LCMXO2-256ZE-1SG32I

The LCMXO2-256ZE-1SG32I is an industrial‑grade FPGA IC from Lattice Semiconductor's MachXO2 family. It delivers a compact, low‑power programmable logic solution in a 32‑pin UFQFN exposed‑pad package for space‑constrained embedded designs.

As part of the MachXO2 family, this device is built on the family architecture that emphasizes flexible I/O, instant‑on non‑volatile reconfiguration and system‑level integration. It targets applications that need compact programmable logic, predictable operating range and straightforward integration into surface‑mount assemblies.

Key Features

• Core Logic  256 logic elements; device-level resource counts are sized for small, dedicated control and glue‑logic functions.
• Logic Blocks  32 logic blocks (CLBs) providing the basic programmable fabric for combinational and sequential logic.
• I/O Capability  21 I/Os suitable for a variety of interface and peripheral connections in compact systems.
• Voltage Supply  Operates from a core supply range of 1.14 V to 1.26 V, enabling compatibility with low‑voltage system domains.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended‑range environments.
• Package and Mounting  32‑UFQFN exposed pad package (supplier device package: 32‑QFN 5×5 mm); surface‑mount mounting type supports compact PCB layouts and thermal coupling through the exposed pad.
• RoHS Compliance  RoHS‑compliant device suitable for lead‑free manufacturing processes.
• MachXO2 Family Features  As a MachXO2 series device, the family provides ultra low power operation, on‑chip user flash memory options, pre‑engineered source‑synchronous I/O and system reconfiguration capabilities (family‑level characteristics).

Typical Applications

• Industrial Control  I/O expansion, signal conditioning and control logic within industrial systems where the device's industrial temperature rating and compact package are required.
• Interface Bridging  Protocol adaptation and glue logic between peripherals and controllers using the device's flexible I/O count and MachXO2 family I/O capabilities.
• Embedded System Logic  Small form‑factor embedded designs that need instant‑on programmable logic and non‑volatile configuration in a 5×5 mm QFN footprint.

Unique Advantages

• Compact, thermally efficient package: The 32‑UFQFN exposed pad (5×5 mm) minimizes PCB area while providing an exposed pad for improved thermal conduction and reliable solder attachment.
• Industrial temperature range: Rated for −40 °C to 100 °C, enabling deployment in harsher environmental conditions without additional thermal qualification steps.
• Low‑voltage core operation: Core supply from 1.14 V to 1.26 V aligns with modern low‑voltage domains, simplifying power‑rail planning in compact systems.
• Part of a flexible family: Being a MachXO2 device provides access to family‑level features such as low‑power modes, on‑chip flash options and source‑synchronous I/O architectures for broader design scalability.
• RoHS compliant: Supports lead‑free manufacturing and assembly processes for contemporary production flows.
• Surface‑mount friendly: 32‑pin QFN package and exposed pad support automated assembly and consistent PCB integration.

Why Choose LCMXO2-256ZE-1SG32I?

The LCMXO2-256ZE-1SG32I combines a small physical footprint with industrial temperature capability and a practical resource set—256 logic elements and 21 I/Os—making it well suited for compact control, interface and glue‑logic tasks. Its package and mounting style simplify thermal management and surface‑mount assembly.

Chosen as a member of the MachXO2 family, it provides a direct migration path to other family densities and leverages family‑level features such as low‑power operation and non‑volatile configuration, offering long‑term design scalability and integration options for embedded system designers and procurement teams.

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