LCMXO1200C-4TN100I
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 73 9421 1200 100-LQFP |
|---|---|
| Quantity | 1,440 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-LQFP | Number of I/O | 73 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-4TN100I – MachXO Field Programmable Gate Array (FPGA) IC 73 I/Os, 9,421‑bit RAM, 100‑LQFP
The LCMXO1200C-4TN100I is a MachXO family FPGA offering non-volatile, instant-on operation in a single-chip, reconfigurable architecture. It combines approximately 1,200 logic elements with on-chip memory and programmable I/O to address glue logic, bus bridging/interfacing, power-up control and general control logic in industrial applications.
Designed for robust embedded designs, this device supports in-field reconfiguration, sleep-mode current reduction and a wide supply and temperature range, making it suitable for industrial systems that require compact, single-chip programmable logic with fast startup and flexible I/O.
Key Features
- Core Logic Approximately 1,200 logic elements for implementing glue logic, combinational and sequential functions.
- Embedded Memory Total on-chip RAM of 9,421 bits (approximately 9.4 Kbits) including embedded and distributed memory resources.
- I/O and Package 73 I/Os available in a 100‑pin LQFP (surface mount) package (100‑TQFP, 14×14 mm footprint), enabling broad interfacing options while conserving board space.
- Voltage and Temperature Operates across a wide supply range of 1.71 V to 3.465 V and an industrial operating temperature range of −40 °C to 100 °C.
- Non-Volatile Instant-On Single-chip non-volatile architecture provides immediate startup without external configuration memory.
- Reconfiguration & Programming Supports in-field reconfiguration and background programming of non-volatile memory; SRAM-based logic can be reconfigured in milliseconds.
- Low-Power Modes Sleep mode capability allows significant static current reduction (up to 100×), supporting low-power standby scenarios.
- Clocking Includes one analog PLL for clock multiply/divide and phase shifting to support flexible timing architectures.
- System-Level Support Boundary-scan (IEEE 1149.1) and JTAG programming for in-system programming and debug; device-level programming through standard development tools.
Typical Applications
- Glue Logic Implement system glue logic and simple state machines to reduce external discrete components and simplify PCB design.
- Bus Bridging & Interfacing Bridge incompatible buses or adapt peripheral interfaces using the device’s flexible I/O and programmable logic.
- Power-Up & System Control Manage power sequencing, reset logic and startup control with instant-on capability for faster system availability.
- Control Logic Replace multiple fixed-function devices with a single reconfigurable IC for control, sequencing and signal conditioning tasks.
- Field-Updatable Logic Use in-field reconfiguration to update control algorithms or add features without hardware changes.
Unique Advantages
- Non-volatile, instant startup: Instant-on single-chip configuration eliminates the need for external configuration memory and speeds system availability.
- Compact, integrated solution: Combines ~1,200 logic elements, ~9.4 Kbits of on-chip RAM and 73 I/Os in a 100‑LQFP package to reduce BOM and board area.
- In-field reconfigurability: Background programming and TransFR reconfiguration enable updates while the system remains in operation.
- Low-power standby: Sleep mode allows significant static current reduction (up to 100×) for energy-conscious systems.
- Industrial-ready operating range: Wide voltage support (1.71–3.465 V) and −40 °C to 100 °C rating suit industrial environments.
- Development ecosystem support: Family-level tool support simplifies design entry, synthesis, place-and-route and timing verification.
Why Choose LCMXO1200C-4TN100I?
The LCMXO1200C-4TN100I positions itself as a versatile single-chip programmable logic solution for industrial embedded designs that require instant-on behavior, in-field update capability and a compact footprint. With approximately 1,200 logic elements, embedded memory and 73 I/Os in a 100‑LQFP package, it addresses common glue logic, bus interfacing and control tasks while reducing component count.
Supported by MachXO family design tools and with density-migration options within the family, this device offers design scalability and long-term flexibility for developers who need reliable, reconfigurable logic in industrial temperature and power environments.
Request a quote or submit a request for more information to evaluate the LCMXO1200C-4TN100I for your next design.

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