LCMXO2-4000HC-6FG484I

IC FPGA 278 I/O 484FBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

Quantity 1,616 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O278Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HC-6FG484I – MachXO2 Field Programmable Gate Array (FPGA) IC 278 94208 4320 484-BBGA

The LCMXO2-4000HC-6FG484I is a MachXO2 family FPGA from Lattice Semiconductor, delivered in a 484-ball BGA package and rated for industrial use. It combines a flexible low-power logic fabric with significant on-chip memory and high-density I/O capability, making it suitable for embedded control, system glue logic, and I/O-intensive applications.

Key value drivers include non-volatile, instant-on reconfiguration, an extensive programmable I/O set, and a wide single-supply voltage range, enabling compact, reliable designs that require persistent configuration and versatile interfacing.

Key Features

  • Core Logic — Approximately 4,320 logic elements provide configurable LUT-based logic for glue logic, state machines, and custom control functions.
  • Embedded Memory — Approximately 94 kbits of on-chip RAM (94,208 bits) for FIFOs, small data buffers, and state storage.
  • High-Density I/O — 278 user I/O pins support complex interfacing and high pin-count systems in a compact package.
  • Non-volatile Configuration — MachXO2 family non-volatile, instant-on architecture supports in-field reconfiguration and single-chip secure programming via standard interfaces.
  • Programmable I/O Standards — Family-level sysIO support and pre‑engineered source-synchronous I/O features provide flexible signalling options and DDR-capable I/O cells for high-speed interfaces.
  • Power and Clocking — Operates from a single supply from 2.375 V to 3.465 V and includes on-chip clocking resources and PLLs for system timing and clock synthesis.
  • Package & Mounting — 484-ball BGA footprint (supplier package: 484-FBGA, 23 mm × 23 mm) with surface-mount mounting for compact board integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Standards & Reliability — RoHS compliant and includes family-level system features such as JTAG boundary scan and multiple configuration interfaces.

Typical Applications

  • Industrial Control — Implement control logic, sequencing, and interface bridging in industrial systems where the −40 °C to 100 °C range and industrial grading are required.
  • I/O Expansion and Protocol Bridging — Use the 278 I/Os and programmable sysIO buffer options to adapt signals between different subsystems and support source-synchronous interfaces.
  • Boot & Configuration Management — Leverage the MachXO2 non-volatile, instant-on capability and on-chip user flash for secure configuration storage and background reprogramming.
  • Memory Buffering and Data Handling — Employ the on-chip RAM for temporary buffering, FIFO control, and small data-store functions in embedded systems.

Unique Advantages

  • Non-volatile, Instant-On Operation: Eliminates the need for external configuration memory for rapid system start-up and simplified power-up sequencing.
  • High I/O Count in a Compact Package: 278 I/O pins in a 484-ball BGA enable dense connectivity for complex systems without a large board footprint.
  • Wide Supply Range: Single-supply operation from 2.375 V to 3.465 V simplifies power rail design across mixed-voltage platforms.
  • Industrial Temperature Rating: −40 °C to 100 °C qualification supports deployment in harsh or temperature-variable environments.
  • Embedded Memory for System Tasks: Approximately 94 kbits of on-chip RAM supports FIFOs, buffering, and small embedded data structures without external SRAM.
  • Flexible Reconfiguration: In-field reprogramming and multiple configuration interfaces (JTAG, SPI, I²C at the family level) streamline firmware updates and design iteration.

Why Choose LCMXO2-4000HC-6FG484I?

The LCMXO2-4000HC-6FG484I positions itself as a versatile, industrial-grade programmable logic device that balances logic capacity, embedded memory, and extensive I/O in a compact BGA package. It is well suited for engineers building embedded control systems, interface bridges, and board-level glue logic where non-volatile configuration and reliable operation across a wide temperature range are required.

With family-level features such as instant-on configuration, programmable I/O standards, and reconfiguration capability, this device offers scalability and long-term value for designs that need field updateability and integrated system support.

Request a quote or submit your requirements to receive pricing and availability for the LCMXO2-4000HC-6FG484I. Our team can assist with lead times, volume pricing, and technical queries to help you integrate this FPGA into your next design.

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