LCMXO2-256HC-6SG32CAIC
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 21 256 32-UFQFN Exposed Pad |
|---|---|
| Quantity | 1,982 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 32-QFN (5x5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 32-UFQFN Exposed Pad | Number of I/O | 21 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO2-256HC-6SG32CAIC – MachXO2 FPGA, 256 logic elements, 21 I/O (32‑UFQFN Exposed Pad)
The LCMXO2-256HC-6SG32CAIC is a compact MachXO2 family FPGA offered in a 32‑pin UFQFN package with exposed pad. It provides 256 logic elements and 21 user I/Os in a surface-mount, commercial‑grade device optimized for board-level glue logic, interface bridging and system control functions. The device supports a single power supply range of 2.375 V to 3.465 V and operates over a commercial temperature range of 0 °C to 85 °C.
Key Features
- Core Logic 256 logic elements for implementing glue logic, simple state machines and interface aggregation in a small-footprint FPGA.
- I/O Count & Flexibility 21 programmable I/Os in the 32‑UFQFN (5×5 mm) package suitable for signal-level interfacing and board-level connectivity.
- Power Single-supply operation from 2.375 V to 3.465 V; part of a family manufactured on an advanced low-power 65 nm process (family-level characteristic).
- Memory No embedded SRAM on this device (Total RAM bits: 0), simplifying predictable resource allocation for control and glue logic tasks.
- Configuration & System Functions MachXO2 family-level system features include hardened interfaces such as SPI and I²C and timer/counter primitives—useful for configuration, system monitoring and auxiliary control.
- Package & Mounting 32‑UFQFN exposed pad (supplier device package 32‑QFN, 5×5 mm) for surface-mount assembly with a compact board footprint.
- Environmental & Grade Commercial grade operation (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Board-level glue logic Replace discrete gates and CPLDs to consolidate address decoding, bus arbitration and control logic in a single programmable device.
- Interface bridging Implement protocol adaptors and I/O translation between subsystems using the device’s 21 I/Os and flexible logic resources.
- System control and management Use for power sequencing, reset control, and simple supervisory functions leveraging on-chip timers and serial interfaces (family-level features).
- User interface control Drive LEDs, buttons and basic display logic while offloading simple sequencing and state machines from the main processor.
Unique Advantages
- Compact, production-friendly package: 32‑UFQFN with exposed pad offers a small PCB footprint for space-constrained designs.
- Predictable resource set: 256 logic elements and 21 I/Os provide a clear resource budget for glue logic and interface tasks.
- Wide supply tolerance: Operation across 2.375 V to 3.465 V simplifies integration with common board power rails.
- Commercial temperature rating: 0 °C to 85 °C operation aligns with standard consumer and industrial board-level applications.
- RoHS compliant: Environmentally compliant packaging meets common regulatory requirements for lead‑free assembly.
- Part of the MachXO2 family: Access to family-level system capabilities such as hardened SPI/I²C and timer functions for streamlined system integration.
Why Choose LCMXO2-256HC-6SG32CAIC?
This MachXO2 device targets compact, low‑to‑moderate complexity logic and interface roles where a small package, modest logic capacity and predictable I/O count matter. Its single-supply operation, commercial temperature rating and RoHS compliance make it suitable for mainstream embedded designs that require reliable board-level control, protocol bridging or user-interface logic.
Designers benefit from a clear, constrained resource set (256 logic elements, 21 I/Os, no embedded SRAM) that simplifies partitioning of glue logic versus higher-capacity FPGA functions, while leveraging MachXO2 family-level system features for configuration and basic peripherals.
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