LAV-AT-G70-2LFG1156C

The LAV-AT-G70-2LFG1156C is an Avant™-G FPGA in a 1156-ball FCBGA package, offering a high logic capacity and broad I/O for complex embedded designs. Built on the Lattice Avant platform architecture, the device combines programmable functional unit blocks, rich clocking and memory subsystems, and multi-protocol PHY/serdes capability as described in the platform datasheet.

Targeted for commercial-grade applications, this FPGA provides approximately 637,000 logic elements, around 4.24 Mbits of embedded memory, and 554 I/O pins in a surface-mount 1156-FCBGA (35×35) package. It is RoHS compliant and specified for operation from 0 °C to 85 °C with a 820 mV supply.

Key Features

• Logic Capacity — Approximately 637,000 logic elements (cells) for large-scale programmable logic integration.
• Embedded Memory — Approximately 4.24 Mbits of total on-chip RAM supporting single, dual and pseudo-dual port modes, FIFO operation, memory cascading, and RAM initialization/ROM operation as described in the platform memory architecture.
• I/O and Packaging — 554 I/O pins in a 1156-ball FCBGA package (35 × 35 mm), surface-mount mounting for compact board-level integration. Commercial-grade temperature range: 0 °C to 85 °C.
• Clocking and Timing — Comprehensive clock architecture including on-chip oscillator, PLL, global and regional clocks, edge clocks, PHYCLK, clock synchronizers/dividers, dynamic clock select and dynamic clock control to support flexible timing domains.
• Programmable Functional Units — Platform architecture includes Programmable Functional Unit (PFU) blocks and slice-based logic structures for configurable datapaths and logic modes of operation.
• sysDSP and sysMEM — Dedicated DSP and memory subsystems (sysDSP, sysMEM) described in the data sheet to accelerate arithmetic and memory-intensive functions within the device fabric.
• Programmable I/O Cell (PIC) — Rich programmable I/O cell capabilities including input, output and tri-state register blocks; platform documentation lists supported sysI/O standards and banking schemes.
• DDR and PHY Support — DDR memory support with DDRPHY and DQS grouping mechanisms for external memory interfaces, as described in the platform documentation.
• SERDES and Multi‑Protocol PHY — SERDES/PMA blocks and multi-protocol PCS (MPPCS) / Multi-Protocol PHY (MPPHY) integration are part of the platform feature set for high-speed serial interfaces.
• Device Configuration and Reliability — Enhanced configuration options, JTAG support and Single Event Upset (SEU) handling are included in the platform overview to aid device bring-up and reliability management.
• Compliance — RoHS compliant; commercial grade device classification.
• Supply — Specified supply voltage listed as 820 mV.

Typical Applications

• Communications and Networking — Multi‑protocol PHY and SERDES/PMA blocks make the device suitable for protocol bridging, packet processing, and high‑speed I/O aggregation.
• Memory Interface and Controllers — DDRPHY support and flexible sysMEM modes enable implementation of memory controllers, buffering, and FIFO management for data‑intensive systems.
• High‑I/O System Integration — With 554 I/O pins and programmable I/O cells, the device supports dense sensor, peripheral and board‑level interfaces in embedded platforms.
• DSP‑Accelerated Embedded Systems — sysDSP and large logic/memory resources support signal processing pipelines and custom hardware accelerators.

Unique Advantages

• High Logic Density: ~637,000 logic elements enable consolidation of large logic functions into a single FPGA, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 4.24 Mbits of embedded RAM with flexible modes (single/dual/pseudo-dual, FIFO, cascading) simplifies buffer and state storage designs.
• Flexible Clocking: Extensive clocking features (PLL, on‑chip oscillator, global/regional/edge clocks) provide designers with the means to manage multiple timing domains without external clocking complexity.
• Broad I/O Capability: 554 I/Os in a compact 1156-FCBGA package enable high-density peripheral and bus connectivity for complex systems.
• Integrated High‑Speed Interfaces: SERDES, MPPCS and MPPHY building blocks support multi‑protocol serial links and high-throughput channels directly in the fabric.
• Commercial‑Grade, RoHS‑Compliant: Commercial temperature rating and RoHS compliance support mainstream product development and regulatory needs.

Why Choose LAV-AT-G70-2LFG1156C?

The LAV-AT-G70-2LFG1156C positions designers to integrate high logic capacity, substantial embedded memory, and a large I/O complement within a single, surface-mount 1156-FCBGA device. The Avant platform architecture documented in the datasheet supplies programmable functional blocks, advanced clocking, embedded DSP and memory subsystems, and multi‑protocol PHY/SERDES capabilities that address demanding embedded and communications-oriented designs.

This commercial‑grade FPGA is suitable for teams building complex data paths, high‑bandwidth interfaces, and custom hardware accelerators who need a well‑documented architecture with configurable I/O, memory modes, and device configuration options. Its combination of logic, memory, and interface features provides a scalable foundation for mid-to-large FPGA designs.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for LAV-AT-G70-2LFG1156C. Our team can provide part availability details and support for your procurement and design planning.