LCMXO2-1200HC-6TG100CR1

IC FPGA 79 I/O 100TQFP
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 79 65536 1280 100-LQFP

Quantity 198 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case100-LQFPNumber of I/O79Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs160Number of Logic Elements/Cells1280
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits65536

Overview of LCMXO2-1200HC-6TG100CR1 – MachXO2 Field Programmable Gate Array (FPGA) IC, 1280 logic elements, 64 kbit RAM, 79 I/Os, 100‑LQFP

The LCMXO2-1200HC-6TG100CR1 is a MachXO2 family Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It combines a flexible logic architecture with non-volatile configuration and embedded memory to deliver an instant-on programmable fabric for system glue logic, interface bridging and peripheral control.

With 1,280 logic elements, approximately 65,536 bits of on-chip RAM, 79 I/Os and single-supply operation across a broad voltage range, this 100‑pin LQFP surface-mount device targets commercial designs that need compact, low-power reconfigurable logic and in-field update capability.

Key Features

  • Core Logic — 1,280 logic elements provide a compact, flexible LUT-based architecture for glue logic, state machines and small accelerators.
  • Embedded Memory — Approximately 65,536 bits of on-chip RAM for distributed and block memory use within user designs.
  • I/O and Interface Flexibility — 79 I/Os support a wide range of peripheral and system interfaces and permit dense signal routing in the 100‑pin package.
  • Non-volatile Configuration — MachXO2 instant-on architecture with on-chip user flash memory and support for background programming and in-field updates (TransFR reconfiguration).
  • Clocking and PLL — Device includes clocking resources and supports up to one analog PLL for flexible clock generation and management.
  • Power — Low-power family architecture with standby power optimization; single-supply operation across 2.375 V to 3.465 V simplifies power-system design.
  • Embedded System Functions — On-chip peripherals and management features such as SPI, I2C and timer/counter primitives for system integration and control.
  • Package and Mounting — 100‑pin LQFP (100‑TQFP, 14 × 14 mm) surface-mount package suitable for compact PCB layouts.
  • Commercial Grade and RoHS — Commercial operating temperature range (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • Interface Bridging — Use as a programmable bridge between mismatched peripherals, aggregating signals and adapting voltage domains while minimizing external glue components.
  • Peripheral and Sensor Aggregation — Consolidate multiple sensor inputs and peripheral interfaces into a single programmable device to simplify board routing and control logic.
  • Display and I/O Timing — Implement display gearing and custom I/O timing functions enabled by the device clocking resources and I/O flexibility.
  • Firmware/Field Upgrades — Support in-field logic updates and background programming to enable system feature updates without full hardware replacement.

Unique Advantages

  • Compact, reconfigurable logic: 1,280 logic elements deliver a space-efficient platform for replacing multiple discrete glue components.
  • Integrated memory reduces BOM: Approximately 65,536 bits of on-chip RAM reduce or eliminate the need for external SRAM in many control and buffering tasks.
  • High I/O count in a small package: 79 I/Os in a 100‑pin LQFP enable dense connectivity while keeping PCB footprint modest.
  • Instant-on non-volatile configuration: On-chip flash and MachXO2 instant-on capability enable rapid startup and secure configuration without external PROM.
  • Flexible power and clocking: Single-supply operation from 2.375 V to 3.465 V and on-chip PLL support simplify power rails and clock domain generation.
  • Commercial temperature and RoHS compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.

Why Choose LCMXO2-1200HC-6TG100CR1?

This MachXO2 FPGA offers a balanced combination of reconfigurable logic density, embedded memory and flexible I/O in a compact 100‑pin surface-mount package. It is well suited for designers who need instant-on, non-volatile programmable logic to consolidate glue logic, manage interfaces, and enable in-field updates without adding external configuration devices.

The device’s integrated memory, single-supply voltage range, and support for standard serial configuration interfaces make it a practical choice for commercial electronic systems seeking to reduce BOM complexity, accelerate time-to-market, and maintain update flexibility throughout the product lifecycle.

If you would like pricing, availability or to request a quote for LCMXO2-1200HC-6TG100CR1, submit a quote request or contact sales to get started.

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