LAV-AT-G50-2LFG676I

The LAV-AT-G50-2LFG676I is an Avant™-G FPGA from Lattice Semiconductor Corporation offering a high-density programmable fabric with 409,000 logic elements and approximately 2.7 Mbits of embedded memory. The device combines a versatile Avant platform architecture (PFU blocks, slices, routing and clocking structures) with extensive I/O and on-chip subsystems to support complex digital, memory and interface functions.

Designed for industrial-grade applications, this surface-mount FPGA in a 676‑FCBGA (27×27) package provides 298 I/Os, on-chip clocking (including oscillator and PLL), DDR memory support and SERDES/PCS subsystems, making it suitable for systems that require significant logic capacity, DSP capability and flexible high‑speed connectivity within a −40 °C to 100 °C operating range.

Key Features

• Core Architecture (Avant Platform) Programmable Functional Unit (PFU) blocks and slice-based fabric as described in the Avant platform overview and architecture sections.
• Logic Capacity 409,000 logic elements to implement large combinational and sequential designs.
• Embedded Memory (sysMEM) Approximately 2.7 Mbits of on-chip RAM with features noted in the datasheet such as memory initialization, single/dual/pseudo‑dual port modes and FIFO support.
• DSP Capability (sysDSP) Dedicated sysDSP resources are included in the Avant platform architecture for signal processing functions.
• Programmable I/O (PIO) 298 I/Os with a documented sysI/O banking scheme and supported I/O standards described in the platform overview.
• Clocking and Timing On-chip oscillator, PLL, global and regional clock domains, dynamic clock select/control and clock synchronizers described in the clocking structure sections.
• Memory Interface Support DDR memory support and DDRPHY features are included in the platform overview for external memory interfacing.
• SERDES and High‑Speed PHY SERDES/PMA blocks, Multi‑Protocol PCS and MPPHY integration capability are covered in the datasheet overview for high‑speed serial links.
• Device Configuration and Reliability Enhanced configuration options, JTAG and SEU handling are described in the device configuration material.
• Package and Environmental Surface-mount 676‑BBGA / 676‑FCBGA (27×27) package; RoHS compliant; operating range −40 °C to 100 °C.
• Supply Voltage Specified supply at 820 mV (per product specifications).

Typical Applications

• High‑performance signal processing — Use the substantial logic array and sysDSP resources to implement custom DSP pipelines and accelerators.
• Memory interface and buffering — Leverage on‑chip sysMEM features and DDRPHY support for memory controllers, FIFOs and buffering functions.
• High‑speed serial connectivity — Implement protocol bridging, SERDES links and multi‑protocol PHY integrations using the SERDES/PCS subsystems.
• I/O‑rich system glue — Exploit 298 programmable I/Os and the PIO banking scheme for board-level interface, aggregation and control logic.

Unique Advantages

• High logic density: 409,000 logic elements provide the capacity to consolidate complex functions into a single FPGA device, reducing board-level component count.
• Integrated embedded memory: Approximately 2.7 Mbits of sysMEM with flexible porting and FIFO modes simplifies data buffering and on‑chip storage.
• Comprehensive clocking: On‑chip oscillator, PLLs and regional/global clock structures enable flexible timing architectures and dynamic clock control.
• Robust I/O and PHY options: 298 I/Os plus documented SERDES, PCS and DDRPHY capabilities support a wide range of interface and high‑speed link requirements.
• Industrial temperature range: Rated for −40 °C to 100 °C operation for deployment in demanding environments.
• Compact FCBGA package: 676‑FCBGA (27×27) surface‑mount package provides a high pin‑count footprint in a single compact package.

Why Choose LAV-AT-G50-2LFG676I?

The LAV-AT-G50-2LFG676I positions the Avant™-G architecture into a high‑density FPGA offering that combines substantial logic resources, embedded memory and comprehensive on‑chip subsystems—making it well suited for designs that require integrated DSP, memory interfaces and high‑speed serial links. Its industrial temperature rating, high I/O count and compact 676‑FCBGA package support robust, space‑efficient system designs.

Engineers specifying this device benefit from the documented Avant platform building blocks—PFU slices, sysMEM, sysDSP, PIO, clocking and SERDES/PHY elements—enabling scalable implementations and reduced board complexity for demanding embedded applications.

Request a quote or submit an inquiry for pricing and availability of the LAV-AT-G50-2LFG676I.