LAV-AT-G70-2LFG1156I
| Part Description |
Avant™-G Field Programmable Gate Array (FPGA) IC 554 4239360 637000 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,743 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1156-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 554 | Voltage | 820 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 637000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 4239360 |
Overview of LAV-AT-G70-2LFG1156I – Avant™-G FPGA, 637000 logic elements, 1156-FCBGA
The LAV-AT-G70-2LFG1156I is an Avant™-G Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, built on the Lattice Avant platform architecture. It combines a high logic element count with on-chip memory and extensive I/O to address industrial embedded and system applications that require flexible programmable logic, memory integration, and advanced I/O capabilities.
Designed for surface-mount deployment in a 1156-FCBGA (35×35) package, this industrial-grade device provides a defined operating range and platform-level features for clocking, memory, and I/O integration suitable for complex system designs.
Key Features
- Core Capacity 637,000 logic elements to implement large-scale programmable logic and custom hardware acceleration.
- Embedded Memory Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits) for LUTs, buffers, and embedded data storage.
- I/O Density 554 I/O pins to support broad peripheral and system interfacing requirements.
- Package & Mounting 1156-BBGA, FCBGA package in a 1156-FCBGA (35×35) supplier device package; intended for surface-mount applications.
- Power Voltage supply specified at 820 mV.
- Operating Range Industrial-grade temperature range from −40 °C to 100 °C.
- Platform Clocking Includes platform-level clock features such as an on-chip oscillator, PLLs, global and regional clocks, and dynamic clock controls as documented in the Avant platform overview.
- Memory & DSP Support sysMEM and sysDSP building blocks and memory modes documented for single/dual-port, FIFO, and cascading configurations.
- High-Speed I/O and PHY DDR memory support with DDRPHY architecture and SERDES/PCS building blocks referenced in platform documentation for high-speed serial and parallel interfaces.
- Device Configuration & Reliability Enhanced configuration options, JTAG support, and SEU handling mechanisms described in the platform overview.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Systems Programmable logic and abundant I/O enable custom motor control, sequencing, and sensor interfacing in harsh temperature environments.
- Communications and Networking High I/O count, SERDES/PCS blocks, and DDR support are suitable for protocol bridging, packet processing, and interface aggregation.
- Embedded Vision and DSP Large logic capacity and sysDSP/sysMEM resources support image pre-processing, acceleration, and real-time signal processing tasks.
- System Integration Serves as a central programmable hub for consolidating logic, memory, and multiple I/O standards in compact, surface-mount designs.
Unique Advantages
- High logic density: 637,000 logic elements provide headroom for complex FPGA implementations and hardware acceleration without partitioning across multiple devices.
- On-chip memory integration: Approximately 4.24 Mbits of embedded RAM reduces external memory dependence for many buffer and state storage use cases.
- Large I/O footprint: 554 I/Os enable broad peripheral connectivity and flexible interface routing in system designs.
- Platform-level clock and SERDES support: Integrated clocking primitives, PLLs, DDRPHY, and SERDES/PCS building blocks simplify timing and high-speed interface design.
- Industrial temperature rating: −40 °C to 100 °C operation supports deployments in industrial and temperature-challenging environments.
- Compact surface-mount package: 1156-FCBGA (35×35) provides a high-pin-count solution in a footprint suitable for modern PCB assembly.
Why Choose LAV-AT-G70-2LFG1156I?
The LAV-AT-G70-2LFG1156I positions itself as a high-capacity, industrial-grade FPGA option within the Lattice Avant platform, delivering large programmable logic resources, embedded memory, and significant I/O density in a single surface-mount package. It is suited for designers who need scalable programmable logic combined with platform-level clocking, memory, and high-speed I/O building blocks.
For teams targeting industrial embedded systems, communications equipment, or integrated DSP/vision solutions, this device provides a balance of integration and platform features that support robust, compact designs with platform-documented configuration and reliability mechanisms.
Request a quote or submit an RFQ to begin procurement of LAV-AT-G70-2LFG1156I and evaluate it for your next FPGA-based design.