LCMXO2-4000HC-6BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 433 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-6BG332C – MachXO2 FPGA, 4320 logic elements, 274 I/Os (332-CABGA)
The LCMXO2-4000HC-6BG332C is a MachXO2 family field programmable gate array (FPGA) in a 332-ball caBGA package (17×17). It provides 4,320 logic elements and 94,208 bits of on-chip RAM with up to 274 I/O signals, making it suitable for dense glue logic, system control and interface consolidation in commercial designs.
Designed with the MachXO2 family architecture, the device combines reconfigurable logic, embedded memory, on-chip non-volatile flash options and flexible I/O to simplify board-level integration while operating across a single supply voltage range of 2.375 V to 3.465 V.
Key Features
- Core Logic — 4,320 logic elements (cells) for implementing combinational and sequential logic functions appropriate for mid-density designs.
- Embedded Memory — 94,208 total RAM bits on-chip to support FIFOs, buffering and small data stores within the FPGA fabric.
- I/O Capacity & Flexibility — Up to 274 general-purpose I/Os in the 332-ball package; programmable I/O standards supported by the MachXO2 family enable broad interface options.
- Non-volatile Reconfiguration — MachXO2 family devices include on-chip user flash memory and support single-chip, instant-on operation and in-field reconfiguration.
- Power & Supply — Single supply operation across 2.375 V to 3.465 V; the MachXO2 family is built on a low-power process with standby and power-saving modes.
- Clocking & Timing — Family-level support for multiple primary clocks and analog PLLs provides flexible clocking for system and I/O needs.
- Packaging & Mounting — 332-ball caBGA (17×17) supplier package; surface-mount mounting type suited for compact board designs.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Consolidate multiple peripheral interfaces and implement protocol translation using the device’s 4,320 logic elements and large I/O count.
- Display and Video I/O — Family-level support for source-synchronous and geared display I/Os makes the device suitable for display timing, buffering and control tasks.
- Memory Interface Control — Use pre-engineered DDR/DDR2/LPDDR I/O support and embedded FIFOs to manage memory interface logic and data gating.
- System Control and Peripheral Management — Implement timers, SPI/I²C controllers and a range of system glue functions leveraging on-chip flash and embedded memory.
Unique Advantages
- High I/O Density: Up to 274 I/Os in a compact 332-ball package supports complex board-level connectivity without large footprint penalties.
- Integrated On‑Chip Memory: 94,208 bits of embedded RAM reduce dependence on external memory for buffering and small data stores.
- Single-Supply Flexibility: Operation across 2.375 V to 3.465 V simplifies power rail design and integration with common system voltages.
- Non-volatile, Reconfigurable Logic: MachXO2 family non-volatile flash and instant-on capabilities enable secure, single-chip deployment and field updates.
- Compact Packaging: 332-ball caBGA (17×17) offers a high pin-count solution in a small-board footprint for space-constrained applications.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product environments.
Why Choose LCMXO2-4000HC-6BG332C?
The LCMXO2-4000HC-6BG332C positions itself as a mid-density, highly connected FPGA option within the MachXO2 family—balancing substantial logic resources (4,320 logic elements) with a large on-chip RAM footprint (94,208 bits) and up to 274 I/Os in a compact caBGA package. Its single-supply operation and family-level features for flexible I/O, on-chip flash and reconfiguration make it well suited to system glue logic, interface bridging and control applications in commercial product lines.
For design teams seeking a field-programmable, non-volatile device that reduces external component count while providing scalable logic and I/O capacity, the LCMXO2-4000HC-6BG332C offers a practical platform backed by the MachXO2 family capabilities.
Request a quote or submit a pricing inquiry to evaluate how the LCMXO2-4000HC-6BG332C can fit into your next design.

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