LCMXO2-1200HC-5TG100CR1

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP

Quantity 470 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200HC-5TG100CR1 – MachXO2 Field Programmable Gate Array (FPGA), 1280 logic elements, 79 I/Os, 100-LQFP

The LCMXO2-1200HC-5TG100CR1 is a MachXO2 family FPGA offering a flexible, low-power programmable-logic platform in a 100-pin LQFP package. It combines 1280 logic elements, 65,536 bits of embedded RAM and 79 user I/Os to address glue logic, interface bridging and control applications that require non-volatile instant-on configuration and flexible I/O options.

Key Features

  • Logic Capacity — 160 LABs providing 1280 logic elements for implementing combinational and sequential logic functions.
  • On-chip Memory — 65,536 bits (≈64 kbits) of embedded RAM for small buffers, state storage and local data processing.
  • I/O and Voltage — 79 user I/Os with a supported supply range of 2.375 V to 3.465 V, enabling a variety of board-level interface options.
  • Non-volatile Configuration — MachXO2 family on-chip user flash memory (UFM) and instant-on reconfiguration for single-chip, secure startup and background programming.
  • Low Power Architecture — Built on an advanced 65 nm low-power process with standby modes and power-saving options documented for the MachXO2 family.
  • Flexible I/O Protocol Support — Family-level programmable sysIO buffers support multiple interface standards including LVCMOS (various voltages), LVTTL, PCI, LVDS and other differential options for versatile signaling needs.
  • Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and support for PLL-based frequency synthesis (family-level capabilities).
  • Package and Temperature — Available in a 100-LQFP (supplier package: 100-TQFP, 14 × 14 mm) and rated for commercial operation from 0 °C to 85 °C.

Typical Applications

  • Board-level glue logic — Implement custom control, protocol conversion and timing logic that simplifies PCB design and reduces discrete component count.
  • Interface and peripheral bridging — Use the flexible I/O support to bridge between multiple logic families and differential signaling standards.
  • Display and source-synchronous interfaces — Support for pre‑engineered source-synchronous I/O and gearing for display interfaces makes it suitable for display timing and related frontend logic.
  • Embedded control and monitoring — Local control tasks, timers and simple state machines can leverage on-chip memory and non-volatile configuration for compact, reliable designs.

Unique Advantages

  • Compact, non-volatile FPGA: Single-chip instant-on configuration reduces system complexity and eliminates the need for external configuration memory in many designs.
  • Flexible, multi-standard I/O: Programmable sysIO buffers and differential I/O support allow the device to adapt to diverse interface requirements without external translators.
  • Low-power operation: Advanced 65 nm process and standby modes help minimize power consumption for always-on or battery-assisted systems.
  • On-chip memory and UFM: Embedded RAM plus on-chip user flash memory enables local buffering, small data stores and in-field updates without external flash.
  • Instant field reconfiguration: TransFR™ family-level reconfiguration supports in-field logic updates while the system is running for faster firmware iteration and feature updates.
  • Industry-standard package: 100-pin LQFP/TQFP footprint simplifies prototyping and integration on standard PCBs.

Why Choose LCMXO2-1200HC-5TG100CR1?

The LCMXO2-1200HC-5TG100CR1 delivers a balanced mix of logic capacity, embedded memory and flexible I/O in a compact, commercial-temperature FPGA package. It is well suited for designers who need reliable, non-volatile programmable logic for glue logic, interface bridging and embedded control without adding external configuration devices.

With family-level features such as low-power operation, programmable I/O standards, on-chip user flash and in-field reconfiguration capabilities, this device provides a scalable, maintainable platform for systems that require quick startup, flexible interfacing and the ability to update logic in the field.

Request a quote or submit your procurement inquiry to receive pricing and availability for the LCMXO2-1200HC-5TG100CR1.

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