LAV-AT-G50-2LBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BFBGA, FCBGA

Quantity 1,214 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BFBGA, FCBGANumber of I/O218Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-G50-2LBG484C – Avant™-G Field Programmable Gate Array (FPGA) IC, 218 I/O, approximately 2.72 Mbits RAM, 409,000 logic elements, 484-FCBGA

The LAV-AT-G50-2LBG484C is an Avant™-G Field Programmable Gate Array (FPGA) supplied in a 484-FCBGA (19×19) package. It provides a high logic element count and substantial on-chip RAM while supporting a 218-pin I/O footprint in a surface-mount BFBGA/FCBGA package. Targeted for commercial-grade applications, the device operates across a 0 °C to 85 °C temperature range and is RoHS compliant.

Documentation for the Avant platform includes detailed electrical and timing characteristics such as sysI/O, PLLs, internal oscillators and hardened PCIe characteristics, enabling engineers to evaluate high-speed interfaces and system timing for integration into complex designs.

Key Features

  • Programmable Logic Capacity  Provides 409,000 logic elements for implementing complex custom logic and parallel processing functions.
  • Embedded Memory  Approximately 2.72 Mbits of on-chip RAM for buffering, FIFOs and local data storage within user logic.
  • High I/O Count  218 available I/O pins to support extensive peripheral, sensor and high-density connector interfacing.
  • Package and Mounting  Supplied in a 484-BFBGA / 484-FCBGA (19×19) package designed for surface-mount assembly to save board area while maintaining signal density.
  • Power  Core voltage specified at 820 mV (per device data).
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
  • Standards and Compliance  RoHS compliant.
  • Platform-Level Documentation  Datasheet content includes DC and switching characteristics, sysI/O timing, PLL and oscillator specifications, and hardened PCIe characteristics across multiple speed segments to support interface design and system timing validation.

Typical Applications

  • PCIe and High-Speed Interface Bridging  Use the documented hardened PCIe characteristics and sysI/O timing to implement host interfaces and data-plane bridging in systems that require standardized high-speed connectivity.
  • Custom Logic and Acceleration  Deploy the 409,000 logic elements and embedded memory to implement custom accelerators, protocol offloads or control logic tailored to application needs.
  • High-Density I/O Aggregation  Leverage 218 I/O pins to aggregate sensors, peripherals, or multi-channel data streams in compact board designs.
  • Embedded Platform Integration  Integrate programmable fabric and on-chip memory in commercial embedded products where a 0 °C to 85 °C operating range and surface-mount 484-FCBGA footprint are appropriate.

Unique Advantages

  • Large Logic Resource Pool: The device’s 409,000 logic elements enable substantial on-chip programmability for complex algorithms and parallel datapaths.
  • Significant On-Chip Memory: Approximately 2.72 Mbits of embedded RAM reduces external memory dependence for many buffering and state storage needs.
  • High I/O Density: With 218 I/Os, the package supports extensive peripheral interfacing while conserving PCB real estate with a 19×19 FCBGA footprint.
  • Platform-Level Technical Detail: Comprehensive datasheet sections covering sysI/O, PLLs, internal oscillators and hardened PCIe characteristics help engineers validate timing and interface requirements.
  • Compact Surface-Mount Package: The 484-FCBGA/484-BFBGA package offers a high pin-count solution suitable for space-constrained commercial boards.
  • Regulatory Compliance: RoHS compliance supports deployment in regions and products requiring restricted-substance adherence.

Why Choose LAV-AT-G50-2LBG484C?

The LAV-AT-G50-2LBG484C positions itself as a commercial-grade FPGA option with a large programmable resource set (409,000 logic elements) and meaningful on-chip memory (~2.72 Mbits) combined with a high I/O count (218). Its 484-FCBGA package delivers density for compact system designs while platform documentation provides the low-level electrical and timing data engineers need to integrate high-speed interfaces and validate system behavior.

This device is suited to development teams designing commercial embedded systems, high-density I/O aggregation solutions, or FPGA-based interface bridges where documented sysI/O and PCIe characteristics support hardware integration and timing closure.

Request a quote or submit an inquiry to receive availability, pricing and additional technical support for LAV-AT-G50-2LBG484C.

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