LCMXO2-4000HE-5BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

Quantity 594 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-5BG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 94208 4320 256-LFBGA

The LCMXO2-4000HE-5BG256C is a MachXO2 family FPGA offering a flexible, non-volatile logic fabric for control, glue-logic and interface tasks. It provides 4,320 logic elements, approximately 94 kbits of on-chip RAM and 206 user I/Os in a 256-ball LFBGA package, delivering integration for compact embedded systems and subsystem control.

Designed for commercial applications, this device combines a dense logic count, extensive I/O and on-chip non-volatile features to simplify board-level design and reduce external component count.

Key Features

  • Core Logic  4,320 logic elements suitable for glue logic, control state machines and medium-density programmable functions.
  • On-Chip Memory  Approximately 94 kbits of total on-chip RAM for distributed and block memory needs.
  • I/O Capacity & Flexibility  206 user I/Os in a 256-ball package to support multiple peripherals and parallel interfaces.
  • Non-volatile Configuration  MachXO2 family features on-chip user Flash memory and in-field reconfiguration capabilities for secure, single-chip instant-on operation.
  • Power and Supply  Core supply range specified at 1.14 V to 1.26 V for the device core.
  • Package  256-LFBGA package; supplier package listed as 256-CABGA (14×14) for compact board footprint and high I/O density.
  • Operating Conditions  Commercial temperature range of 0 °C to 85 °C and RoHS-compliant construction.
  • Family-Level System Features  MachXO2 family capabilities include embedded block RAM, distributed RAM, programmable I/O standards, on-chip peripherals (SPI, I2C, timers) and system-level reconfiguration — enabling rapid integration and reduced BOM.

Typical Applications

  • Interface Bridging  Implement protocol translation and peripheral bridging between processors, sensors and external devices using abundant I/Os and on-chip logic.
  • System Glue Logic  Replace discrete glue components and CPLDs with a single programmable device to simplify board design and reduce component count.
  • Display and Source-Synchronous I/O  Use the device’s high I/O count and MachXO2 family I/O features for display controllers and parallel data interfaces.
  • Embedded Control and Sequencing  Implement control state machines, reset sequencing and peripheral management with available logic and on-chip non-volatile configuration.

Unique Advantages

  • High I/O Density: 206 I/Os in a 256-ball package provide board-level flexibility for multi-peripheral designs.
  • Integrated Non-Volatile Configuration: On-chip Flash and family reconfiguration features remove the need for external configuration PROMs and enable instant-on behavior.
  • Compact, High-Density Packaging: 256-LFBGA (supplier 256-CABGA 14×14) balances I/O count with a small footprint for space-constrained applications.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C to match typical commercial embedded deployments.
  • Verified Ecosystem: MachXO2 family system features (peripherals, memory blocks and flexible I/O standards) accelerate integration and reduce development time.

Why Choose LCMXO2-4000HE-5BG256C?

This MachXO2 device is positioned as a compact, non-volatile FPGA for designers who need medium-density logic, substantial I/O and on-chip memory without external configuration components. With 4,320 logic elements, roughly 94 kbits of RAM and 206 I/Os in a 256-ball package, it fits applications requiring board-level integration and flexible interfacing.

For product teams focused on reducing BOM, shortening development cycles and deploying a reconfigurable single-chip solution in commercial-temperature environments, the LCMXO2-4000HE-5BG256C offers a balanced combination of logic, memory and I/O in a RoHS-compliant package.

Request a quote or submit an RFQ to obtain pricing and availability for the LCMXO2-4000HE-5BG256C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up