LCMXO1200C-5FTN256C
| Part Description |
MachXO Field Programmable Gate Array (FPGA) IC 211 9421 1200 256-LBGA |
|---|---|
| Quantity | 464 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 211 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 150 | Number of Logic Elements/Cells | 1200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9421 |
Overview of LCMXO1200C-5FTN256C – MachXO Field Programmable Gate Array (FPGA)
The LCMXO1200C-5FTN256C is a MachXO family FPGA offering non-volatile, instant-on programmable logic in a 256-ball BGA package. Built for glue logic, control and interfacing tasks, it delivers a compact, single-chip solution with a mix of logic, I/O and on-chip memory tailored for commercial embedded applications.
This device combines approximately 1,200 logic elements arranged across 150 logic blocks, up to 211 I/Os, and roughly 9.4 Kbits of on-chip RAM, providing a balance of density and connectivity for board-level control, protocol bridging, and user-interface tasks.
Key Features
- Non‑volatile, instant‑on architecture — Single-chip configuration with no external configuration memory required; enables rapid power-up and secure bitstream handling.
- Reconfigurability and in-field updates — Supports background programming and TransFR™ reconfiguration for in-field logic updates while the system operates.
- Logic and memory — Approximately 1,200 logic elements across 150 logic blocks and approximately 9.4 Kbits of on‑chip RAM for control and data buffering.
- I/O density and flexibility — Up to 211 I/Os with a programmable sysIO™ buffer that supports a wide range of interfaces including LVCMOS, LVTTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS.
- Clocking — Includes one sysCLOCK™ PLL for clock multiply/divide and phase shifting requirements.
- Low‑power modes — Sleep mode available to substantially reduce static current draw for power-sensitive applications.
- Commercial temperature and supply — Operates from 0 °C to 85 °C with a supply range of 1.71 V to 3.465 V.
- Package and mounting — Supplied in a 256-ball ftBGA (17 × 17 mm) / 256-LBGA package for surface-mount PCB assemblies; RoHS compliant.
Typical Applications
- Board-level glue logic — Implement signal conditioning, address decoding and control-state machines to reduce external glue components.
- Bus bridging and protocol interfacing — Bridge between different bus standards or implement protocol conversion leveraging the flexible I/O buffer.
- Power-up and system control — Handle power sequencing, reset control and supervisory tasks with instant-on, single-chip configuration.
- User interfaces and peripheral control — Drive LEDs, buttons, displays and peripheral interfaces while offloading control tasks from the main processor.
Unique Advantages
- Single-chip configuration: Eliminates the need for external configuration memory, simplifying BOM and board layout while improving security.
- Instant-on responsiveness: Fast power-up behavior enables systems to become operational in microseconds, useful for time-sensitive control functions.
- Field update capability: Background programming and TransFR™ let you update logic in the field without taking the system offline.
- High I/O-to-logic ratio: Up to 211 I/Os paired with ~1,200 logic elements enables dense interfacing and control in a compact package.
- Power management options: Sleep mode allows significant reduction in static current for lower-power system states.
- Commercial-grade robustness: Rated for 0 °C to 85 °C and RoHS compliant, suitable for a wide range of commercial embedded designs.
Why Choose LCMXO1200C-5FTN256C?
The LCMXO1200C-5FTN256C positions itself as a compact, secure and reconfigurable logic device for commercial embedded applications that require instant-on behavior and flexible I/O. With approximately 1,200 logic elements, about 9.4 Kbits of on-chip RAM, one PLL and up to 211 I/Os in a 256-ball BGA, it addresses board-level control, protocol bridging and user-interface tasks while minimizing external components.
Designed for engineers seeking a single-chip non-volatile FPGA solution, this MachXO device provides straightforward scalability within the MachXO family and supports in-field updates to extend product lifetime and adaptability. Its surface-mount packaging and RoHS compliance simplify integration into contemporary commercial designs.
Request a quote or submit an inquiry for pricing and availability of the LCMXO1200C-5FTN256C to evaluate it for your next embedded design.

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