LCMXO2-256ZE-2MG132I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 55 256 132-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,158 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 132-CSPBGA (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 132-LFBGA, CSPBGA | Number of I/O | 55 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 32 | Number of Logic Elements/Cells | 256 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of LCMXO2-256ZE-2MG132I – MachXO2 FPGA, 256 Logic Elements, 55 I/O, 132-CSPBGA
The LCMXO2-256ZE-2MG132I is a MachXO2 field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 132-ball CSPBGA surface-mount package. With 256 logic elements and 55 user I/Os, this industrial-grade device targets compact logic integration and I/O consolidation in space-constrained embedded systems.
Engineered for low-voltage operation (1.14 V to 1.26 V) and extended temperature environments (–40 °C to 100 °C), the device is suited for industrial control, interface bridging, and general-purpose logic tasks where deterministic glue logic and reliable operation are required.
Key Features
- Logic Capacity 256 logic elements provide a compact programmable fabric for control logic, protocol bridging, and glue-logic functions.
- I/O Count 55 user I/Os support a variety of peripheral and interface connections in a small-footprint design.
- Package and Mounting 132-LFBGA / 132-CSPBGA (8×8) package in a surface-mount form factor for high-density PCB layouts.
- Voltage Supply Operates at 1.14 V to 1.26 V, enabling integration into low-voltage system rails.
- Industrial Temperature Range Rated for –40 °C to 100 °C for deployment in industrial and harsh-environment applications.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
- Memory Profile No on-chip RAM (Total RAM Bits: 0), making the device optimized for logic-centric applications that rely on external memory or do not require embedded RAM.
Typical Applications
- Industrial Control Implement compact control logic, signal conditioning, and I/O aggregation for PLCs, motor drives, and factory automation equipment operating across industrial temperature ranges.
- Interface Bridging Consolidate protocol translation and glue logic between multiple peripherals and system buses using the device’s abundant I/O.
- User Interfaces Drive and manage display/LED control, button scanning, and peripheral multiplexing in small-form-factor HMI or instrument panels.
- Embedded Logic Acceleration Offload deterministic combinatorial and sequential logic from a microcontroller to reduce software overhead and tighten real-time response.
Unique Advantages
- Compact, Board-Friendly Package: 132-ball CSPBGA enables high I/O density in a small PCB footprint for space-constrained designs.
- Industrial-Grade Reliability: Rated for –40 °C to 100 °C to withstand extended-temperature operation in industrial systems.
- Low-Voltage Operation: Narrow supply range (1.14 V–1.26 V) simplifies integration with low-voltage system rails and power domains.
- Logic-Focused Architecture: 256 logic elements provide a streamlined, deterministic fabric for glue logic, protocol handling, and control tasks where on-chip RAM is not required.
- RoHS Compliance: Meets environmental manufacturing requirements for modern product builds.
Why Choose LCMXO2-256ZE-2MG132I?
This MachXO2-based FPGA delivers a focused, logic-centric solution for embedded designs that need programmable I/O and deterministic control in a compact, industrial-grade package. Its combination of 256 logic elements, 55 I/Os, and a 132-CSPBGA footprint makes it well suited for engineers who need to consolidate interfaces and offload fixed logic from host processors without increasing board area.
Choose the LCMXO2-256ZE-2MG132I when your design requires reliable operation across extended temperatures, low-voltage integration, and a RoHS-compliant, surface-mount FPGA for production-grade embedded systems.
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