LCMXO2-4000HE-5BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA |
|---|---|
| Quantity | 594 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-5BG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA
The LCMXO2-4000HE-5BG256C is a MachXO2 family FPGA offering a flexible, non-volatile logic fabric for control, glue-logic and interface tasks. It provides 4,320 logic elements, approximately 94 kbits of on-chip RAM and 206 user I/Os in a 256-ball LFBGA package, delivering integration for compact embedded systems and subsystem control.
Designed for commercial applications, this device combines a dense logic count, extensive I/O and on-chip non-volatile features to simplify board-level design and reduce external component count.
Key Features
- Core Logic 4,320 logic elements suitable for glue logic, control state machines and medium-density programmable functions.
- On-Chip Memory Approximately 94 kbits of total on-chip RAM for distributed and block memory needs.
- I/O Capacity & Flexibility 206 user I/Os in a 256-ball package to support multiple peripherals and parallel interfaces.
- Non-volatile Configuration MachXO2 family features on-chip user Flash memory and in-field reconfiguration capabilities for secure, single-chip instant-on operation.
- Power and Supply Core supply range specified at 1.14 V to 1.26 V for the device core.
- Package 256-LFBGA package; supplier package listed as 256-CABGA (14×14) for compact board footprint and high I/O density.
- Operating Conditions Commercial temperature range of 0 °C to 85 °C and RoHS-compliant construction.
- Family-Level System Features MachXO2 family capabilities include embedded block RAM, distributed RAM, programmable I/O standards, on-chip peripherals (SPI, I2C, timers) and system-level reconfiguration — enabling rapid integration and reduced BOM.
Typical Applications
- Interface Bridging Implement protocol translation and peripheral bridging between processors, sensors and external devices using abundant I/Os and on-chip logic.
- System Glue Logic Replace discrete glue components and CPLDs with a single programmable device to simplify board design and reduce component count.
- Display and Source-Synchronous I/O Use the device’s high I/O count and MachXO2 family I/O features for display controllers and parallel data interfaces.
- Embedded Control and Sequencing Implement control state machines, reset sequencing and peripheral management with available logic and on-chip non-volatile configuration.
Unique Advantages
- High I/O Density: 206 I/Os in a 256-ball package provide board-level flexibility for multi-peripheral designs.
- Integrated Non-Volatile Configuration: On-chip Flash and family reconfiguration features remove the need for external configuration PROMs and enable instant-on behavior.
- Compact, High-Density Packaging: 256-LFBGA (supplier 256-CABGA 14×14) balances I/O count with a small footprint for space-constrained applications.
- Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial embedded deployments.
- Verified Ecosystem: MachXO2 family system features (peripherals, memory blocks and flexible I/O standards) accelerate integration and reduce development time.
Why Choose LCMXO2-4000HE-5BG256C?
This MachXO2 device is positioned as a compact, non-volatile FPGA for designers who need medium-density logic, substantial I/O and on-chip memory without external configuration components. With 4,320 logic elements, roughly 94 kbits of RAM and 206 I/Os in a 256-ball package, it fits applications requiring board-level integration and flexible interfacing.
For product teams focused on reducing BOM, shortening development cycles and deploying a reconfigurable single-chip solution in commercial-temperature environments, the LCMXO2-4000HE-5BG256C offers a balanced combination of logic, memory and I/O in a RoHS-compliant package.
Request a quote or submit an RFQ to obtain pricing and availability for the LCMXO2-4000HE-5BG256C.