LCMXO1200C-4TN100I

IC FPGA 73 I/O 100TQFP
Part Description

MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP

Quantity 1,440 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-LQFPNumber of I/O73Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs150Number of Logic Elements/Cells1200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9421

Overview of LCMXO1200C-4TN100I – MachXO Field Programmable Gate Array (FPGA) IC 73 I/Os, 9,421‑bit RAM, 100‑LQFP

The LCMXO1200C-4TN100I is a MachXO family FPGA offering non-volatile, instant-on operation in a single-chip, reconfigurable architecture. It combines approximately 1,200 logic elements with on-chip memory and programmable I/O to address glue logic, bus bridging/interfacing, power-up control and general control logic in industrial applications.

Designed for robust embedded designs, this device supports in-field reconfiguration, sleep-mode current reduction and a wide supply and temperature range, making it suitable for industrial systems that require compact, single-chip programmable logic with fast startup and flexible I/O.

Key Features

  • Core Logic  Approximately 1,200 logic elements for implementing glue logic, combinational and sequential functions.
  • Embedded Memory  Total on-chip RAM of 9,421 bits (approximately 9.4 Kbits) including embedded and distributed memory resources.
  • I/O and Package  73 I/Os available in a 100‑pin LQFP (surface mount) package (100‑TQFP, 14×14 mm footprint), enabling broad interfacing options while conserving board space.
  • Voltage and Temperature  Operates across a wide supply range of 1.71 V to 3.465 V and an industrial operating temperature range of −40 °C to 100 °C.
  • Non-Volatile Instant-On  Single-chip non-volatile architecture provides immediate startup without external configuration memory.
  • Reconfiguration & Programming  Supports in-field reconfiguration and background programming of non-volatile memory; SRAM-based logic can be reconfigured in milliseconds.
  • Low-Power Modes  Sleep mode capability allows significant static current reduction (up to 100×), supporting low-power standby scenarios.
  • Clocking  Includes one analog PLL for clock multiply/divide and phase shifting to support flexible timing architectures.
  • System-Level Support  Boundary-scan (IEEE 1149.1) and JTAG programming for in-system programming and debug; device-level programming through standard development tools.

Typical Applications

  • Glue Logic  Implement system glue logic and simple state machines to reduce external discrete components and simplify PCB design.
  • Bus Bridging & Interfacing  Bridge incompatible buses or adapt peripheral interfaces using the device’s flexible I/O and programmable logic.
  • Power-Up & System Control  Manage power sequencing, reset logic and startup control with instant-on capability for faster system availability.
  • Control Logic  Replace multiple fixed-function devices with a single reconfigurable IC for control, sequencing and signal conditioning tasks.
  • Field-Updatable Logic  Use in-field reconfiguration to update control algorithms or add features without hardware changes.

Unique Advantages

  • Non-volatile, instant startup: Instant-on single-chip configuration eliminates the need for external configuration memory and speeds system availability.
  • Compact, integrated solution: Combines ~1,200 logic elements, ~9.4 Kbits of on-chip RAM and 73 I/Os in a 100‑LQFP package to reduce BOM and board area.
  • In-field reconfigurability: Background programming and TransFR reconfiguration enable updates while the system remains in operation.
  • Low-power standby: Sleep mode allows significant static current reduction (up to 100×) for energy-conscious systems.
  • Industrial-ready operating range: Wide voltage support (1.71–3.465 V) and −40 °C to 100 °C rating suit industrial environments.
  • Development ecosystem support: Family-level tool support simplifies design entry, synthesis, place-and-route and timing verification.

Why Choose LCMXO1200C-4TN100I?

The LCMXO1200C-4TN100I positions itself as a versatile single-chip programmable logic solution for industrial embedded designs that require instant-on behavior, in-field update capability and a compact footprint. With approximately 1,200 logic elements, embedded memory and 73 I/Os in a 100‑LQFP package, it addresses common glue logic, bus interfacing and control tasks while reducing component count.

Supported by MachXO family design tools and with density-migration options within the family, this device offers design scalability and long-term flexibility for developers who need reliable, reconfigurable logic in industrial temperature and power environments.

Request a quote or submit a request for more information to evaluate the LCMXO1200C-4TN100I for your next design.

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