LAV-AT-G50-3LBG484C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 218 2723840 409000 484-BFBGA, FCBGA |
|---|---|
| Quantity | 231 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA, FCBGA | Number of I/O | 218 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-G50-3LBG484C – Avant™-G Field Programmable Gate Array (FPGA) IC, 218 I/O, ~2.72 Mbit RAM, 409,000 logic elements, 484-FCBGA
The LAV-AT-G50-3LBG484C is an Avant™-G FPGA from Lattice Semiconductor Corporation designed for high-density programmable logic implementations. This surface-mount FCBGA device provides 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 218 user I/Os in a 484-FCBGA (19×19) package.
Targeted for commercial applications, the device offers a compact, high-density programmable fabric with documented platform-level characteristics in the vendor datasheet including DC and switching parameters, programmable I/O termination options, high-speed serial interfaces, and hardened PCIe characteristics.
Key Features
- Logic Capacity 409,000 logic elements suitable for large FPGA designs and complex logic implementations.
- Embedded Memory Approximately 2.72 Mbits of on-chip RAM for buffering, LUT-based memory, and intermediate data storage.
- I/O Density 218 I/Os to support a wide mix of peripheral interfaces and board-level connectivity.
- Package & Mounting 484-FCBGA (19×19) package, surface-mount mounting type, enabling a compact board footprint for space-constrained designs.
- Power Supply Documented device supply requirement at 820 mV as specified in the product data.
- Operating Range & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant.
- Platform-Level Capabilities (per datasheet) Datasheet documentation covers DC and switching characteristics, on‑chip programmable termination, ESD performance, sysI/O differential and single‑ended characteristics (including LVDS and soft MIPI D‑PHY), internal oscillators, PLL timing, and hardened PCIe characteristics across multiple data rates.
Typical Applications
- High-speed communications equipment Use the device’s documented high-speed I/O and hardened PCIe characteristics to implement data-path acceleration and protocol bridging where PCIe interface capability is required.
- Video and imaging systems Platform support for soft MIPI D‑PHY and differential I/O options makes the device suitable for multi‑camera interfaces and video data handling.
- Edge compute and acceleration Large logic capacity and on-chip RAM enable implementation of custom accelerators and FPGA-based processing blocks in compact form factors.
- Prototyping and system integration High I/O count and comprehensive datasheet specifications support rapid integration and board-level prototyping for advanced logic designs.
Unique Advantages
- High logic density: 409,000 logic elements allow substantial logic integration on a single device, reducing the need for multi‑chip solutions.
- Meaningful embedded memory: Approximately 2.72 Mbits of on‑chip RAM supports buffering, state machines, and small data caches close to logic.
- Extensive I/O mix: 218 I/Os provide flexibility to connect multiple peripherals, clocks, and high‑speed lanes without external multiplexing.
- Compact assembly: 484‑FCBGA (19×19) surface‑mount package balances board footprint and routing density for compact systems.
- Documented high‑speed interfaces: Datasheet coverage of differential I/O standards, PLLs, and hardened PCIe characteristics simplifies high‑speed interface design and validation.
- Commercial readiness and compliance: Commercial operating range (0 °C to 85 °C) and RoHS compliance support mainstream electronic product requirements.
Why Choose LAV-AT-G50-3LBG484C?
The LAV-AT-G50-3LBG484C positions itself as a high-density, commercially rated FPGA option within the Avant™ platform, delivering substantial logic capacity, on‑chip RAM, and a large I/O complement in a compact FCBGA package. Its documented platform-level electrical and timing characteristics—including programmable I/O termination, differential I/O modes, PLL/oscillator behavior, and hardened PCIe information—help engineers evaluate and integrate the device into complex designs with greater confidence.
This part is suitable for teams building feature-rich commercial products that require significant programmable logic, meaningful embedded memory, and extensive I/O capability, while adhering to RoHS requirements and operating within a commercial temperature range.
Request a quote or submit a pricing request for LAV-AT-G50-3LBG484C today to evaluate its fit for your next FPGA-based design.