LCMXO2-4000HE-5BG332C

IC FPGA 274 I/O 332CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 274 94208 4320 332-FBGA

Quantity 850 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package332-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case332-FBGANumber of I/O274Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-5BG332C – MachXO2 FPGA, 4,320 logic elements, 274 I/Os, 332-ball BGA

The LCMXO2-4000HE-5BG332C is a MachXO2 family Field Programmable Gate Array (FPGA) delivering 4,320 logic elements and a high-density 274 I/O count in a 332-ball BGA package. It targets I/O-intensive system designs that require flexible interface support, embedded memory, and low-power operation.

Built on the MachXO2 architecture, this device provides configurable I/O, embedded RAM, on-chip non-volatile memory options, and system-level peripherals that simplify interface bridging, display and memory-interface tasks, and general-purpose glue logic for commercial applications.

Key Features

  • Logic Capacity  Approximately 4,320 logic elements for implementing medium-density combinational and sequential logic functions.
  • Embedded Memory  Approximately 94,208 bits of on-chip RAM to support FIFOs, small buffers and local data storage.
  • High I/O Count  274 I/Os in a 332-ball package to accommodate wide parallel interfaces and multiple serial/parallel peripherals.
  • Flexible I/O Standards  Programmable sysIO buffer options described for the family support a wide range of interfaces (LVCMOS, LVTTL, differential and industry signaling modes) and include on‑chip differential termination and programmable pull modes.
  • Clocking and PLLs  Family-level support for multiple primary clocks and up to two analog PLLs with fractional-n synthesis for flexible clock management across interfaces.
  • Non-volatile and Reconfigurable  On-chip user flash and TransFR™ reconfiguration enable instant-on behavior, single-chip secure configuration, and in-field logic updates while systems operate.
  • Low Power Architecture  MachXO2 family devices use an advanced 65 nm low-power process and include standby and power-saving options (family-level standby power down to micro-watt range).
  • Package and Mounting  Available in a 332-ball caBGA (17 × 17 mm) / 332-FBGA style package for surface-mount PCB assembly and compact system footprints.
  • Commercial Temperature and Supply  Rated for commercial operation from 0 °C to 85 °C with a core supply range of 1.14 V to 1.26 V; RoHS compliant.

Typical Applications

  • Display and Video Interfaces  Pre-engineered display gearing and DDR support enable implementation of display drivers and source-synchronous video interfaces.
  • Memory Interface Bridging  Dedicated DDR/DDR2/LPDDR memory support and DQS-capable I/O allow use as memory interface logic or protocol adapters.
  • High-Density I/O Systems  Wide I/O availability suits boards requiring many parallel signals, multiplexing, or protocol multiplexing between subsystems.
  • System Glue Logic and Peripheral Control  On-chip timers, SPI and I²C support simplify integration of control, configuration, and monitoring functions.

Unique Advantages

  • High I/O Integration:  With 274 I/Os in a compact 332-ball package, designers can reduce external interface components and PCB complexity.
  • Balanced Logic and Memory:  4,320 logic elements combined with approximately 94 kbits of embedded RAM support mixed-control and buffering tasks without external SRAM.
  • Field Reconfiguration:  On-chip non-volatile memory and TransFR™ reconfiguration enable secure instant-on and in-field logic updates, improving maintenance flexibility.
  • Flexible Clocking:  Multiple primary clocks and analog PLLs with fractional-n synthesis provide the timing flexibility needed for diverse interface speeds.
  • Low-Power Design Options:  65 nm low-power process and family-level standby modes help minimize power consumption in always-on and idle states.
  • Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and provided in industry-standard BGA packaging for broad commercial applications.

Why Choose LCMXO2-4000HE-5BG332C?

The LCMXO2-4000HE-5BG332C positions itself as a versatile mid-density MachXO2 FPGA for commercial designs that demand high I/O counts, flexible interface support, and on-chip memory with non-volatile configuration. Its blend of logic capacity, embedded RAM, reconfiguration capabilities, and low-power family features makes it a practical choice for system designers implementing display, memory-interface, or system glue logic.

For teams focused on reducing BOM complexity and accelerating time-to-market, this device offers a compact package, extensive I/O options, and programmable system functions that simplify board-level design while supporting in-field updates and secure single-chip configuration.

If you need pricing, availability, or a formal quote for LCMXO2-4000HE-5BG332C, submit a request or inquiry and our team will respond with the information you need.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up