LCMXO2-4000HC-6FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 783 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HC-6FTG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 I/Os, 94,208 bits RAM, 4,320 Logic Elements, 256-LBGA
The LCMXO2-4000HC-6FTG256C is a MachXO2 family non-volatile FPGA offered in a 256-ball ftBGA package (17 × 17 mm). It delivers 4,320 logic elements and approximately 94 kbits of on-chip RAM with 206 user I/Os, making it suitable for compact, low-power control, glue-logic and I/O-expansion tasks in commercial systems.
Built on the MachXO2 architecture, the device combines reconfigurable logic, embedded memory and flexible I/O with single-chip, instant-on non-volatile configuration. Key value propositions include high I/O density, on-chip memory resources and a broad voltage input range for easy integration into existing 2.5 V–3.3 V systems.
Key Features
- Core Logic — 4,320 logic elements provide a balanced capacity for glue logic, control finite-state machines and medium-density logic functions.
- Embedded Memory — Approximately 94,208 total RAM bits on-chip to support FIFOs, packet buffering and small data stores without external SRAM.
- I/O Density & Flexibility — 206 user I/Os available in the 256-ball ftBGA package enabling wide peripheral connectivity and dense board-level routing.
- Voltage Supply Range — Supports 2.375 V to 3.465 V operation for compatibility with common 2.5 V and 3.3 V domains.
- Non-volatile, Instant-On Configuration — MachXO2 family features include on-chip user Flash and single-chip, secure instant-on configuration (family level).
- Low Power Options — Family-level low-power characteristics are available, including micro-watt standby modes for power-sensitive designs.
- Clocking and PLLs — Flexible on-chip clocking options and analog PLL support are provided at the family level to implement multiple clock domains and high-speed interfaces.
- Package & Mounting — Surface-mount 256-LBGA (supplier package: 256-FTBGA, 17 × 17 mm) for compact board footprint and high I/O count.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
- RoHS Compliant — Conforms to RoHS requirements for lead-free assemblies.
Typical Applications
- System Glue Logic — Use the 4,320 logic elements and 206 I/Os to consolidate discrete glue logic, bus bridging and control functions onto a single device.
- Peripheral Interface Expansion — High I/O count enables expansion and aggregation of sensors, LEDs, buttons and serial peripherals at the board level.
- Display and Memory Interfaces — On-chip memory and family-level source-synchronous I/O support make the device suitable for interfacing display buses and managing DDR/DDRx style signaling where applicable to the MachXO2 family.
- Embedded Control and Timing — Integrated clocking and PLL capabilities (family-level) support multi-domain timing and control logic for embedded subsystems.
Unique Advantages
- High I/O Count in a Small Footprint: 206 user I/Os in a 17 × 17 mm ftBGA package reduce board area while enabling rich peripheral connectivity.
- On-Chip Memory Reduces BOM: Approximately 94 kbits of embedded RAM helps eliminate small external memory components for buffering and FIFOs.
- Broad Voltage Compatibility: 2.375 V to 3.465 V supply range allows direct interface with common 2.5 V and 3.3 V domains, simplifying power-rail design.
- Instant-On, Non-Volatile Operation: MachXO2 family non-volatile configuration enables immediate availability after power-up and simplifies system startup sequences.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
- RoHS Compliant Packaging: Halogen-free, RoHS-compliant package supports modern assembly and regulatory needs.
Why Choose LCMXO2-4000HC-6FTG256C?
The LCMXO2-4000HC-6FTG256C positions itself as a compact, non-volatile FPGA option for designs that require moderate logic capacity, substantial I/O density and embedded memory without external configuration devices. Its 4,320 logic elements, ~94 kbits of RAM and 206 I/Os make it well suited for consolidating control, interfacing and buffering tasks within commercial electronic products.
Designers benefit from family-level features such as flexible clocking, low-power modes and non-volatile instant-on configuration while taking advantage of a small ftBGA package and a wide supply voltage window for straightforward integration into existing 2.5 V / 3.3 V systems.
Request a quote or submit an RFQ to get pricing and availability for the LCMXO2-4000HC-6FTG256C and to discuss how it fits your next design.

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