LAV-AT-G50-3LFG676C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 2723840 409000 676-BBGA, FCBGA |
|---|---|
| Quantity | 684 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 409000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2723840 |
Overview of LAV-AT-G50-3LFG676C – Avant™-G FPGA, 409,000 Logic Elements, 676-FCBGA
The LAV-AT-G50-3LFG676C is an Avant™-G Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It provides a high-density programmable fabric with a large I/O count and embedded memory, packaged in a 676-ball FCBGA (27 × 27) surface-mount package.
With approximately 409,000 logic elements, approximately 2.7 Mbits of on-chip RAM, and support for advanced clocking and I/O features described in the Avant platform documentation, this device targets designs that require substantial configurable logic, abundant I/O, and compact board-level integration within commercial temperature ranges.
Key Features
- Core Capacity Approximately 409,000 logic elements for complex programmable logic implementations.
- Embedded Memory Approximately 2.7 Mbits of on-chip RAM providing storage for buffers, FIFOs and local data structures.
- High I/O Count 298 user I/Os to support wide connectivity and multiple peripheral interfaces.
- Advanced Clocking On-chip oscillator, PLL, and multi-level clock resources (global, regional, edge clocks) as described in the Avant platform architecture for flexible clock distribution and domain control.
- Memory and DSP Blocks Device architecture includes dedicated sysMEM and sysDSP resources and features such as single/dual-pseudo port modes, FIFO support, and DSP-oriented building blocks referenced in the Avant platform documentation.
- High-speed Interface Support Architectural support for SERDES/PMA and multi-protocol PHY integration is included in the Avant platform overview.
- Configuration and Debug Enhanced configuration options and standard JTAG support are provided for device programming and test.
- Package & Mounting 676-FCBGA (27 × 27) package, surface-mount mounting type for compact board integration.
- Power Device core voltage specified at 0.820 V.
- Commercial Grade Temperature Operating temperature range from 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-performance data processing — Leverages the large logic capacity and embedded RAM for compute- and memory-intensive FPGA functions.
- High-density I/O systems — Supports designs requiring many peripheral connections or wide parallel interfaces with 298 I/Os.
- Interface and protocol bridging — Architecture support for SERDES and multi-protocol PHY enables implementation of custom high-speed interfaces and protocol conversion.
- Embedded memory and buffering — On-chip sysMEM features and FIFO modes support packet buffering, streaming data paths, and memory-coupled accelerators.
Unique Advantages
- High logic capacity: Approximately 409k logic elements allow implementation of large-scale, multi-module designs on a single device.
- Substantial embedded memory: Approximately 2.7 Mbits of on-chip RAM reduces external memory dependency for many buffering and local storage needs.
- Extensive I/O: 298 I/Os provide flexibility for complex board-level architectures and multiple peripheral interfaces.
- Comprehensive clocking options: Integrated oscillator, PLLs, and hierarchical clock domains enable precise timing architectures and domain separation.
- Compact, surface-mount FCBGA package: 676-ball (27 × 27) FCBGA provides dense integration for space-constrained designs.
- Commercial-grade qualification and RoHS compliance: Designed for 0 °C to 85 °C operation and RoHS-compliant material standards for general commercial applications.
Why Choose LAV-AT-G50-3LFG676C?
The LAV-AT-G50-3LFG676C positions itself as a high-capacity, commercially graded FPGA offering substantial on-chip logic and memory resources together with a large I/O complement and advanced platform features documented in the Avant platform overview. Its combination of logic density, embedded RAM, clocking architecture, and interface capabilities makes it suitable for designers implementing complex programmable systems that require integrated memory, DSP, and high-density I/O in a compact BGA footprint.
This device is suited to engineering teams seeking scalable FPGA capacity within a commercial temperature range, with the ability to leverage the Avant platform’s memory, clocking, and high-speed interface features to accelerate development and reduce external component count.
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