LAV-AT-G70-1LFG676I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 298 4239360 637000 676-BBGA, FCBGA

Quantity 684 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O298Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-G70-1LFG676I – Avant™-G Field Programmable Gate Array (FPGA) IC

The LAV-AT-G70-1LFG676I is an Avant™-G FPGA device from Lattice Semiconductor designed as a high-density programmable logic solution. The device integrates a large programmable fabric, embedded memory, and a broad set of system-level features from the Avant platform architecture.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 298 I/O pins in a 676-FCBGA (27×27) package, this industrial-grade FPGA is intended for designs that require dense logic, extensive on-chip RAM, and flexible I/O and interface support within an industrial operating range.

Key Features

  • Core Programmable Fabric 637,000 logic elements provide a large, configurable logic resource for complex digital functions and custom accelerators.
  • Embedded Memory (sysMEM) Approximately 4.24 Mbits of on-chip RAM with support for single, dual and pseudo-dual port modes, FIFO modes, memory cascading, and RAM initialization/ROM operation as described in the Avant platform documentation.
  • High I/O Count and Programmable I/O 298 I/O pins supported with the Avant programmable I/O cell (PIC) features and sysI/O banking scheme for flexible I/O standard support and input/output register options.
  • Clocking and Timing On-chip oscillator, PLL, global and regional clock resources, edge and PHY clocks, clock synchronizers/dividers, dynamic clock select/control and DLL delay capabilities as outlined in the Avant platform overview.
  • DSP and High‑Performance Blocks (sysDSP) Integrated sysDSP block support for arithmetic and signal-processing workloads, as covered in the platform documentation.
  • Memory Interface and DDR Support DDRPHY support and DQS grouping for DDR memory interfaces are included in the platform feature set.
  • SERDES and Multi‑Protocol PHY/PCS SERDES/PMA blocks, Multi‑Protocol PCS (MPPCS), and MPPHY integration are present in the Avant platform for high-speed serial connectivity.
  • Device Configuration and System Reliability Enhanced configuration options, JTAG support, Single Event Upset (SEU) handling, and trace ID features are described in the Avant platform documentation.
  • Package and Environmental 676‑FBGA / 676‑BBGA family packaging (676‑FCBGA, 27×27) with RoHS compliance and industrial-grade temperature rating.
  • Power Supply Device voltage supply specified at 820 mV.
  • Operating Range Industrial operating temperature range from −40 °C to 100 °C.

Typical Applications

  • High‑density programmable logic — Implement complex custom logic, protocol bridges, and offload engines that require large numbers of logic elements and embedded memory.
  • Memory interface and buffering — Devices with sysMEM and DDRPHY support are suitable for designs with on‑chip buffering, FIFOs, and DDR memory bridging.
  • High‑speed serial connectivity — SERDES, PCS and multi‑protocol PHY capabilities address designs that require serial links and protocol adaptation.
  • Industrial control and automation — Industrial temperature grade and flexible I/O make the device applicable to rugged embedded control, signal processing, and interface aggregation tasks.

Unique Advantages

  • Large programmable fabric: 637,000 logic elements enable integration of complex logic and multi‑function designs on a single device, reducing external component count.
  • Substantial on‑chip memory: Approximately 4.24 Mbits of embedded RAM with FIFO and multi‑port modes simplifies buffering and state storage for high‑throughput systems.
  • Extensive I/O and packaging: 298 I/O pins in a 676‑FCBGA (27×27) package provide dense connectivity for interfaces, sensors, and external memory.
  • Comprehensive clocking and timing: On‑chip oscillator, PLLs, global/regional clocks, dynamic clock control and DLL delay support complex timing architectures and multi‑domain designs.
  • Protocol and PHY support: SERDES, MPPCS and MPPHY integration enable implementations of high‑speed serial links and multi‑protocol physical layers.
  • Industrial reliability: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.

Why Choose LAV-AT-G70-1LFG676I?

The LAV-AT-G70-1LFG676I combines a high‑capacity logic fabric, sizeable embedded memory, broad I/O, and Avant platform system features to address demanding, high‑density FPGA requirements. Its platform-level capabilities—clocking resources, DDRPHY, SERDES/PCS, sysDSP and configurable sysMEM—provide an integrated foundation for advanced embedded designs.

This device is suited for teams and projects that require a scalable, industrial‑grade FPGA with comprehensive platform features for memory interfaces, serial connectivity, and flexible clocking—all packaged in a 676‑FCBGA footprint and supported by the Avant platform documentation.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the LAV-AT-G70-1LFG676I.

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