV-AT-G50-2LBG484C is an Avant™-G Field Programmable Gate Array (FPGA) supplied in a 484-FCBGA (19×19) package. It provides a high logic element count and substantial on-chip RAM while supporting a 218-pin I/O footprint in a surface-mount BFBGA/FCBGA package. Targeted for commercial-grade applications, the device operates across a 0 °C to 85 °C temperature range and is RoHS compliant.
Documentation for the Avant platform includes detailed electrical and timing characteristics such as sysI/O, PLLs, internal oscillators and hardened PCIe characteristics, enabling engineers to evaluate high-speed interfaces and system timing for integration into complex designs.
Key Features
- Programmable Logic Capacity Provides 409,000 logic elements for implementing complex custom logic and parallel processing functions.
- Embedded Memory Approximately 2.72 Mbits of on-chip RAM for buffering, FIFOs and local data storage within user logic.
- High I/O Count 218 available I/O pins to support extensive peripheral, sensor and high-density connector interfacing.
- Package and Mounting Supplied in a 484-BFBGA / 484-FCBGA (19×19) package designed for surface-mount assembly to save board area while maintaining signal density.
- Power Core voltage specified at 820 mV (per device data).
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
- Standards and Compliance RoHS compliant.
- Platform-Level Documentation Datasheet content includes DC and switching characteristics, sysI/O timing, PLL and oscillator specifications, and hardened PCIe characteristics across multiple speed segments to support interface design and system timing validation.
Typical Applications
- PCIe and High-Speed Interface Bridging Use the documented hardened PCIe characteristics and sysI/O timing to implement host interfaces and data-plane bridging in systems that require standardized high-speed connectivity.
- Custom Logic and Acceleration Deploy the 409,000 logic elements and embedded memory to implement custom accelerators, protocol offloads or control logic tailored to application needs.
- High-Density I/O Aggregation Leverage 218 I/O pins to aggregate sensors, peripherals, or multi-channel data streams in compact board designs.
- Embedded Platform Integration Integrate programmable fabric and on-chip memory in commercial embedded products where a 0 °C to 85 °C operating range and surface-mount 484-FCBGA footprint are appropriate.
Unique Advantages
- Large Logic Resource Pool: The device’s 409,000 logic elements enable substantial on-chip programmability for complex algorithms and parallel datapaths.
- Significant On-Chip Memory: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence for many buffering and state storage needs.
- High I/O Density: With 218 I/Os, the package supports extensive peripheral interfacing while conserving PCB real estate with a 19×19 FCBGA footprint.
- Platform-Level Technical Detail: Comprehensive datasheet sections covering sysI/O, PLLs, internal oscillators and hardened PCIe characteristics help engineers validate timing and interface requirements.
- Compact Surface-Mount Package: The 484-FCBGA/484-BFBGA package offers a high pin-count solution suitable for space-constrained commercial boards.
- Regulatory Compliance: RoHS compliance supports deployment in regions and products requiring restricted-substance adherence.
Why Choose LAV-AT-G50-2LBG484C?
The LAV-AT-G50-2LBG484C positions itself as a commercial-grade FPGA option with a large programmable resource set (409,000 logic elements) and meaningful on-chip memory (~2.72 Mbits) combined with a high I/O count (218). Its 484-FCBGA package delivers density for compact system designs while platform documentation provides the low-level electrical and timing data engineers need to integrate high-speed interfaces and validate system behavior.
This device is suited to development teams designing commercial embedded systems, high-density I/O aggregation solutions, or FPGA-based interface bridges where documented sysI/O and PCIe characteristics support hardware integration and timing closure.
Request a quote or submit an inquiry to receive availability, pricing and additional technical support for LAV-AT-G50-2LBG484C.

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