LCMXO2-256ZE-1SG32C

The LCMXO2-256ZE-1SG32C is a compact MachXO2 field programmable gate array offered in a 32‑lead UFQFN exposed‑pad package. It delivers 256 logic elements and 21 general purpose I/O pins in a small, surface‑mount footprint for commercial temperature designs.

This device is intended for space‑constrained embedded and system‑glue applications that require moderate programmable logic density, low‑voltage operation, and RoHS compliance, while maintaining a compact board footprint.

Key Features

• Logic Capacity — 256 logic elements provide flexible, reprogrammable logic for glue logic, control functions, and small finite‑state machines.
• I/O Count — 21 general purpose I/O pins suitable for peripheral interfacing, signal routing, and control signals.
• Power Supply — Operates from a core supply range of 1.14 V to 1.26 V, compatible with 1.2 V system rails.
• Package & Mounting — 32‑lead UFQFN exposed pad (32‑QFN, 5 mm × 5 mm) in a surface‑mount form factor optimized for compact PCB designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory Status — RoHS compliant, supporting lead‑free assembly processes.
• Design Density — Small logic footprint (256 logic elements) enables cost‑effective implementations where modest programmable logic is required.

Typical Applications

• System Glue Logic — Consolidate multiple discrete glue functions into a single programmable device to reduce BOM and simplify routing.
• Peripheral and Sensor Interfacing — Implement interface translation, simple protocol handling, and signal conditioning for sensors and peripherals using available I/Os.
• Embedded Control — Implement compact control logic, finite‑state machines, and timing/state coordination for small embedded systems.
• User Interface Control — Drive status LEDs, buttons, and simple display or keypad interfaces while minimizing board area.

Unique Advantages

• Compact, Low‑Profile Package: The 32‑UFQFN (5×5 mm) exposed‑pad package minimizes board area while providing thermal performance for small form‑factor designs.
• Moderate Logic Density: 256 logic elements provide the right balance of reprogrammable logic for common glue and control tasks without excess cost or complexity.
• Low‑Voltage Operation: Narrow core supply range (1.14 V to 1.26 V) for straightforward integration into 1.2 V power domains.
• Commercial Temperature Range: Rated 0 °C to 85 °C, suitable for a wide range of consumer and commercial electronics.
• Surface‑Mount Ready: Package and exposed pad are optimized for standard surface‑mount assembly, aiding automated manufacturing.
• RoHS Compliant: Meets environmental directives for lead‑free production and global regulatory expectations.

Why Choose LCMXO2-256ZE-1SG32C?

The LCMXO2-256ZE-1SG32C positions itself as a practical, compact FPGA choice when modest programmable logic and a limited number of I/Os are required. Its small UFQFN package and low‑voltage core make it well suited for space‑constrained embedded designs where board area, power domain compatibility, and simplified assembly are priorities.

This device is ideal for engineers seeking a reprogrammable, RoHS‑compliant solution for glue logic, peripheral interfacing, and simple control tasks in commercial temperature applications, providing predictable integration into existing 1.2 V systems.

Request a quote or submit an inquiry to obtain pricing and availability for the LCMXO2-256ZE-1SG32C.