LAV-AT-G70-2LFG1156I

LATTICE AVANT MID-RANGE GENERAL
Part Description

Avant™-G Field Programmable Gate Array (FPGA) IC 554 4239360 637000 1156-BBGA, FCBGA

Quantity 1,743 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O554Voltage820 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBsN/ANumber of Logic Elements/Cells637000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits4239360

Overview of LAV-AT-G70-2LFG1156I – Avant™-G FPGA, 637000 logic elements, 1156-FCBGA

The LAV-AT-G70-2LFG1156I is an Avant™-G Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, built on the Lattice Avant platform architecture. It combines a high logic element count with on-chip memory and extensive I/O to address industrial embedded and system applications that require flexible programmable logic, memory integration, and advanced I/O capabilities.

Designed for surface-mount deployment in a 1156-FCBGA (35×35) package, this industrial-grade device provides a defined operating range and platform-level features for clocking, memory, and I/O integration suitable for complex system designs.

Key Features

  • Core Capacity  637,000 logic elements to implement large-scale programmable logic and custom hardware acceleration.
  • Embedded Memory  Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) for LUTs, buffers, and embedded data storage.
  • I/O Density  554 I/O pins to support broad peripheral and system interfacing requirements.
  • Package & Mounting  1156-BBGA, FCBGA package in a 1156-FCBGA (35×35) supplier device package; intended for surface-mount applications.
  • Power  Voltage supply specified at 820 mV.
  • Operating Range  Industrial-grade temperature range from −40 °C to 100 °C.
  • Platform Clocking  Includes platform-level clock features such as an on-chip oscillator, PLLs, global and regional clocks, and dynamic clock controls as documented in the Avant platform overview.
  • Memory & DSP Support  sysMEM and sysDSP building blocks and memory modes documented for single/dual-port, FIFO, and cascading configurations.
  • High-Speed I/O and PHY  DDR memory support with DDRPHY architecture and SERDES/PCS building blocks referenced in platform documentation for high-speed serial and parallel interfaces.
  • Device Configuration & Reliability  Enhanced configuration options, JTAG support, and SEU handling mechanisms described in the platform overview.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control Systems  Programmable logic and abundant I/O enable custom motor control, sequencing, and sensor interfacing in harsh temperature environments.
  • Communications and Networking  High I/O count, SERDES/PCS blocks, and DDR support are suitable for protocol bridging, packet processing, and interface aggregation.
  • Embedded Vision and DSP  Large logic capacity and sysDSP/sysMEM resources support image pre-processing, acceleration, and real-time signal processing tasks.
  • System Integration  Serves as a central programmable hub for consolidating logic, memory, and multiple I/O standards in compact, surface-mount designs.

Unique Advantages

  • High logic density: 637,000 logic elements provide headroom for complex FPGA implementations and hardware acceleration without partitioning across multiple devices.
  • On-chip memory integration: Approximately 4.24 Mbits of embedded RAM reduces external memory dependence for many buffer and state storage use cases.
  • Large I/O footprint: 554 I/Os enable broad peripheral connectivity and flexible interface routing in system designs.
  • Platform-level clock and SERDES support: Integrated clocking primitives, PLLs, DDRPHY, and SERDES/PCS building blocks simplify timing and high-speed interface design.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployments in industrial and temperature-challenging environments.
  • Compact surface-mount package: 1156-FCBGA (35×35) provides a high-pin-count solution in a footprint suitable for modern PCB assembly.

Why Choose LAV-AT-G70-2LFG1156I?

The LAV-AT-G70-2LFG1156I positions itself as a high-capacity, industrial-grade FPGA option within the Lattice Avant platform, delivering large programmable logic resources, embedded memory, and significant I/O density in a single surface-mount package. It is suited for designers who need scalable programmable logic combined with platform-level clocking, memory, and high-speed I/O building blocks.

For teams targeting industrial embedded systems, communications equipment, or integrated DSP/vision solutions, this device provides a balance of integration and platform features that support robust, compact designs with platform-documented configuration and reliability mechanisms.

Request a quote or submit an RFQ to begin procurement of LAV-AT-G70-2LFG1156I and evaluate it for your next FPGA-based design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up