LCMXO2-1200HC-5SG32C

The LCMXO2-1200HC-5SG32C is a MachXO2 family FPGA from Lattice Semiconductor designed for compact, low-power system control and glue-logic applications. The device provides 1,280 logic elements, approximately 65 kbits of total on-chip RAM, and 21 I/O pins in a 32‑UFQFN exposed‑pad surface‑mount package.

With a single supply range of 2.375 V to 3.465 V, commercial grade operating temperature (0 °C to 85 °C), and RoHS compliance, this part is suited for a wide range of embedded designs that require a compact, reconfigurable logic element.

Key Features

• Core Logic  1,280 logic elements (cells) for implementing glue logic, finite state machines and small to mid-sized control functions.
• On‑chip Memory  Total RAM: 65,536 bits (approximately 64 kbits) to support distributed RAM and small buffering/FIFO requirements.
• I/O Count  21 general purpose I/Os suitable for interfacing sensors, peripherals and control lines.
• Power Supply  Single-supply operation from 2.375 V to 3.465 V to match common board power rails.
• Package & Mounting  32‑UFQFN exposed pad (supplier package: 32‑QFN 5×5) in a surface‑mount form factor for compact PCB layouts.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
• MachXO2 Family Capabilities  As a member of the MachXO2 family, the device benefits from family-level features such as ultra‑low power options, on‑chip user flash memory, flexible programmable I/O buffers, and support for in-system programming and reconfiguration.

Typical Applications

• System Glue Logic  Consolidate discrete logic and small microcontroller interfaces into a single FPGA to reduce PCB real estate and BOM complexity.
• I/O Bridging and Protocol Conversion  Implement level-shifting, simple protocol translation and timing alignment between different subsystems using available I/Os and embedded memory.
• User Interface Control  Drive button matrices, LEDs and simple displays where a compact, reconfigurable controller is required.
• Peripheral Control  Manage sensors, GPIO expansion and timing-critical peripherals in embedded consumer and industrial equipment.

Unique Advantages

• Compact, serviceable package: The 32‑UFQFN exposed‑pad package (5×5 QFN supplier package) enables small board footprints while providing a solderable thermal/power pad for reliable assembly.
• Right‑sized logic density: 1,280 logic elements deliver sufficient capacity for glue logic and control functions without the cost and complexity of larger FPGAs.
• On‑chip RAM: Approximately 65 kbits of embedded RAM supports local buffering, FIFOs and small data tables without external memory.
• Flexible supply range: Operation from 2.375 V to 3.465 V simplifies integration into common 2.5 V and 3.3 V systems.
• Family-level ecosystem: As part of the MachXO2 family, the device aligns with a documented feature set that includes low-power options, on‑chip flash and in-system programming capabilities, aiding development and migration across densities.
• Regulatory readiness: Commercial grade and RoHS compliant for standard embedded product lines and assembly processes.

Why Choose LCMXO2-1200HC-5SG32C?

The LCMXO2-1200HC-5SG32C positions itself as a compact, low-power FPGA choice for embedded designers who need a configurable logic device with modest density, on‑chip RAM and a small QFN footprint. Its single-supply operation, exposed‑pad package and RoHS compliance make it straightforward to integrate into standard commercial electronic designs.

Ideal for teams implementing board-level glue logic, I/O bridging, or compact control functions, this MachXO2 family member provides a balance of integration, reconfigurability and documented family features that support scalability and in-field updates during product life.

Request a quote or submit a procurement inquiry to obtain pricing, availability and lead-time for LCMXO2-1200HC-5SG32C.