LAV-AT-G70-3LFG1156C
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 554 4239360 637000 1156-BBGA, FCBGA |
|---|---|
| Quantity | 118 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 554 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-G70-3LFG1156C – Avant™-G FPGA, 1156-FCBGA (35×35)
The LAV-AT-G70-3LFG1156C is an Avant™-G Field Programmable Gate Array (FPGA) in a 1156-ball FCBGA package. It leverages the Avant platform architecture to provide a programmable fabric with dedicated memory, DSP, clocking and I/O resources suitable for commercial embedded applications.
With 637,000 logic elements and approximately 4.24 Mbits of embedded memory, this device targets designs that require high logic capacity, significant on-chip RAM, and a large I/O complement while operating within a commercial temperature range.
Key Features
- Core Architecture — Avant platform The device is based on the Lattice Avant architecture with programmable functional unit (PFU) blocks and slice-based logic resources as described in the platform overview.
- Logic Capacity 637,000 logic elements provide substantial programmable logic resources for complex digital designs.
- Embedded Memory Approximately 4.24 Mbits of on-chip RAM (4,239,360 bits) with sysMEM capabilities including single/dual/pseudo-dual port modes and FIFO support as documented in the platform overview.
- I/O Resources 554 I/O pins supported by the platform’s programmable I/O cells (PIC) and banking scheme for flexible signaling and interface integration.
- Clocking and Timing Platform-level clocking features include an on-chip oscillator, PLLs, global and regional clocks, dynamic clock select/control and DLL delay functionality to support complex timing domains.
- High-speed and Peripheral Support The Avant platform overview documents SERDES/PMA blocks, Multi-Protocol PCS and Multi-Protocol PHY integration, as well as DDR memory PHY support for demanding interface requirements.
- Package and Mounting 1156-FCBGA package (35×35 mm) designed for surface-mount assembly.
- Power and Temperature Voltage supply listed at 820 mV and an operating temperature range of 0 °C to 85 °C; device grade is Commercial.
- System Features Platform-level features include sysDSP blocks, configurable routing, device configuration options including JTAG, SEU handling, and trace ID capabilities described in the Avant overview.
- Compliance RoHS compliant.
Typical Applications
- Networking and Communications Utilizes documented SERDES, PCS and PHY integration for protocols and high-speed serial connectivity within commercial communications equipment.
- Memory Subsystems and Controllers Leverages DDR memory support and sysMEM features for implementing on-board memory controllers and high-bandwidth buffering.
- Signal Processing and DSP Acceleration Employs sysDSP blocks and large logic capacity to implement custom DSP kernels and hardware accelerators.
- Custom I/O and Peripheral Bridging High I/O count and programmable I/O cells allow flexible interfacing, protocol bridging, and peripheral integration in embedded systems.
Unique Advantages
- High Logic Density: 637,000 logic elements enable complex designs without immediate migration to a larger device.
- Significant Embedded Memory: Approximately 4.24 Mbits of on-chip RAM with sysMEM features for versatile memory configurations and FIFO support.
- Large I/O Complement: 554 I/Os support dense connectivity and multiple external interfaces from a single device package.
- Advanced Clocking and I/O Primitives: Platform-level clocking (PLL, on-chip oscillator, dynamic clock controls) and programmable I/O cell features help manage multi-domain timing and interface requirements.
- Comprehensive Platform Features: Built-in sysDSP, DDRPHY support, SERDES/PCS integration and configuration options documented in the Avant platform overview offer a broad set of on-chip resources.
- Commercial-grade Package and Compliance: 1156-FCBGA (35×35) surface-mount package with RoHS compliance for standard commercial production environments.
Why Choose LAV-AT-G70-3LFG1156C?
The LAV-AT-G70-3LFG1156C combines a high logic element count with sizable embedded memory and a large I/O footprint in a 1156-FCBGA package. It is positioned for commercial embedded designs that require a programmable fabric with platform-level features such as advanced clocking, DDR memory support, sysDSP blocks and SERDES/PHY integration as described in the Avant platform documentation.
This device is suited to engineering teams building complex interfaces, memory subsystems, or custom accelerators who need a well-documented platform architecture and a commercially graded FPGA with RoHS compliance.
Request a quote or submit a pricing inquiry to receive availability and purchasing information for LAV-AT-G70-3LFG1156C.

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