LCMXO2-4000HE-4MG184C

IC FPGA 150 I/O 184CSBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 150 94208 4320 184-LFBGA, CSPBGA

Quantity 627 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package184-CSBGA (8x8)GradeCommercialOperating Temperature0°C – 85°C
Package / Case184-LFBGA, CSPBGANumber of I/O150Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs540Number of Logic Elements/Cells4320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LCMXO2-4000HE-4MG184C – MachXO2 Field Programmable Gate Array (FPGA) IC 150 94208 4320 184-LFBGA, CSPBGA

The LCMXO2-4000HE-4MG184C is a MachXO2 family FPGA device delivering 4,320 logic elements and 150 I/Os in a compact 184-ball csBGA package. It combines flexible programmable fabric, embedded memory, and on-chip system features to serve glue-logic, interface and control functions in commercial electronic designs.

Designed for low-power operation with advanced process technology and fast, non‑volatile configuration options, the device targets applications that require integration of control, I/O bridging and in-field reconfiguration while operating from a 1.14 V to 1.26 V supply and a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity — 4,320 logic elements (LUT4s) to implement glue logic, state machines and custom peripherals.
  • Memory — 94,208 total RAM bits (approximately 92 kbits of embedded SRAM) with additional distributed RAM resources for flexible data storage and buffering.
  • User Flash (UFM) — On-chip user flash memory available on-device (up to 96 kbits for the XO2-4000 device family); supports in-field updates and non-volatile configuration.
  • I/O and Interface Support — 150 I/Os with programmable sysIO buffer options and pre‑engineered source-synchronous I/O including DDR registers and gearing for high-speed interfaces.
  • Clocking and PLLs — Multiple primary clocks and up to two analog PLLs for fractional‑N frequency synthesis and flexible clock domain management.
  • Low Power Operation — Designed on an advanced 65 nm low-power process with standby modes and family-reported standby power down to micro-watt levels.
  • Non-Volatile, Reconfigurable — Instant-on single-chip solution with support for background programming, JTAG/SPI/I²C configuration and in-field TransFR reconfiguration.
  • Package and Mounting — 184-LFBGA (csBGA) surface-mount package; supplier device package listed as 184-CSBGA (8×8).
  • Commercial Grade — Rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

  • Interface Bridging and Glue Logic — Use the device to consolidate glue logic between subsystems, implement protocol translators and manage complex I/O routing with its 150 I/Os.
  • Memory Interface and Timing Control — Pre‑engineered source-synchronous I/O and DDR register support make it suitable for timing-critical buffering and gear‑down between devices.
  • System Control and Peripheral Offload — Implement hardware accelerators, timers/counters, or peripheral control to offload processing from host microcontrollers.
  • Field Upgradeable Logic — On-chip user flash and TransFR reconfiguration enable in-field updates and iterative feature deployment without board removal.

Unique Advantages

  • Highly integrated I/O and logic: 4,320 logic elements combined with 150 I/Os reduce external glue components and simplify board-level design.
  • Flexible memory options: Approximately 92 kbits of embedded SRAM plus distributed RAM support varied buffering and storage needs on-chip.
  • Non‑volatile instant-on capability: On-chip flash memory and single-chip configuration enable rapid startup and secure, persistent configuration.
  • Low-power design: Advanced 65 nm low-power process and standby modes help minimize system idle power.
  • Robust clocking: Multiple primary clocks and two PLLs provide flexible clock generation and domain isolation for mixed-rate designs.
  • Compact, surface-mount packaging: 184-ball csBGA (8×8) package offers a small footprint for space-constrained applications while supporting high I/O count.

Why Choose LCMXO2-4000HE-4MG184C?

This MachXO2 device is positioned for engineers who need a compact, low-power programmable element that consolidates I/O, control logic and configuration storage into a single component. With 4,320 logic elements, substantial on-chip memory, flexible I/O capabilities and non‑volatile flash, it simplifies system-level integration while enabling field updates and secure startup.

LCMXO2-4000HE-4MG184C is well suited to commercial applications requiring reliable, reconfigurable logic in a small csBGA package, and provides a clear upgrade path within the MachXO2 family for designs that may scale in capacity or features.

Request a quote or submit a sales inquiry to evaluate LCMXO2-4000HE-4MG184C for your next design. Provide part number, required quantity and any specific packaging or support needs to start the process.

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