LAV-AT-G50-3LBG484C

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BFBGA, FCBGA

Quantity 231 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BFBGA, FCBGANumber of I/O218Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells409000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits2723840

Overview of LAV-AT-G50-3LBG484C – Avant™-G Field Programmable Gate Array (FPGA) IC, 218 I/O, ~2.72 Mbit RAM, 409,000 logic elements, 484-FCBGA

The LAV-AT-G50-3LBG484C is an Avant™-G FPGA from Lattice Semiconductor Corporation designed for high-density programmable logic implementations. This surface-mount FCBGA device provides 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 218 user I/Os in a 484-FCBGA (19×19) package.

Targeted for commercial applications, the device offers a compact, high-density programmable fabric with documented platform-level characteristics in the vendor datasheet including DC and switching parameters, programmable I/O termination options, high-speed serial interfaces, and hardened PCIe characteristics.

Key Features

  • Logic Capacity  409,000 logic elements suitable for large FPGA designs and complex logic implementations.
  • Embedded Memory  Approximately 2.72 Mbits of on-chip RAM for buffering, LUT-based memory, and intermediate data storage.
  • I/O Density  218 I/Os to support a wide mix of peripheral interfaces and board-level connectivity.
  • Package & Mounting  484-FCBGA (19×19) package, surface-mount mounting type, enabling a compact board footprint for space-constrained designs.
  • Power Supply  Documented device supply requirement at 820 mV as specified in the product data.
  • Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.
  • Platform-Level Capabilities (per datasheet)  Datasheet documentation covers DC and switching characteristics, on‑chip programmable termination, ESD performance, sysI/O differential and single‑ended characteristics (including LVDS and soft MIPI D‑PHY), internal oscillators, PLL timing, and hardened PCIe characteristics across multiple data rates.

Typical Applications

  • High-speed communications equipment  Use the device’s documented high-speed I/O and hardened PCIe characteristics to implement data-path acceleration and protocol bridging where PCIe interface capability is required.
  • Video and imaging systems  Platform support for soft MIPI D‑PHY and differential I/O options makes the device suitable for multi‑camera interfaces and video data handling.
  • Edge compute and acceleration  Large logic capacity and on-chip RAM enable implementation of custom accelerators and FPGA-based processing blocks in compact form factors.
  • Prototyping and system integration  High I/O count and comprehensive datasheet specifications support rapid integration and board-level prototyping for advanced logic designs.

Unique Advantages

  • High logic density: 409,000 logic elements allow substantial logic integration on a single device, reducing the need for multi‑chip solutions.
  • Meaningful embedded memory: Approximately 2.72 Mbits of on‑chip RAM supports buffering, state machines, and small data caches close to logic.
  • Extensive I/O mix: 218 I/Os provide flexibility to connect multiple peripherals, clocks, and high‑speed lanes without external multiplexing.
  • Compact assembly: 484‑FCBGA (19×19) surface‑mount package balances board footprint and routing density for compact systems.
  • Documented high‑speed interfaces: Datasheet coverage of differential I/O standards, PLLs, and hardened PCIe characteristics simplifies high‑speed interface design and validation.
  • Commercial readiness and compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance support mainstream electronic product requirements.

Why Choose LAV-AT-G50-3LBG484C?

The LAV-AT-G50-3LBG484C positions itself as a high-density, commercially rated FPGA option within the Avant™ platform, delivering substantial logic capacity, on‑chip RAM, and a large I/O complement in a compact FCBGA package. Its documented platform-level electrical and timing characteristics—including programmable I/O termination, differential I/O modes, PLL/oscillator behavior, and hardened PCIe information—help engineers evaluate and integrate the device into complex designs with greater confidence.

This part is suitable for teams building feature-rich commercial products that require significant programmable logic, meaningful embedded memory, and extensive I/O capability, while adhering to RoHS requirements and operating within a commercial temperature range.

Request a quote or submit a pricing request for LAV-AT-G50-3LBG484C today to evaluate its fit for your next FPGA-based design.

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