LCMXO2-1200ZE-3MG132C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 104 65536 1280 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,579 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 104 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 160 | Number of Logic Elements/Cells | 1280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 65536 |
Overview of LCMXO2-1200ZE-3MG132C – MachXO2 Field Programmable Gate Array (FPGA) IC 104 65536 1280 132-LFBGA, CSPBGA
The LCMXO2-1200ZE-3MG132C is a MachXO2 family field programmable gate array (FPGA) offered in a 132‑ball CSPBGA surface‑mount package. It provides a compact, non‑volatile FPGA fabric with approximately 1,280 logic elements, 65,536 bits of on‑chip RAM, and 104 I/O pins for board‑level logic, interface bridging, and control functions.
Built for low power operation and flexible I/O, this commercial‑grade device supports single‑chip instant‑on reconfiguration and a broad set of on‑chip peripherals and interfaces suitable for embedded control, I/O expansion, and system glue logic in commercial applications.
Key Features
- Logic Capacity – Provides approximately 1,280 logic elements, organized for flexible implementation of combinational and sequential logic.
- On‑Chip Memory – Includes 65,536 bits of total RAM for distributed and embedded memory needs on the device.
- I/O and Interface Flexibility – 104 I/O pins with programmable sysIO buffers; family support includes multiple standards such as LVCMOS (1.2–3.3 V), LVTTL, LVDS and other differential options, plus on‑chip differential termination and programmable pull modes.
- Power and Supply – Core supply range specified at 1.14 V to 1.26 V and family‑level ultra low power options including standby modes and microsecond‑scale instant‑on behavior.
- On‑Chip Configuration & Peripherals – MachXO2 family features non‑volatile user flash memory and background programming through interfaces like SPI, I²C and JTAG, plus on‑chip oscillator and timer/counter functions.
- Clocking and PLL – Flexible on‑chip clocking with primary clocks and analog PLL support as provided by the MachXO2 family.
- Package & Mounting – 132‑LFBGA / 132‑CSPBGA (8×8 mm) surface‑mount package, commercial grade (0 °C to 85 °C), RoHS compliant.
Typical Applications
- Interface Bridging and Protocol Translation – Use the programmable I/O and flexible buffer standards to implement board‑level interface conversion and signal conditioning.
- Glue Logic and System Control – Implement system glue logic, control sequencers, and peripheral management using on‑chip logic, timers/counters and configuration interfaces.
- Display and Source‑Synchronous I/O – Apply the device’s source synchronous I/O features and gearing options for display interfaces and high‑speed parallel data paths.
- Embedded Configuration and Security – Leverage non‑volatile on‑chip flash and instant‑on capability for secure, single‑chip configuration storage and field updates.
Unique Advantages
- Non‑volatile, Instant‑On – Single‑chip, non‑volatile configuration enables immediate startup without external configuration devices.
- Low Power Operation – Family‑level low power modes and standby operation reduce system idle power draw and support energy‑constrained designs.
- Wide I/O Flexibility – Programmable buffers and differential I/O support simplify interfacing to a broad range of legacy and high‑speed standards.
- Compact Surface‑Mount Package – 132‑ball CSPBGA provides a small footprint solution for space‑constrained PCBs while offering 104 I/Os.
- Integrated System Functions – On‑chip peripherals such as SPI, I²C, timers and oscillator reduce external component count and simplify BOM.
Why Choose LCMXO2-1200ZE-3MG132C?
The LCMXO2-1200ZE-3MG132C positions itself as a compact, low‑power, non‑volatile FPGA solution for commercial embedded designs that require flexible I/O, modest logic density, and on‑chip memory. Its combination of approximately 1,280 logic elements, 65,536 bits of RAM, and 104 I/Os in a 132‑CSPBGA package makes it suitable for board‑level glue logic, interface bridging, and control applications where fast startup and integrated configuration matter.
Backed by MachXO2 family capabilities—programmable I/O standards, on‑chip configuration interfaces, and family‑level clocking and peripheral support—this device delivers scalability and system integration that help simplify design and reduce component count.
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