LAV-AT-G70-1LFG1156I

The LAV-AT-G70-1LFG1156I is an Avant™-G Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded systems. Built on the Lattice Avant platform, this device integrates a high density of programmable logic, on-chip memory, and a broad set of I/O and system-level features suitable for complex interface, memory and signal-processing tasks.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, 554 I/O pins and support for advanced platform capabilities (clocking, DDRPHY, SERDES/PCS and configuration options), this FPGA targets applications requiring significant integration and industrial temperature operation from –40 °C to 100 °C.

Key Features

• Core Logic 637,000 logic elements provide large-scale programmable resources for complex digital designs and custom acceleration.
• Embedded Memory Approximately 4.24 Mbits of on-chip RAM (sysMEM) with support for single, dual and pseudo-dual port modes, FIFO operation and memory cascading.
• I/O Density and Programmability 554 I/O pins and programmable I/O cell (PIC) features including input, output and tri-state register blocks for flexible interfacing and I/O standard support.
• Clocking and Timing Multi-level clock architecture including on-chip oscillator, PLLs, global/regional/edge clocks, dynamic clock select/control and DLL delay elements for robust timing control.
• High-Speed Interfaces Series-level support for SERDES, PCS blocks, Multi-Protocol PCS (MPPCS) and Multi-Protocol PHY (MPPHY) integration for high-speed serial links and protocol flexibility.
• DDR Memory Support DDRPHY and DQS grouping features to support DDR memory interfaces and optimized memory subsystem integration.
• System and Configuration Enhanced configuration options, JTAG support and SEU handling capabilities as described in the Avant platform documentation.
• Package & Mounting 1156-FCBGA (35×35) package (1156-BBGA, FCBGA) designed for surface-mount assembly.
• Industrial Grade & Environmental Specified operating range from –40 °C to 100 °C and RoHS compliant.
• Supply Voltage Device specification indicates an 820 mV supply operating point.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature rating, high I/O count and large logic capacity for motor control, PLC extensions and complex sensor aggregation.
• High-Speed Interface Bridging — Implement protocol bridging and serialization/deserialization using the on-chip SERDES/PCS and multi-protocol PHY integration.
• Memory Subsystem and Controllers — Deploy DDRPHY and sysMEM features for custom memory controllers, buffering and high-bandwidth data paths.
• Signal Processing and Acceleration — Leverage the sizable logic fabric and sysDSP resources for embedded DSP, filtering and deterministic processing functions.

Unique Advantages

• High-density programmable fabric: 637,000 logic elements enable implementation of large-scale, integrated functions and custom accelerators on a single device.
• Integrated memory flexibility: Approximately 4.24 Mbits of embedded RAM with multiple port and FIFO modes simplifies system memory design and reduces external memory dependency.
• Extensive I/O and packaging: 554 I/Os in a 1156-FCBGA (35×35) surface-mount package provide broad connectivity while maintaining compact board footprint.
• Industrial temperature range: Rated for –40 °C to 100 °C to meet the needs of industrial and other temperature-demanding environments.
• Advanced platform features: On-chip oscillator, PLLs, dynamic clocking, DDRPHY, SERDES/PCS and configuration options from the Avant platform enable system-level integration and design flexibility.
• Regulatory and supply considerations: RoHS compliant construction supports environmentally conscious designs.

Why Choose LAV-AT-G70-1LFG1156I?

The LAV-AT-G70-1LFG1156I combines a large programmable fabric, substantial on-chip memory and a high pin count in an industrial-grade FCBGA package, making it a strong candidate for designs that require integration of complex logic, high-bandwidth memory interfaces and versatile I/O. Its Avant platform capabilities—clocking infrastructure, SERDES/PHY support and configuration features—help accelerate system design and consolidate functions that might otherwise require multiple components.

This device is suited to engineering teams developing industrial automation, high-speed interface bridges, memory controllers and embedded signal-processing applications where temperature robustness, I/O density and integrated platform features deliver long-term value, scalability and reduced system BOM complexity.

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