LAV-AT-G50-3LFG676I
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,030 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-G50-3LFG676I – Avant™-G FPGA, 676‑FCBGA, Industrial
The LAV-AT-G50-3LFG676I is an Avant™-G Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation built on the Avant platform architecture. It integrates a high-count programmable fabric with dedicated memory and DSP resources and a flexible clocking and I/O subsystem described in the platform data sheet.
Designed for industrial applications, this device combines 409,000 logic elements, approximately 2.72 Mbits of embedded memory, and 298 I/O pins in a 676‑FCBGA (27×27) surface-mount package, offering a compact solution for high-density programmable designs that require extended operating temperature range and RoHS compliance.
Key Features
- Programmable Fabric — 409,000 logic elements provide substantial gate-equivalent capacity for complex logic, control and data-path implementations.
- Embedded Memory (sysMEM) — Approximately 2.72 Mbits of on-chip RAM with support for memory cascading, single/dual/pseudo-dual port modes and FIFO configurations per the Avant platform memory architecture.
- DSP Capability (sysDSP) — Dedicated DSP resources are included in the platform architecture to support arithmetic and signal-processing functions.
- High I/O Count — 298 I/O pins with programmable I/O cell features and a banking scheme to support a range of interface requirements.
- Advanced Clocking — On-chip oscillator, PLLs, global and regional clock networks, edge and PHY clocks, and dynamic clock control options described in the platform overview allow flexible clock distribution and timing strategies.
- High‑speed SerDes and PHY — SERDES/PMA blocks and multi-protocol PCS/PHY integration are supported as part of the Avant platform for serial link implementation.
- Device Configuration and Reliability — Enhanced configuration options, JTAG support, SEU handling and trace ID capabilities are part of the documented platform feature set.
- Package and Environmental — 676‑FCBGA (27×27) surface-mount package; industrial grade operation from −40°C to 100°C; RoHS compliant.
- Power Supply — Documented operating voltage supply at 820 mV.
Typical Applications
- System Prototyping and Development — Leverage the large logic element count and flexible clocking to implement complex prototypes and iterate system designs on a single device.
- Memory‑Intensive Data Processing — Use the approximately 2.72 Mbits of embedded memory and sysMEM features (FIFO, dual-port modes) for buffering, streaming and packet processing tasks.
- High‑Density I/O Bridging — 298 programmable I/Os and configurable PICs support multi-protocol I/O requirements for protocol bridging and board-level integration.
- Industrial Control and Automation — Industrial temperature rating (−40°C to 100°C) and a compact FCBGA package suit applications requiring ruggedized, compact programmable logic solutions.
Unique Advantages
- Large Logic Capacity: 409,000 logic elements reduce the need for multiple devices, enabling more functionality within a single FPGA.
- Integrated Memory and DSP: Approximately 2.72 Mbits of embedded RAM plus sysDSP resources simplify designs that combine control logic with signal processing and buffering.
- Flexible Clocking and Timing: On-chip oscillator, PLLs and multiple clock domains provide designers with the control needed for complex timing architectures.
- High I/O Density: 298 I/Os and programmable I/O cell features support diverse interface needs without extensive external logic.
- Industrial‑Grade Reliability: −40°C to 100°C operating range and RoHS compliance meet common industrial deployment requirements.
- Compact Packaging: 676‑FCBGA (27×27) surface-mount package delivers high integration density for space-constrained designs.
Why Choose LAV-AT-G50-3LFG676I?
The LAV-AT-G50-3LFG676I positions itself as a high-capacity, industrial-grade FPGA in the Avant platform family, combining large programmable fabric, embedded memory, DSP resources and broad clocking and I/O capabilities. It is suited for customers seeking a single-device solution for complex logic, data buffering and interface consolidation in industrial environments.
Supported by the documented Avant platform architecture, this device provides a pathway for scalable designs that require substantial on-chip resources, configurable I/O and industry-grade operating range, while maintaining compliance with RoHS requirements.
Request a quote or submit an inquiry to purchase the LAV-AT-G50-3LFG676I and evaluate how its Avant platform features align with your design requirements.