LCMXO2-4000HE-4MG184C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 150 94208 4320 184-LFBGA, CSPBGA |
|---|---|
| Quantity | 627 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 184-CSBGA (8x8) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 184-LFBGA, CSPBGA | Number of I/O | 150 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 540 | Number of Logic Elements/Cells | 4320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LCMXO2-4000HE-4MG184C – MachXO2 Field Programmable Gate Array (FPGA) IC 150 94208 4320 184-LFBGA, CSPBGA
The LCMXO2-4000HE-4MG184C is a MachXO2 family FPGA device delivering 4,320 logic elements and 150 I/Os in a compact 184-ball csBGA package. It combines flexible programmable fabric, embedded memory, and on-chip system features to serve glue-logic, interface and control functions in commercial electronic designs.
Designed for low-power operation with advanced process technology and fast, non‑volatile configuration options, the device targets applications that require integration of control, I/O bridging and in-field reconfiguration while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C commercial temperature range.
Key Features
- Logic Capacity — 4,320 logic elements (LUT4s) to implement glue logic, state machines and custom peripherals.
- Memory — 94,208 total RAM bits (approximately 92 kbits of embedded SRAM) with additional distributed RAM resources for flexible data storage and buffering.
- User Flash (UFM) — On-chip user flash memory available on-device (up to 96 kbits for the XO2-4000 device family); supports in-field updates and non-volatile configuration.
- I/O and Interface Support — 150 I/Os with programmable sysIO buffer options and pre‑engineered source-synchronous I/O including DDR registers and gearing for high-speed interfaces.
- Clocking and PLLs — Multiple primary clocks and up to two analog PLLs for fractional‑N frequency synthesis and flexible clock domain management.
- Low Power Operation — Designed on an advanced 65 nm low-power process with standby modes and family-reported standby power down to micro-watt levels.
- Non-Volatile, Reconfigurable — Instant-on single-chip solution with support for background programming, JTAG/SPI/I²C configuration and in-field TransFR reconfiguration.
- Package and Mounting — 184-LFBGA (csBGA) surface-mount package; supplier device package listed as 184-CSBGA (8×8).
- Commercial Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
Typical Applications
- Interface Bridging and Glue Logic — Use the device to consolidate glue logic between subsystems, implement protocol translators and manage complex I/O routing with its 150 I/Os.
- Memory Interface and Timing Control — Pre‑engineered source-synchronous I/O and DDR register support make it suitable for timing-critical buffering and gear‑down between devices.
- System Control and Peripheral Offload — Implement hardware accelerators, timers/counters, or peripheral control to offload processing from host microcontrollers.
- Field Upgradeable Logic — On-chip user flash and TransFR reconfiguration enable in-field updates and iterative feature deployment without board removal.
Unique Advantages
- Highly integrated I/O and logic: 4,320 logic elements combined with 150 I/Os reduce external glue components and simplify board-level design.
- Flexible memory options: Approximately 92 kbits of embedded SRAM plus distributed RAM support varied buffering and storage needs on-chip.
- Non‑volatile instant-on capability: On-chip flash memory and single-chip configuration enable rapid startup and secure, persistent configuration.
- Low-power design: Advanced 65 nm low-power process and standby modes help minimize system idle power.
- Robust clocking: Multiple primary clocks and two PLLs provide flexible clock generation and domain isolation for mixed-rate designs.
- Compact, surface-mount packaging: 184-ball csBGA (8×8) package offers a small footprint for space-constrained applications while supporting high I/O count.
Why Choose LCMXO2-4000HE-4MG184C?
This MachXO2 device is positioned for engineers who need a compact, low-power programmable element that consolidates I/O, control logic and configuration storage into a single component. With 4,320 logic elements, substantial on-chip memory, flexible I/O capabilities and non‑volatile flash, it simplifies system-level integration while enabling field updates and secure startup.
LCMXO2-4000HE-4MG184C is well suited to commercial applications requiring reliable, reconfigurable logic in a small csBGA package, and provides a clear upgrade path within the MachXO2 family for designs that may scale in capacity or features.
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