LCMXO2-4000HE-5FG484C

The LCMXO2-4000HE-5FG484C is a MachXO2 family FPGA in a 484-ball BGA package designed for commercial embedded and system-control applications. It provides a flexible logic fabric with 4320 logic elements, approximately 94 kbits of on-chip RAM (94,208 bits) and 278 I/O pins, targeting glue logic, interface bridging and control tasks where integration and low-power operation are important.

Built on the MachXO2 architecture, this device combines reconfigurable logic, embedded memory and programmable I/O with on-chip configuration/storage features and low standby power to simplify system design and reduce bill of materials.

Key Features

• Logic Capacity — 4320 logic elements suitable for mid-density glue-logic, control and interface functions.
• Embedded Memory — Approximately 94 kbits of on-chip RAM (94,208 bits) for FIFO, buffering and small data store requirements.
• I/O Density and Flexibility — 278 I/O pins with a programmable sysIO buffer that supports multiple signaling standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL and differential I/O families identified in the device family documentation.
• Low Power Operation — Family-level low-power architecture with standby modes cited in the datasheet; device supply operates from 1.14 V to 1.26 V for core voltage compatibility with low-voltage systems.
• Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and up to two analog PLLs per device for fractional-n frequency synthesis and system clock generation.
• On‑Chip Configuration and Flash — MachXO2 family supports on-chip user flash and single-chip instant-on capability with programming via JTAG, SPI or I2C and background programming options as described in the family datasheet.
• System-Level Features — Hardened peripherals and functions at the family level include SPI, I2C, timer/counter and IEEE 1149.1 boundary scan for system integration and debug.
• Package and Mounting — 484-ball fine-pitch BGA (23 mm × 23 mm) in a surface-mount package, commercial grade with operating temperature range 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Interface Bridging — Use as a protocol bridge or glue logic between different I/O standards and subsystems, leveraging the device’s high I/O count and programmable sysIO buffers.
• System Control and Configuration — Implement control/state machines, SPI/I2C peripherals and configuration managers using on-chip user flash and reconfiguration features.
• Display and Memory I/O Support — Support for source-synchronous and DDR-style I/O modes at the family level makes the device suitable for display gearing and memory interface logic as described in the datasheet.
• Address/Timing Glue in Embedded Systems — Mid-density logic and embedded RAM are appropriate for address decoding, timing control and small buffering tasks in complex boards.

Unique Advantages

• Balanced Integration: Combines 4320 logic elements, significant on-chip RAM and 278 I/Os to reduce external glue logic and lower BOM count.
• Programmable I/O Versatility: sysIO buffer options and differential signaling support simplify interface design across voltage domains and signaling families.
• On-Device Non-Volatile Options: Family-level user flash and instant-on configuration enable single-chip, secure configuration and field updates without external configuration flash.
• Power-Aware Design: Low-voltage core operation (1.14 V–1.26 V) and documented standby power modes support energy-conscious embedded designs.
• Robust System Support: Built-in SPI, I2C, timers and boundary-scan support system integration, control and testability without external controllers.

Why Choose LCMXO2-4000HE-5FG484C?

The LCMXO2-4000HE-5FG484C positions itself as a mid-density, low-power reconfigurable logic device that bridges the gap between small CPLDs and larger FPGAs. With 4320 logic elements, ample on-chip RAM and 278 flexible I/Os in a compact 484-BBGA package, it is well suited for designers who need integrated interface logic, configuration flexibility and system-level peripherals in commercial embedded applications.

Choosing this MachXO2 device provides a balance of performance, integration and configurability documented for the family—helpful for scalable designs where in-field reconfiguration, instant-on capability and a rich set of on-chip system features matter for long-term product support and maintainability.

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