LCMXO2-256ZE-2SG32C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 21 256 32-UFQFN Exposed Pad |
|---|---|
| Quantity | 1,474 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 32-QFN (5x5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 32-UFQFN Exposed Pad | Number of I/O | 21 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO2-256ZE-2SG32C – MachXO2 FPGA, 256 logic elements, 21 I/Os, 32‑UFQFN
The LCMXO2-256ZE-2SG32C is a MachXO2 family Field Programmable Gate Array (FPGA) IC configured for compact, low-power commercial designs. It provides 256 logic elements with 21 general-purpose I/Os in a 32‑UFQFN exposed‑pad surface-mount package, making it suitable for small footprint interface, control and glue‑logic applications where low voltage operation and board-level integration matter.
Key Features
- Core Logic 256 logic elements provide the programmable fabric for custom logic, state machines and simple glue logic implementations.
- I/O Capability 21 configurable I/Os support a variety of interface roles; the MachXO2 family includes flexible I/O buffer options for common signaling standards.
- Power and Supply Single‑supply operation with a specified voltage range of 1.14 V to 1.26 V for core operation; the MachXO2 family also targets ultra‑low power operation in standby modes.
- Memory This device reports a total of 0 on‑chip RAM bits, making it optimized for logic‑centric tasks without embedded SRAM.
- System Peripherals (Family) MachXO2 family devices include on‑chip peripheral support such as SPI, I²C and timer/counter primitives for system integration and interface handling.
- Package & Mounting 32‑UFQFN exposed pad (supplier package: 32‑QFN, 5×5 mm) for surface‑mount assembly with improved thermal path via the exposed pad.
- Operating Range & Compliance Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Interface and Protocol Bridging Use the device to implement compact protocol translators, level‑shifters and signal conditioning for peripheral buses.
- Control and Sequencing Ideal for small control tasks such as power sequencing, reset management and state machine implementations in commercial systems.
- Glue Logic and Integration Replace discrete logic with a single programmable device to reduce BOM and simplify board routing in compact designs.
- User Interface Control Drive and manage simple user interfaces, button matrices or LED control where modest logic density and reliable I/O are required.
Unique Advantages
- Compact, board‑friendly package: 32‑UFQFN with exposed pad delivers a small PCB footprint and improved thermal dissipation for dense assemblies.
- Low‑voltage operation: Narrow core supply range (1.14 V–1.26 V) supports designs where low core voltage and power efficiency are important.
- Right‑sized logic capacity: 256 logic elements match small to medium glue‑logic and control tasks without over‑provisioning device resources.
- Commercial temperature rating: Rated 0 °C to 85 °C for general commercial deployments where standard ambient conditions apply.
- Family ecosystem benefits: MachXO2 family support for SPI/I²C and other system primitives enables tighter integration and faster development when migrating within the family.
- Regulatory friendliness: RoHS compliance supports modern environmental and manufacturing requirements.
Why Choose LCMXO2-256ZE-2SG32C?
This MachXO2‑based FPGA offers a concise, low‑voltage programmable solution for designers needing compact logic capacity, flexible I/O and an exposed‑pad QFN package for effective thermal and mechanical integration. Its combination of 256 logic elements and 21 I/Os is well suited to commercial applications that require reliable interface handling, control sequencing and board‑level integration without large device overhead.
Choosing this part provides a straightforward path for small to medium complexity designs that benefit from the MachXO2 family’s system features and compact packaging, delivering a balanced tradeoff between logic density, I/O capability and board space.
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