LCMXO1200C-5BN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LFBGA, CSPBGA |
|---|---|
| Quantity | 955 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA, CSPBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-5BN256C – MachXO Field Programmable Gate Array (FPGA) IC
The LCMXO1200C-5BN256C is a MachXO family FPGA optimized for glue logic, bus bridging, power-up control and general control logic. It combines non-volatile configuration and FPGA-style lookup-table architecture to provide instant-on behavior and in-field reconfiguration for commercial embedded systems.
Built with approximately 1,200 logic elements and support for up to 211 I/Os in a 256-ball LFBGA package, this device targets applications where fast startup, on-chip memory and flexible I/O in a compact surface-mount package are important.
Key Features
- Core Logic Approximately 1,200 logic elements and 150 logic blocks provide programmable combinational and sequential resources for glue logic and control functions.
- Embedded Memory Approximately 9,421 bits of on-chip RAM for distributed and embedded memory needs within the device.
- I/O Density Up to 211 I/Os in supported package options, enabling broad interfacing and bus connectivity in compact board layouts.
- Non-Volatile, Instant-On Configuration Single-chip, non-volatile architecture enables rapid power-up and eliminates the need for external configuration memory.
- In-Field Reconfiguration and Background Programming Supports reconfiguring SRAM-based logic in milliseconds and background programming of non-volatile memory for firmware updates while deployed.
- Clocking Includes one analog PLL for clock multiply/divide and phase shifting to support flexible timing architectures.
- Flexible Voltage Supply Operates across a supply range of 1.71 V to 3.465 V to accommodate diverse system power rails.
- Package & Mounting Surface-mount 256-LFBGA (256-CABGA, 14×14 mm) package provides a compact footprint with robust pin count for high I/O density.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial and general-purpose embedded applications.
- System-Level Support Family-level features include JTAG programming, boundary scan and support for in-system programming standards to simplify development and production.
Typical Applications
- Glue Logic and System Control Implement board-level glue logic, reset sequencing and power-up control functions with instant-on non-volatile configuration.
- Bus Bridging and Interfacing Use the device’s abundant I/O and programmable logic to bridge disparate buses and implement protocol adapters.
- User Interface and Control Deploy for HMI control, LED/key scanning and housekeeping tasks where compact packaging and fast startup are beneficial.
- In-Field Updatable Firmware Leverage background programming and in-field reconfiguration to deliver firmware updates without removing the device from service.
Unique Advantages
- Instant-On Non-Volatile Operation: Eliminates external configuration memory and provides microsecond-level power-up readiness for faster system boot.
- Single-Chip Solution: Integrates configuration, logic and embedded memory to reduce bill-of-materials and simplify board design.
- High I/O-to-Logic Ratio: Up to 211 I/Os in a 256-ball package supports dense peripheral connectivity without increasing logic density requirements.
- Flexible Voltage Compatibility: Broad supply range (1.71 V–3.465 V) accommodates multiple system power domains.
- Compact, Surface-Mount Package: 256-LFBGA (14×14 mm) package balances footprint and I/O capacity for space-constrained designs.
- Field Programmability and Maintainability: Background programming and fast reconfiguration reduce downtime and support iterative feature updates.
Why Choose LCMXO1200C-5BN256C?
The LCMXO1200C-5BN256C positions itself as a compact, non-volatile FPGA for commercial embedded designs that require fast startup, flexible interfacing and on-chip memory. With roughly 1,200 logic elements, about 9,421 bits of embedded RAM, and up to 211 I/Os in a 256-LFBGA package, it delivers a balanced blend of integration and I/O capacity for glue logic, bus interfacing and control tasks.
This device is well suited for engineers and system designers seeking a single-chip, reconfigurable solution that simplifies BOM, supports in-field updates, and meets commercial temperature requirements. Its MachXO-family capabilities such as background programming and PLL-based clock control provide design flexibility and long-term maintainability.
Request a quote or submit an inquiry for the LCMXO1200C-5BN256C to check pricing and availability for your next design.

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