LAV-AT-G70-3LFG676C

The LAV-AT-G70-3LFG676C is a commercial-grade Avant™-G FPGA from Lattice Semiconductor, delivering a high logic element count and substantial embedded memory in a 676-FCBGA package. It implements the Lattice Avant platform architecture and provides platform-level features such as advanced clocking, on-chip memory and DSP resources, programmable I/O, SERDES/PCS blocks, and DDR PHY support as described in the Avant platform overview.

With 637,000 logic elements, approximately 4.24 Mbits of embedded memory, and 298 I/Os, this device targets designs that require high logic density, significant on-chip RAM, and broad I/O connectivity in a surface-mount 27×27 676-FCBGA package.

Key Features

• Core Logic  637,000 logic elements to implement complex programmable logic and custom datapaths.
• Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) with sysMEM capabilities including single, dual and pseudo‑dual port modes, FIFO modes, memory initialization and cascading (platform-level features).
• I/O Capacity  298 I/O pins to support extensive external interfacing and parallel connectivity.
• Package & Mounting  676‑BBGA / 676‑FCBGA package, supplier device package 676‑FCBGA (27×27), surface mount mounting type.
• Power Supply  Voltage supply specified at 820 mV.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Avant Platform Architecture  Platform-level architecture includes programmable functional unit blocks, routing, and region/global clock structures described in the Avant overview.
• Clocking & Timing  Platform-level clock resources include on-chip oscillator, PLL, global and regional clock domains, edge and PHY clocks, and dynamic clock control elements.
• Programmable I/O & I/O Cells  Programmable I/O (PIO) and programmable I/O cell (PIC) capabilities and an I/O banking scheme to support a range of signaling requirements (platform-level features).
• Memory & DSP Support  sysDSP blocks, sysMEM blocks, and memory features for embedded data processing and buffering (platform-level features).
• High-Speed Interfaces  SERDES/PMA blocks, Multi‑Protocol PCS and Multi‑Protocol PHY integration plus DDRPHY support for external memory interfaces (platform-level features).
• Device Configuration & Reliability  Enhanced configuration options, JTAG support, and SEU handling mechanisms are included at the platform level.
• Compliance  RoHS compliant.

Typical Applications

• Communication and Networking  Use the device’s high logic count, SERDES/PCS blocks and extensive I/O to implement packet forwarding, protocol bridging, or custom PHY interfaces.
• High‑Density Compute Modules  Implement complex datapaths and hardware accelerators leveraging 637,000 logic elements and sysDSP/sysMEM resources.
• Memory Interface Designs  Leverage the device’s DDRPHY support and sysMEM features for buffering, FIFO implementations and external memory controllers.
• Programmable I/O Aggregation  Aggregate diverse peripherals and sensor interfaces using 298 I/Os and programmable I/O cell capabilities.

Unique Advantages

• High Logic Density:  637,000 logic elements provide capacity for large programmable designs and complex custom logic integration.
• Significant On‑Chip Memory:  Approximately 4.24 Mbits of embedded RAM with sysMEM features enables local buffering, FIFOs and memory cascading without external RAM in many use cases.
• Broad I/O Footprint:  298 I/Os facilitate connections to multiple peripherals, parallel buses and high‑pin-count interfacing needs.
• Platform-Level Interfaces:  Integrated platform capabilities for clocking, DDR PHY, SERDES and PCS reduce system-level integration effort.
• Compact Surface-Mount Packaging:  676‑FCBGA (27×27) package provides a high-pin-count solution in a compact footprint for board-level density.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C operation for commercial applications and environments.

Why Choose LAV-AT-G70-3LFG676C?

The LAV-AT-G70-3LFG676C positions itself as a high-capacity, platform-enabled FPGA for commercial designs that require large programmable logic resources, substantial embedded memory, and a wide complement of I/O. Its implementation on the Lattice Avant platform brings platform-level clocking, memory, DSP and high-speed interface capabilities to system designs.

This device is well suited for customers building complex compute, memory-interface, and high‑I/O systems who need scalable logic capacity and integrated platform features in a 676‑FCBGA surface-mount package. RoHS compliance and commercial grade operation support standard procurement and deployment models.

Request a quote or submit a pricing inquiry to discuss availability, lead times, and volume pricing for LAV-AT-G70-3LFG676C.