LCMXO2-4000HE-5FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LBGA

Quantity 851 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-5FTG256I – MachXO2 FPGA, 256-LBGA, Industrial

The LCMXO2-4000HE-5FTG256I is a MachXO2 family field programmable gate array (FPGA) IC from Lattice Semiconductor, designed for mid-density programmable logic and high I/O count applications. It combines 4,320 logic elements with 206 I/Os and on-chip memory to support glue logic, control functions, and system integration in industrial designs requiring non-volatile, instant-on programmability.

Key Features

  • Core Logic  4,320 logic elements for mid-density programmable logic and system control functions.
  • I/O Density & Flexibility  206 I/Os to support extensive board-level interfacing; programmable sysIO buffer options and on-chip differential termination are available in the MachXO2 family.
  • Embedded Memory  Total on-chip RAM: 94,208 bits (reported). The MachXO2 family also provides embedded and distributed memory architectures for FIFO and buffering needs.
  • Non-Volatile Configuration  Part of the MachXO2 family that supports on-chip user flash memory and instant-on, single-chip non-volatile operation with background programming options.
  • Low-Power Architecture  Built on an advanced low-power process with family-level power-saving modes and standby options to minimize idle power.
  • High-Performance I/O Standards  Family supports a wide range of I/O standards (LVCMOS, LVDS, Bus-LVDS, RSDS, LVPECL, SSTL, HSTL and others) and features such as programmable low-swing differential I/Os and DDR registers in I/O cells.
  • Clocking & PLLs  Flexible on-chip clocking resources in the MachXO2 family including multiple primary clocks and up to two analog PLLs for fractional-n frequency synthesis.
  • Reconfiguration & System Support  Supports in-field reconfiguration (TransFR) and hardened system functions such as SPI, I²C and timers; IEEE 1149.1 boundary scan and IEEE 1532 in-system programming support are included at the family level.
  • Package & Environmental  256-ball LBGA package (supplier package: 256-FTBGA, 17×17 mm), surface-mount; industrial grade with operating temperature range −40 °C to 100 °C and RoHS compliance.
  • Power Supply  Core supply range specified at 1.14 V to 1.26 V.

Typical Applications

  • Industrial Control  Use the device’s industrial temperature rating and 206 I/Os for sensor interfacing, system glue logic, and control signal aggregation in automation equipment.
  • Embedded System Glue Logic  Mid-density logic and on-chip non-volatile configuration make it suitable for consolidating glue logic, boot management and configuration tasks on a single device.
  • Interface Bridging & I/O Expansion  High I/O count and flexible I/O standards support protocol translation, level shifting and expansion of board-level connectivity.
  • Display & Memory Interfaces  Family-level support for source-synchronous I/O and DDR gearing helps implement display interfaces and memory controller glue logic where needed.

Unique Advantages

  • High I/O Count with Mid-Density Logic  Combines 4,320 logic elements with 206 I/Os to reduce the number of discrete components for complex board-level interfacing.
  • Non-Volatile, Instant-On Operation  Part of a family offering on-chip user flash and instant-on capability, simplifying system boot and secure single-chip solutions.
  • Flexible I/O and Clocking  Programmable I/O standards and multiple clock/PLL resources reduce external component needs for timing and signal conditioning.
  • Robust Industrial Specification  Surface-mount 256-ball FTBGA package, industrial temperature range (−40 °C to 100 °C) and RoHS compliance for reliable deployment in industrial environments.
  • Power-Efficient Architecture  Designed with low-power process characteristics and power-saving modes for minimized standby consumption at the family level.

Why Choose LCMXO2-4000HE-5FTG256I?

The LCMXO2-4000HE-5FTG256I delivers a balanced combination of mid-density logic, high I/O count and non-volatile configuration features suited to industrial and embedded system applications. Its MachXO2 family capabilities—flexible I/O, on-chip memory and in-field reconfiguration—help simplify board design, reduce BOM and enable reliable instant-on operation.

This device is appropriate for designers who need scalable, reconfigurable logic with significant I/O resources and industrial temperature support, backed by the MachXO2 family feature set for system-level integration and long-term design portability.

Request a quote or submit a purchase inquiry for the LCMXO2-4000HE-5FTG256I to receive pricing and availability information tailored to your project needs.

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