LCMXO2-4000HC-6BG256C

The LCMXO2-4000HC-6BG256C is a MachXO2 family field programmable gate array (FPGA) packaged in a 256-ball LFBGA offering 4,320 logic elements and 206 user I/Os. Designed as a low-power, non-volatile FPGA solution, it integrates on-chip RAM and user flash to support flexible glue-logic, interface bridging, and control functions across commercial embedded systems.

With a single power supply operating range of 2.375 V to 3.465 V, commercial temperature grading (0 °C to 85 °C) and RoHS compliance, this device targets applications that require immediate-on configuration, a broad range of I/O standards, and in-field reconfiguration options.

Key Features

• Logic Capacity — 4,320 logic elements (LUT4s) for implementing mid-density glue logic, protocol bridging, and control tasks.
• On-chip Memory — 94,208 total RAM bits of embedded and distributed memory to support FIFOs, buffering and small data stores; family supports up to 240 kbits embedded block RAM and up to 256 kbits user flash memory.
• Flexible I/O — 206 user I/Os with programmable sysIO buffer support for multiple interface standards; I/Os include programmable differential options, on-chip termination, and hot-socketing support as described for the MachXO2 family.
• Power and Low-Power Modes — Advanced 65 nm low-power process technology with ultra-low standby behavior (family standby power as low as 22 μW) and programmable power-saving options.
• Clocking and PLLs — Multi-clock architecture with eight primary clocks and up to two analog PLLs per device in the family for fractional-n frequency synthesis and wide input frequency ranges.
• Non-volatile, Instant-On Configuration — On-chip user flash memory and single-chip non-volatile configuration enables instant-on behavior and background programming; supports JTAG, SPI and I²C programming interfaces.
• In-field Reconfiguration — TransFR reconfiguration capability for in-field logic updates while the system operates (family feature).
• Package and Mounting — 256-LFBGA surface-mount package; supplier device package listed as 256-CABGA (14 × 14).
• Commercial Grade and Compliance — Commercial temperature range (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Interface Bridging and Protocol Conversion — Use the device’s abundant I/Os and flexible sysIO buffer options to implement protocol adapters and signal-level translators in embedded systems.
• System Control and Glue Logic — Deploy as a programmable control hub for power sequencing, watchdogs, and peripheral management where quick reconfiguration and on-chip non-volatile memory are beneficial.
• Memory and Display Interfaces — Leverage dedicated DDR gearing and pre-engineered source synchronous I/O features (family capabilities) for display or memory interface support requiring DDR registers and gearing logic.
• Field Updatable Logic — Implement in-field feature updates and firmware offload scenarios using the MachXO2 family’s TransFR reconfiguration and on-chip flash memory.

Unique Advantages

• High I/O Density in a Compact Package: 206 I/Os in a 256-ball LFBGA package enable rich external connectivity without large board area.
• Integrated Non-Volatile Configuration: On-chip user flash supports instant-on operation and background programming to simplify system boot and updates.
• Mid-Density Logic with Embedded RAM: 4,320 logic elements paired with 94,208 bits of on-chip RAM support a wide range of mid-complexity logic functions and buffering needs.
• Low-Power Operation: Family-level low-power process and standby modes reduce idle energy consumption in always-on or battery-assisted designs.
• Flexible Clocking and PLLs: Multiple primary clocks and analog PLL options allow designers to manage diverse timing domains and high-speed I/O requirements.
• Field Serviceability: TransFR and supported programming interfaces (JTAG, SPI, I²C) enable in-field updates and secure single-chip solutions.

Why Choose LCMXO2-4000HC-6BG256C?

The LCMXO2-4000HC-6BG256C positions itself as a flexible, non-volatile FPGA for commercial embedded designs that demand immediate configuration, a high I/O count, and integrated memory for control and buffering tasks. Its combination of 4,320 logic elements, approximately 94,208 bits of on-chip RAM, and family-level features such as low-power operation, programmable I/O standards, and in-field reconfiguration make it well suited to system control, interface bridging, and mid-density programmable logic roles.

For teams needing a compact, RoHS-compliant FPGA with a broad power supply range (2.375 V–3.465 V) and surface-mount packaging, this MachXO2 device offers a practical balance of integration, configurability, and commercial-grade reliability within the specified operating temperature range.

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