LCMXO2-4000HE-5BG332C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA |
|---|---|
| Quantity | 850 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 332-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 332-FBGA | Number of I/O | 274 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-5BG332C – MachXO2 FPGA, 4,320 logic elements, 274 I/Os, 332-ball BGA
The LCMXO2-4000HE-5BG332C is a MachXO2 family Field Programmable Gate Array (FPGA) delivering 4,320 logic elements and a high-density 274 I/O count in a 332-ball BGA package. It targets I/O-intensive system designs that require flexible interface support, embedded memory, and low-power operation.
Built on the MachXO2 architecture, this device provides configurable I/O, embedded RAM, on-chip non-volatile memory options, and system-level peripherals that simplify interface bridging, display and memory-interface tasks, and general-purpose glue logic for commercial applications.
Key Features
- Logic Capacity Approximately 4,320 logic elements for implementing medium-density combinational and sequential logic functions.
- Embedded Memory Approximately 94,208 bits of on-chip RAM to support FIFOs, small buffers and local data storage.
- High I/O Count 274 I/Os in a 332-ball package to accommodate wide parallel interfaces and multiple serial/parallel peripherals.
- Flexible I/O Standards Programmable sysIO buffer options described for the family support a wide range of interfaces (LVCMOS, LVTTL, differential and industry signaling modes) and include on‑chip differential termination and programmable pull modes.
- Clocking and PLLs Family-level support for multiple primary clocks and up to two analog PLLs with fractional-n synthesis for flexible clock management across interfaces.
- Non-volatile and Reconfigurable On-chip user flash and TransFR™ reconfiguration enable instant-on behavior, single-chip secure configuration, and in-field logic updates while systems operate.
- Low Power Architecture MachXO2 family devices use an advanced 65 nm low-power process and include standby and power-saving options (family-level standby power down to micro-watt range).
- Package and Mounting Available in a 332-ball caBGA (17 × 17 mm) / 332-FBGA style package for surface-mount PCB assembly and compact system footprints.
- Commercial Temperature and Supply Rated for commercial operation from 0 °C to 85 °C with a core supply range of 1.14 V to 1.26 V; RoHS compliant.
Typical Applications
- Display and Video Interfaces Pre-engineered display gearing and DDR support enable implementation of display drivers and source-synchronous video interfaces.
- Memory Interface Bridging Dedicated DDR/DDR2/LPDDR memory support and DQS-capable I/O allow use as memory interface logic or protocol adapters.
- High-Density I/O Systems Wide I/O availability suits boards requiring many parallel signals, multiplexing, or protocol multiplexing between subsystems.
- System Glue Logic and Peripheral Control On-chip timers, SPI and I²C support simplify integration of control, configuration, and monitoring functions.
Unique Advantages
- High I/O Integration: With 274 I/Os in a compact 332-ball package, designers can reduce external interface components and PCB complexity.
- Balanced Logic and Memory: 4,320 logic elements combined with approximately 94 kbits of embedded RAM support mixed-control and buffering tasks without external SRAM.
- Field Reconfiguration: On-chip non-volatile memory and TransFR™ reconfiguration enable secure instant-on and in-field logic updates, improving maintenance flexibility.
- Flexible Clocking: Multiple primary clocks and analog PLLs with fractional-n synthesis provide the timing flexibility needed for diverse interface speeds.
- Low-Power Design Options: 65 nm low-power process and family-level standby modes help minimize power consumption in always-on and idle states.
- Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and provided in industry-standard BGA packaging for broad commercial applications.
Why Choose LCMXO2-4000HE-5BG332C?
The LCMXO2-4000HE-5BG332C positions itself as a versatile mid-density MachXO2 FPGA for commercial designs that demand high I/O counts, flexible interface support, and on-chip memory with non-volatile configuration. Its blend of logic capacity, embedded RAM, reconfiguration capabilities, and low-power family features makes it a practical choice for system designers implementing display, memory-interface, or system glue logic.
For teams focused on reducing BOM complexity and accelerating time-to-market, this device offers a compact package, extensive I/O options, and programmable system functions that simplify board-level design while supporting in-field updates and secure single-chip configuration.
If you need pricing, availability, or a formal quote for LCMXO2-4000HE-5BG332C, submit a request or inquiry and our team will respond with the information you need.

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