LAV-AT-G70-1LFG676C

The LAV-AT-G70-1LFG676C is an Avant™-G field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It delivers a high-density programmable fabric with an Avant platform architecture that includes programmable functional units, routing, and a comprehensive clocking and I/O framework.

Designed for mainstream commercial applications, the device offers approximately 637,000 logic elements, roughly 4.24 Mbits of embedded memory, and 298 I/O pins in a compact 676-FCBGA (27×27) surface-mount package, providing a balance of integration, memory, and interface capability for complex logic and system-level designs.

Key Features

• Core Logic  Approximately 637,000 logic elements implemented within the Avant architecture, with programmable functional unit (PFU) blocks and slice-based resources for flexible logic implementation.
• Embedded Memory (sysMEM)  Approximately 4.24 Mbits of on-chip RAM (4,239,360 total RAM bits). sysMEM supports bus-size matching, RAM initialization/ROM operation, memory cascading, single/dual/pseudo-dual port modes and FIFO modes.
• I/O and Interfaces  298 I/O pins with a programmable I/O cell (PIC) architecture. Architecture-level support for DDR memory interfaces (DDRPHY, DQS grouping) and multi-protocol SERDES/PCS integration is provided.
• DSP Capabilities (sysDSP)  Dedicated sysDSP resources are available to accelerate arithmetic and signal-processing workloads within the programmable fabric.
• Clocking and Timing  Comprehensive clocking structure including on-chip oscillator, PLL, global/regional/edge clocks (GCLK, RCLK, ECLK), PHYCLK, clock synchronizers/dividers, dynamic clock select/control, and DLL delay (DLLDEL).
• Configuration & Reliability  Enhanced configuration options with JTAG support and Single Event Upset (SEU) handling mechanisms; includes Trace ID for device identification and debug.
• Package & Power  676-FCBGA package (27×27) in a surface-mount form factor; specified supply voltage listed as 820 mV and commercial operating temperature range 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density system logic  Implement complex glue logic, protocol bridging, and hardware-accelerated state machines using the large logic-element count and flexible PFU architecture.
• Memory interface controllers  Design DDR memory interfaces and controllers leveraging sysMEM features, DDRPHY support, and DQS grouping for multi-bit memory paths.
• High-speed serial & PHY integration  Integrate multi-protocol SERDES/PCS and PHY blocks for communication endpoints and data aggregation tasks.
• DSP and signal processing  Offload arithmetic-intensive functions to on-chip sysDSP resources for real-time processing workloads.

Unique Advantages

• High logic density:  Approximately 637,000 logic elements give designers significant room for integration of complex state machines, datapaths, and custom accelerators.
• Substantial on-chip memory:  About 4.24 Mbits of embedded RAM with flexible sysMEM modes reduces external memory dependency and simplifies data buffering and FIFO implementations.
• Wide I/O and interface support:  298 I/O and programmable PICs, together with DDR and SERDES/PCS capability, enable diverse interfacing options for system designs.
• Flexible and robust clocking:  On-chip oscillator, PLLs, multiple clock domains, and dynamic clock control accommodate mixed-frequency designs and runtime clock reconfiguration.
• Compact package:  676-FCBGA (27×27) surface-mount package provides a high-pin-count, space-efficient footprint for dense PCB layouts.
• Commercial-grade readiness:  Specified 0 °C to 85 °C operating range and RoHS compliance align the device for standard commercial applications and manufacturing flows.

Why Choose LAV-AT-G70-1LFG676C?

The LAV-AT-G70-1LFG676C combines a high-count logic fabric (≈637,000 logic elements), substantial embedded memory (≈4.24 Mbits), and 298 programmable I/O pins in a compact 676-FCBGA package, delivering a capable platform for integration-intensive designs. Its Avant architecture—featuring PFU blocks, sysMEM, sysDSP, and comprehensive clocking—supports a wide range of system-level functions without relying solely on external components.

This device is suited for designers targeting commercial applications that require high integration density, flexible memory and interface support, and predictable thermal and electrical operating conditions. The combination of on-chip resources and architecture-level features supports scalable designs and streamlined BOMs for complex FPGA-based systems.

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