LCMXO2-4000HE-5FTG256I
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA |
|---|---|
| Quantity | 851 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-5FTG256I – MachXO2 FPGA, 256-LBGA, Industrial
The LCMXO2-4000HE-5FTG256I is a MachXO2 family field programmable gate array (FPGA) IC from Lattice Semiconductor, designed for mid-density programmable logic and high I/O count applications. It combines 4,320 logic elements with 206 I/Os and on-chip memory to support glue logic, control functions, and system integration in industrial designs requiring non-volatile, instant-on programmability.
Key Features
- Core Logic 4,320 logic elements for mid-density programmable logic and system control functions.
- I/O Density & Flexibility 206 I/Os to support extensive board-level interfacing; programmable sysIO buffer options and on-chip differential termination are available in the MachXO2 family.
- Embedded Memory Total on-chip RAM: 94,208 bits (reported). The MachXO2 family also provides embedded and distributed memory architectures for FIFO and buffering needs.
- Non-Volatile Configuration Part of the MachXO2 family that supports on-chip user flash memory and instant-on, single-chip non-volatile operation with background programming options.
- Low-Power Architecture Built on an advanced low-power process with family-level power-saving modes and standby options to minimize idle power.
- High-Performance I/O Standards Family supports a wide range of I/O standards (LVCMOS, LVDS, Bus-LVDS, RSDS, LVPECL, SSTL, HSTL and others) and features such as programmable low-swing differential I/Os and DDR registers in I/O cells.
- Clocking & PLLs Flexible on-chip clocking resources in the MachXO2 family including multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis.
- Reconfiguration & System Support Supports in-field reconfiguration (TransFR) and hardened system functions such as SPI, I²C and timers; IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support are included at the family level.
- Package & Environmental 256-ball LBGA package (supplier package: 256-FTBGA, 17×17 mm), surface-mount; industrial grade with operating temperature range −40 °C to 100 °C and RoHS compliance.
- Power Supply Core supply range specified at 1.14 V to 1.26 V.
Typical Applications
- Industrial Control Use the device’s industrial temperature rating and 206 I/Os for sensor interfacing, system glue logic, and control signal aggregation in automation equipment.
- Embedded System Glue Logic Mid-density logic and on-chip non-volatile configuration make it suitable for consolidating glue logic, boot management and configuration tasks on a single device.
- Interface Bridging & I/O Expansion High I/O count and flexible I/O standards support protocol translation, level shifting and expansion of board-level connectivity.
- Display & Memory Interfaces Family-level support for source-synchronous I/O and DDR gearing helps implement display interfaces and memory controller glue logic where needed.
Unique Advantages
- High I/O Count with Mid-Density Logic Combines 4,320 logic elements with 206 I/Os to reduce the number of discrete components for complex board-level interfacing.
- Non-Volatile, Instant-On Operation Part of a family offering on-chip user flash and instant-on capability, simplifying system boot and secure single-chip solutions.
- Flexible I/O and Clocking Programmable I/O standards and multiple clock/PLL resources reduce external component needs for timing and signal conditioning.
- Robust Industrial Specification Surface-mount 256-ball FTBGA package, industrial temperature range (−40 °C to 100 °C) and RoHS compliance for reliable deployment in industrial environments.
- Power-Efficient Architecture Designed with low-power process characteristics and power-saving modes for minimized standby consumption at the family level.
Why Choose LCMXO2-4000HE-5FTG256I?
The LCMXO2-4000HE-5FTG256I delivers a balanced combination of mid-density logic, high I/O count and non-volatile configuration features suited to industrial and embedded system applications. Its MachXO2 family capabilities—flexible I/O, on-chip memory and in-field reconfiguration—help simplify board design, reduce BOM and enable reliable instant-on operation.
This device is appropriate for designers who need scalable, reconfigurable logic with significant I/O resources and industrial temperature support, backed by the MachXO2 family feature set for system-level integration and long-term design portability.
Request a quote or submit a purchase inquiry for the LCMXO2-4000HE-5FTG256I to receive pricing and availability information tailored to your project needs.

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