LCMXO2-4000HE-4FTG256C

The LCMXO2-4000HE-4FTG256C is a commercial-grade MachXO2 family Field Programmable Gate Array (FPGA) IC. It provides 4,320 logic elements, 94,208 bits of on-chip RAM and 206 I/O pins in a 256-ball LBGA package, making it suitable for a wide range of embedded control and system-integration roles where moderate logic density, flexible I/O and low-power operation are required.

Built for fast configuration and system-level integration, the device operates from a 1.14 V to 1.26 V supply and supports a 0 °C to 85 °C operating temperature window. It is RoHS compliant and supplied in a 256-FTBGA (17×17 mm) package for surface-mount assembly.

Key Features

• Logic Capacity – 4,320 logic elements provide the programmable fabric for glue logic, control functions and custom interfaces.
• Embedded Memory – 94,208 total RAM bits of on-chip memory for FIFO, buffering and small data structures without external SRAM.
• High I/O Count – 206 I/Os support broad connectivity for peripherals, sensors, memory interfaces and board-level glue logic.
• Power and Voltage – Single supply operation from 1.14 V to 1.26 V to match common FPGA supply domains and enable predictable power budgeting.
• Packaging and Mounting – Surface-mount 256-ball ftBGA package (256-LBGA, supplier package 256‑FTBGA, 17×17 mm) for compact board designs.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation to meet standard commercial electronics requirements.
• Standards and Compliance – RoHS compliant for environmental and regulatory conformity in commercial applications.

Typical Applications

• System Glue Logic – Implement custom control, address decoding and protocol bridging using the device’s 4,320 logic elements and rich I/O count.
• Peripheral and Interface Aggregation – Consolidate multiple sensor, serial and parallel interfaces onto a single device using the 206 available I/Os.
• On-Board Memory Buffering – Use the device’s approximately 94 kbits of embedded RAM for FIFO buffering, small packet storage or temporary data staging without external memory.
• Low-Power Control Functions – Apply the MachXO2 family’s low-power capabilities in battery-assisted or always-on commercial systems where power budgets are constrained.

Unique Advantages

• Balanced Integration: 4,320 logic elements paired with substantial on-chip RAM reduce external components and simplify board design.
• High Pin Count in Compact Package: 206 I/Os in a 256-ball ftBGA (17×17 mm) package enable dense connectivity while conserving PCB area.
• Commercial-Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial deployment requirements.
• Predictable Power Envelope: Defined 1.14 V to 1.26 V supply range supports consistent power planning for mixed-supply systems.
• On-Chip Memory for Reduced BOM: Approximately 94 kbits of embedded RAM lowers the need for external memory components for many control and buffering tasks.

Why Choose LCMXO2-4000HE-4FTG256C?

The LCMXO2-4000HE-4FTG256C combines a mid-range logic fabric with substantial embedded memory and a high I/O count in a compact ftBGA package, making it a practical choice for commercial embedded designs that require configurable logic, multiple interfaces and on-chip buffering without adding external components. Its defined supply range and commercial temperature rating allow straightforward integration into standard electronics products.

This device is suited to engineers and teams building systems that prioritize board-level consolidation, predictable power requirements and moderate logic density. Leveraging the MachXO2 family’s integration features helps reduce BOM complexity and accelerate system-level development and deployment.

Request a quote or submit an inquiry to evaluate the LCMXO2-4000HE-4FTG256C for your next design and get pricing and availability details.