LAV-AT-G70-3CSG841C

The LAV-AT-G70-3CSG841C is an Avant™-G Field Programmable Gate Array (FPGA) device offered in an 841-ball FCCSP/BGA package. It provides 637,000 logic elements and approximately 4.24 Mbits of embedded RAM, with 303 available I/O pins for complex, high-density designs. This commercial-grade, surface-mount FPGA operates from a supply voltage of 820 mV and across an operating temperature range of 0 °C to 85 °C, and is RoHS compliant.

Key Features

• Core Logic — 637,000 logic elements for implementing substantial programmable logic and custom digital functions.
• Embedded Memory — Approximately 4.24 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage.
• I/O Density — 303 I/O pins to enable multiple high-pin-count interfaces and parallel signal routing.
• Power — Single supply voltage specified at 820 mV, suitable for designs targeting this supply domain.
• Package & Mounting — 841-BGA (841-FCCSP, 15 × 13 mm) surface-mount package for compact board layouts and high I/O density.
• Operating Range & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density I/O interfacing — Leverages 303 I/Os for designs that require many external signals and parallel interfaces.
• Custom digital logic — Use the 637,000 logic elements to implement complex, application-specific processing and control logic.
• On-chip buffering and data handling — Approximately 4.24 Mbits of embedded RAM supports local buffering, temporary storage, and FIFO implementations.
• Compact, surface-mount systems — The 841-FCCSP package enables small-form-factor PCB designs while maintaining high I/O count.

Unique Advantages

• High logic capacity: 637,000 logic elements provide the headroom for complex logic implementations without external programmable devices.
• Integrated memory resources: Approximately 4.24 Mbits of on-chip RAM reduce the need for external memory in many buffering and temporary-storage use cases.
• Substantial I/O count: 303 I/Os simplify board-level routing for multi-interface and parallel-signal designs.
• Compact package: 841-FCCSP (15 × 13 mm) delivers a small footprint for space-constrained applications while preserving connectivity.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements in many supply chains.
• Commercial operating range: Rated for 0 °C to 85 °C to match standard commercial deployments and system-level thermal designs.

Why Choose LAV-AT-G70-3CSG841C?

The LAV-AT-G70-3CSG841C Avant™-G FPGA delivers a combination of high logic density, substantial on-chip memory, and a large number of I/Os in a compact 841-ball FCCSP/BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of standard electronics products where programmable, high-density digital logic is required.

This device is well suited for designers who need scalable programmable logic capacity with integrated memory and significant I/O resources, enabling reduced external component count and streamlined board design.

Request a quote or submit an RFQ to obtain pricing and availability for the LAV-AT-G70-3CSG841C Avant™-G FPGA. Our team will provide the information needed to evaluate this device for your next design.