LCMXO2-256ZE-2SG32C

IC FPGA 21 I/O 32QFNS
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 21 256 32-UFQFN Exposed Pad

Quantity 1,474 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package32-QFN (5x5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case32-UFQFN Exposed PadNumber of I/O21Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs32Number of Logic Elements/Cells256
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of LCMXO2-256ZE-2SG32C – MachXO2 FPGA, 256 logic elements, 21 I/Os, 32‑UFQFN

The LCMXO2-256ZE-2SG32C is a MachXO2 family Field Programmable Gate Array (FPGA) IC configured for compact, low-power commercial designs. It provides 256 logic elements with 21 general-purpose I/Os in a 32‑UFQFN exposed‑pad surface-mount package, making it suitable for small footprint interface, control and glue‑logic applications where low voltage operation and board-level integration matter.

Key Features

  • Core Logic  256 logic elements provide the programmable fabric for custom logic, state machines and simple glue logic implementations.
  • I/O Capability  21 configurable I/Os support a variety of interface roles; the MachXO2 family includes flexible I/O buffer options for common signaling standards.
  • Power and Supply  Single‑supply operation with a specified voltage range of 1.14 V to 1.26 V for core operation; the MachXO2 family also targets ultra‑low power operation in standby modes.
  • Memory  This device reports a total of 0 on‑chip RAM bits, making it optimized for logic‑centric tasks without embedded SRAM.
  • System Peripherals (Family)  MachXO2 family devices include on‑chip peripheral support such as SPI, I²C and timer/counter primitives for system integration and interface handling.
  • Package & Mounting  32‑UFQFN exposed pad (supplier package: 32‑QFN, 5×5 mm) for surface‑mount assembly with improved thermal path via the exposed pad.
  • Operating Range & Compliance  Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • Interface and Protocol Bridging  Use the device to implement compact protocol translators, level‑shifters and signal conditioning for peripheral buses.
  • Control and Sequencing  Ideal for small control tasks such as power sequencing, reset management and state machine implementations in commercial systems.
  • Glue Logic and Integration  Replace discrete logic with a single programmable device to reduce BOM and simplify board routing in compact designs.
  • User Interface Control  Drive and manage simple user interfaces, button matrices or LED control where modest logic density and reliable I/O are required.

Unique Advantages

  • Compact, board‑friendly package: 32‑UFQFN with exposed pad delivers a small PCB footprint and improved thermal dissipation for dense assemblies.
  • Low‑voltage operation: Narrow core supply range (1.14 V–1.26 V) supports designs where low core voltage and power efficiency are important.
  • Right‑sized logic capacity: 256 logic elements match small to medium glue‑logic and control tasks without over‑provisioning device resources.
  • Commercial temperature rating: Rated 0 °C to 85 °C for general commercial deployments where standard ambient conditions apply.
  • Family ecosystem benefits: MachXO2 family support for SPI/I²C and other system primitives enables tighter integration and faster development when migrating within the family.
  • Regulatory friendliness: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose LCMXO2-256ZE-2SG32C?

This MachXO2‑based FPGA offers a concise, low‑voltage programmable solution for designers needing compact logic capacity, flexible I/O and an exposed‑pad QFN package for effective thermal and mechanical integration. Its combination of 256 logic elements and 21 I/Os is well suited to commercial applications that require reliable interface handling, control sequencing and board‑level integration without large device overhead.

Choosing this part provides a straightforward path for small to medium complexity designs that benefit from the MachXO2 family’s system features and compact packaging, delivering a balanced tradeoff between logic density, I/O capability and board space.

Request a quote or submit a purchase inquiry to receive pricing and availability for the LCMXO2-256ZE-2SG32C.

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