LAV-AT-G70-2LFG676C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 298 4239360 637000 676-BBGA, FCBGA |
|---|---|
| Quantity | 1,189 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 298 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-G70-2LFG676C – Avant™-G Field Programmable Gate Array (FPGA) IC
The LAV-AT-G70-2LFG676C is an Avant™-G FPGA in a 676-FCBGA (27×27 mm) package delivering 637,000 logic elements and approximately 4.24 Mbits of embedded RAM. It integrates a high I/O count (298 pins) and platform-level architecture details found in the Avant family, including programmable functional units, on-chip memory, DSP resources and multi-protocol I/O and SERDES capabilities.
Designed for commercial-grade systems, this device targets high-density digital integration and I/O-intensive designs where significant logic capacity, embedded memory and flexible clocking and interface options are required.
Key Features
- Core Logic Capacity — 637,000 logic elements to support large-scale programmable logic and complex SoC-style implementations.
- Embedded Memory — Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) with sysMEM features including single, dual and pseudo-dual port modes, cascading and FIFO operation detailed in the Avant platform architecture.
- High I/O Count — 298 I/O pins suitable for dense external connectivity and multi-bank programmable I/O configurations.
- Package and Mounting — 676-FCBGA (27×27 mm) package, surface mount, offering a compact high-pin-count package for system board designs.
- Clocking and Timing — Comprehensive clocking architecture described for the Avant platform including on-chip oscillator, PLLs, global and regional clocks, edge clocks and dynamic clock control options.
- Memory Interface and PHY — DDR memory support and DDRPHY functionality with DQS grouping capabilities for external memory interfacing.
- DSP and Processing Blocks — sysDSP resources included in the Avant platform for implementing signal processing and arithmetic-heavy functions.
- SERDES and High-Speed Interfaces — SERDES and PCS building blocks and multi-protocol PHY integration as described in the Avant platform architecture for high-speed serial links.
- Device Configuration and Test — Enhanced configuration options including JTAG and SEU handling mechanisms referenced in the platform documentation.
- Electrical and Environmental — Voltage supply listed as 820 mV; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High-density programmable logic systems — Use the 637,000 logic elements to consolidate complex digital functions into a single FPGA fabric.
- Memory-rich designs — Leverage approximately 4.24 Mbits of embedded RAM and sysMEM features for buffer, FIFO and embedded storage needs.
- I/O-intensive platforms — Deploy in systems requiring a large number of external interfaces using the device’s 298 I/O pins and multi-bank programmable I/O cells.
- High-speed serial and PHY integration — Implement SERDES/PCS and DDRPHY-connected interfaces for external memory and serial link connectivity.
Unique Advantages
- Substantial logic density: 637,000 logic elements provide headroom to implement large FPGA designs without partitioning across multiple devices.
- Integrated on-chip memory: Approximately 4.24 Mbits of RAM with versatile sysMEM modes reduces reliance on external memory for many buffering and storage functions.
- High I/O flexibility: 298 I/Os and the Avant programmable I/O cell architecture enable adaptable interfacing across standards and banks.
- Platform-level clocking and timing: Built-in oscillator, PLL and multiple clock domain features support complex timing architectures and dynamic clock control.
- Advanced interface support: SERDES, PCS and DDRPHY elements documented for the Avant platform facilitate high-speed serial links and external memory integration.
- Commercial-grade, RoHS compliant: Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements for regulatory alignment.
Why Choose LAV-AT-G70-2LFG676C?
The LAV-AT-G70-2LFG676C combines high logic capacity, substantial on-chip memory and a broad set of platform capabilities from the Avant family to simplify system design where density, memory and I/O flexibility matter. Its package and pin count support complex board-level integration while the documented platform features—clocking, DSP, memory and SERDES/PHY—provide the architectural building blocks needed for demanding programmable designs.
This device is suited to teams building commercial-grade products that require a single-chip solution for large programmable logic workloads, rich embedded memory usage and a wide range of I/O and high-speed interface requirements, backed by platform-level documentation for design integration.
Request a quote or submit an order inquiry to get pricing and availability for LAV-AT-G70-2LFG676C and start integrating this Avant™-G FPGA into your next design.

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